Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes
Abstract
We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: a previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.
- Authors:
-
- Carnegie Mellon Univ., Pittsburgh, PA (United States)
- Publication Date:
- Research Org.:
- Carnegie Mellon Univ., Pittsburgh, PA (United States); 24M Technologies, Inc., Cambridge, MA (United States); Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
- Sponsoring Org.:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E); USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office
- OSTI Identifier:
- 1881504
- Alternate Identifier(s):
- OSTI ID: 1374071; OSTI ID: 1536538
- Grant/Contract Number:
- AR0000774; EE0007810
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Physical Review Letters
- Additional Journal Information:
- Journal Volume: 119; Journal Issue: 5; Journal ID: ISSN 0031-9007
- Publisher:
- American Physical Society (APS)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; Electrochemical properties; Interface & surface thermodynamics; Batteries; Solid-solid interfaces
Citation Formats
Ahmad, Zeeshan, and Viswanathan, Venkatasubramanian. Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes. United States: N. p., 2017.
Web. doi:10.1103/physrevlett.119.056003.
Ahmad, Zeeshan, & Viswanathan, Venkatasubramanian. Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes. United States. https://doi.org/10.1103/physrevlett.119.056003
Ahmad, Zeeshan, and Viswanathan, Venkatasubramanian. Fri .
"Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes". United States. https://doi.org/10.1103/physrevlett.119.056003. https://www.osti.gov/servlets/purl/1881504.
@article{osti_1881504,
title = {Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes},
author = {Ahmad, Zeeshan and Viswanathan, Venkatasubramanian},
abstractNote = {We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: a previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.},
doi = {10.1103/physrevlett.119.056003},
journal = {Physical Review Letters},
number = 5,
volume = 119,
place = {United States},
year = {Fri Aug 04 00:00:00 EDT 2017},
month = {Fri Aug 04 00:00:00 EDT 2017}
}
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