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Title: Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces

Abstract

Microscale testing has enjoyed significant developments, with the majority of testing focused on tensile/compression type tests and little focus on shear testing. With the recent advances in macroscale shear testing, we developed a novel shear structure for evaluating shear properties of bulk materials and films at the microscale. The shear response in single-crystal copper oriented along the [111] direction was found to have a yield strength of ~180 MPa. Nanocrystalline copper specimens with different orientations showed sensitivity to the film texture with a shear yield strength nearly three times that of single-crystal copper. Shear specimens were fabricated with Cu film–Si substrate interface near the middle of the shear region and compressed to fracture. Here, the shear response showed a mixed behavior of the stiff Si substrate and softer nanocrystalline film and failed in a brittle manner, indicating a response unique to the interface.

Authors:
ORCiD logo [1]; ORCiD logo [1];  [1]; ORCiD logo [1]; ORCiD logo [1]
  1. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Publication Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE Laboratory Directed Research and Development (LDRD) Program
OSTI Identifier:
1523242
Report Number(s):
LA-UR-19-21222
Journal ID: ISSN 0884-2914
Grant/Contract Number:  
89233218CNA000001
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Materials Research
Additional Journal Information:
Journal Volume: 34; Journal Issue: 9; Journal ID: ISSN 0884-2914
Publisher:
Materials Research Society
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Cu; microstructure; stress/strain relationship

Citation Formats

Gigax, Jonathan Gregory, Baldwin, Jon Kevin Scott, Sheehan, Chris J., Maloy, Stuart Andrew, and Li, Nan. Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces. United States: N. p., 2019. Web. doi:10.1557/jmr.2019.104.
Gigax, Jonathan Gregory, Baldwin, Jon Kevin Scott, Sheehan, Chris J., Maloy, Stuart Andrew, & Li, Nan. Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces. United States. https://doi.org/10.1557/jmr.2019.104
Gigax, Jonathan Gregory, Baldwin, Jon Kevin Scott, Sheehan, Chris J., Maloy, Stuart Andrew, and Li, Nan. Wed . "Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces". United States. https://doi.org/10.1557/jmr.2019.104. https://www.osti.gov/servlets/purl/1523242.
@article{osti_1523242,
title = {Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces},
author = {Gigax, Jonathan Gregory and Baldwin, Jon Kevin Scott and Sheehan, Chris J. and Maloy, Stuart Andrew and Li, Nan},
abstractNote = {Microscale testing has enjoyed significant developments, with the majority of testing focused on tensile/compression type tests and little focus on shear testing. With the recent advances in macroscale shear testing, we developed a novel shear structure for evaluating shear properties of bulk materials and films at the microscale. The shear response in single-crystal copper oriented along the [111] direction was found to have a yield strength of ~180 MPa. Nanocrystalline copper specimens with different orientations showed sensitivity to the film texture with a shear yield strength nearly three times that of single-crystal copper. Shear specimens were fabricated with Cu film–Si substrate interface near the middle of the shear region and compressed to fracture. Here, the shear response showed a mixed behavior of the stiff Si substrate and softer nanocrystalline film and failed in a brittle manner, indicating a response unique to the interface.},
doi = {10.1557/jmr.2019.104},
journal = {Journal of Materials Research},
number = 9,
volume = 34,
place = {United States},
year = {Wed Apr 24 00:00:00 EDT 2019},
month = {Wed Apr 24 00:00:00 EDT 2019}
}

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Cited by: 7 works
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