Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers

Abbott, William M.; Murray, Christopher P.; Zhong, Chuan; Smith, Christopher; McGuinness, Cormac; Rezvani, Ehsan; Downing, Clive; Daly, Dermot; Petford-Long, Amanda K.; Bello, Frank; McCloskey, David; Donegan, John F.

doi:10.1021/acsami.8b21193

Title: Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers

Abstract

The use of a metallic adhesion layer is known to increase the thermo-mechanical stability of Au thin films against solid-state dewetting, but in turn results in damping of the plasmonic response, reducing their utility in applications such as heat-assisted magnetic recording (HAMR). In this work, 50 nm Au films with Ti adhesion layers ranging in thickness from 0 to 5 nm were fabricated, and their thermal stability, electrical resistivity, and plasmonic response were measured. Subnanometer adhesion layers are demonstrated to significantly increase the stability of the thin films against dewetting at elevated temperatures (>200 °C), compared to more commonly used adhesion layer thicknesses that are in the range of 2-5 nm. For adhesion layers thicker than 1 nm, the diffusion of excess Ti through Au grain boundaries and subsequent oxidation was determined to result in degradation of the film. This mechanism was confirmed using transmission electron microscopy and X-ray photoelectron spectroscopy on annealed 0.5 and 5 nm adhesion layer samples. The superiority of subnanometer adhesion layers was further demonstrated through measurements of the surface-plasmon polariton resonance; those with thinner adhesion layers possessed both a stronger and spectrally sharper resonance. Furthermore, these results have relevance beyond HAMR to all Ti/Au systemsmore » operating at elevated temperatures.« less

Authors:

^[1]; Murray, Christopher P. ^[1]; Zhong, Chuan ^[1]; Smith, Christopher ^[1]; McGuinness, Cormac ^[1]; Rezvani, Ehsan ^[1]; Downing, Clive ^[1]; Daly, Dermot ^[1]; Petford-Long, Amanda K. ^[2]; Bello, Frank ^[1]; McCloskey, David ^[1];

^[1]

Trinity College Dublin, Dublin (Ireland)
Argonne National Lab. (ANL), Lemont, IL (United States); Northwestern Univ., Evanston, IL (United States)

Publication Date:: Fri Jan 25 00:00:00 EST 2019

Research Org.:: Argonne National Lab. (ANL), Argonne, IL (United States)

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

OSTI Identifier:: 1500000

Grant/Contract Number:: AC02-06CH11357

Resource Type:: Accepted Manuscript

Journal Name:: ACS Applied Materials and Interfaces

Additional Journal Information:: Journal Volume: 11; Journal Issue: 7; Journal ID: ISSN 1944-8244

Publisher:: American Chemical Society (ACS)

Country of Publication:: United States

Language:: English

Subject:: 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE; adhesion; antidewetting; diffusion; gold thin films; heat-assisted magnetic recording; plasmonics

Citation Formats


                    Abbott, William M., Murray, Christopher P., Zhong, Chuan, Smith, Christopher, McGuinness, Cormac, Rezvani, Ehsan, Downing, Clive, Daly, Dermot, Petford-Long, Amanda K., Bello, Frank, McCloskey, David, and Donegan, John F. Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers.  United States: N. p., 2019. 
Web.  doi:10.1021/acsami.8b21193.

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                    Abbott, William M., Murray, Christopher P., Zhong, Chuan, Smith, Christopher, McGuinness, Cormac, Rezvani, Ehsan, Downing, Clive, Daly, Dermot, Petford-Long, Amanda K., Bello, Frank, McCloskey, David, & Donegan, John F. Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers.  United States.  https://doi.org/10.1021/acsami.8b21193

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                    Abbott, William M., Murray, Christopher P., Zhong, Chuan, Smith, Christopher, McGuinness, Cormac, Rezvani, Ehsan, Downing, Clive, Daly, Dermot, Petford-Long, Amanda K., Bello, Frank, McCloskey, David, and Donegan, John F. Fri .  
"Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers".  United States.  https://doi.org/10.1021/acsami.8b21193.  https://www.osti.gov/servlets/purl/1500000.

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@article{osti_1500000,

  title        = {Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers},

  author       = {Abbott, William M. and Murray, Christopher P. and Zhong, Chuan and Smith, Christopher and McGuinness, Cormac and Rezvani, Ehsan and Downing, Clive and Daly, Dermot and Petford-Long, Amanda K. and Bello, Frank and McCloskey, David and Donegan, John F.},

  abstractNote = {The use of a metallic adhesion layer is known to increase the thermo-mechanical stability of Au thin films against solid-state dewetting, but in turn results in damping of the plasmonic response, reducing their utility in applications such as heat-assisted magnetic recording (HAMR). In this work, 50 nm Au films with Ti adhesion layers ranging in thickness from 0 to 5 nm were fabricated, and their thermal stability, electrical resistivity, and plasmonic response were measured. Subnanometer adhesion layers are demonstrated to significantly increase the stability of the thin films against dewetting at elevated temperatures (>200 °C), compared to more commonly used adhesion layer thicknesses that are in the range of 2-5 nm. For adhesion layers thicker than 1 nm, the diffusion of excess Ti through Au grain boundaries and subsequent oxidation was determined to result in degradation of the film. This mechanism was confirmed using transmission electron microscopy and X-ray photoelectron spectroscopy on annealed 0.5 and 5 nm adhesion layer samples. The superiority of subnanometer adhesion layers was further demonstrated through measurements of the surface-plasmon polariton resonance; those with thinner adhesion layers possessed both a stronger and spectrally sharper resonance. Furthermore, these results have relevance beyond HAMR to all Ti/Au systems operating at elevated temperatures.},

  doi          = {10.1021/acsami.8b21193},

  journal      = {ACS Applied Materials and Interfaces},

  number       = 7,

  volume       = 11,

  place        = {United States},

  year         = {Fri Jan 25 00:00:00 EST 2019},

  month        = {Fri Jan 25 00:00:00 EST 2019}

}

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Works referenced in this record:

Ultra-thin films for plasmonics: a technology overview
journal, January 2015

Malureanu, Radu; Lavrinenko, Andrei
Nanotechnology Reviews, Vol. 4, Issue 3
DOI: 10.1515/ntrev-2015-0021

Gold in hybrid microelectronics: The complementary use of thin and thick film integrated circuits
journal, June 1974

Russell, R. F.
Gold Bulletin, Vol. 7, Issue 2
DOI: 10.1007/bf03215031

Dewetting behavior of electron-beam-deposited Au thin films on various substrates: graphenes, quartz, and SiO2 wafers
journal, December 2014

Lee, Seung-Hwan; Kwak, Eun-Hye; Jeong, Goo-Hwan
Applied Physics A, Vol. 118, Issue 2
DOI: 10.1007/s00339-014-8913-2

Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films
journal, October 2017

Todeschini, Matteo; Bastos da Silva Fanta, Alice; Jensen, Flemming
ACS Applied Materials & Interfaces, Vol. 9, Issue 42
DOI: 10.1021/acsami.7b10136

Titanium diffusion in gold thin films
journal, March 2010

Martinez, William E.; Gregori, Giuliano; Mates, Thomas
Thin Solid Films, Vol. 518, Issue 10
DOI: 10.1016/j.tsf.2009.07.187

Effects of temperature, thickness and atmosphere on mixing in Au-Ti bilayer thin films
journal, September 1993

Masahiro, Kitada; Noboru, Shimizu
Journal of Materials Science, Vol. 28, Issue 18
DOI: 10.1007/bf00361184

Improvement of bonding strength between Au/Ti and SiO2 films by Si layer insertion
journal, May 1999

Nagata, Hirotoshi; Shinriki, Takashi; Shima, Kaori
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 17, Issue 3
DOI: 10.1116/1.581676

Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative
journal, May 2012

Habteyes, Terefe G.; Dhuey, Scott; Wood, Erin
ACS Nano, Vol. 6, Issue 6
DOI: 10.1021/nn301885u

Observing Plasmon Damping Due to Adhesion Layers in Gold Nanostructures Using Electron Energy Loss Spectroscopy
journal, January 2017

Madsen, Steven J.; Esfandyarpour, Majid; Brongersma, Mark L.
ACS Photonics, Vol. 4, Issue 2
DOI: 10.1021/acsphotonics.6b00525

Thermo-plasmonics: using metallic nanostructures as nano-sources of heat: Thermoplasmonics
journal, April 2012

Baffou, Guillaume; Quidant, Romain
Laser & Photonics Reviews, Vol. 7, Issue 2
DOI: 10.1002/lpor.201200003

On the lifetime of plasmonic transducers in heat assisted magnetic recording
journal, August 2012

Budaev, Bair V.; Bogy, David B.
Journal of Applied Physics, Vol. 112, Issue 3
DOI: 10.1063/1.4745050

Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks
journal, December 2016

Debu, Desalegn T.; Ghosh, Pijush K.; French, David
Optical Materials Express, Vol. 7, Issue 1
DOI: 10.1364/ome.7.000073

Characterization of thin titanium oxide adhesion layers on gold: resistivity, morphology, and composition
journal, January 1994

Vogt, K. W.; Kohl, P. A.; Carter, W. B.
Surface Science, Vol. 301, Issue 1-3
DOI: 10.1016/0039-6028(94)91300-5

Annealing of CoFeB/MgO based single and double barrier magnetic tunnel junctions: Tunnel magnetoresistance, bias dependence, and output voltage
journal, February 2009

Feng, G.; van Dijken, Sebastiaan; Feng, J. F.
Journal of Applied Physics, Vol. 105, Issue 3
DOI: 10.1063/1.3068186

Solid-State Dewetting of Thin Films
journal, August 2012

Thompson, Carl V.
Annual Review of Materials Research, Vol. 42, Issue 1
DOI: 10.1146/annurev-matsci-070511-155048

Solid state dewetting of thin plasmonic films under focused cw-laser irradiation
journal, February 2018

Abbott, William M.; Corbett, Simon; Cunningham, Graeme
Acta Materialia, Vol. 145
DOI: 10.1016/j.actamat.2017.12.030

Capillary instabilities in thin, continuous films
journal, February 1992

Jiran, E.; Thompson, C. V.
Thin Solid Films, Vol. 208, Issue 1
DOI: 10.1016/0040-6090(92)90941-4

The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy
journal, May 2015

Niekiel, Florian; Schweizer, Peter; Kraschewski, Simon M.
Acta Materialia, Vol. 90
DOI: 10.1016/j.actamat.2015.01.072

Platinum Hillocks in Pt/Ti Film Stacks Deposited on Thermally Oxidized Si Substrate
journal, October 2001

Kweon, Soon Yong; Choi, Si Kyung; Yeom, Seung Jin
Japanese Journal of Applied Physics, Vol. 40, Issue Part 1, No. 10
DOI: 10.1143/jjap.40.5850

Spectroscopy of ultrathin epitaxial rutile TiO2(110) films grown on W(100)
journal, August 2007

Bennett, R. A.; Mulley, J. S.; Newton, M. A.
The Journal of Chemical Physics, Vol. 127, Issue 8
DOI: 10.1063/1.2756842

Evaluation of Calculated and Measured Electron Inelastic Mean Free Paths Near Solid Surfaces
journal, January 1999

Powell, C. J.; Jablonski, A.
Journal of Physical and Chemical Reference Data, Vol. 28, Issue 1
DOI: 10.1063/1.556035

Plasmonic Films Can Easily Be Better: Rules and Recipes
journal, February 2015

McPeak, Kevin M.; Jayanti, Sriharsha V.; Kress, Stephan J. P.
ACS Photonics, Vol. 2, Issue 3
DOI: 10.1021/ph5004237

Engineering Metal Adhesion Layers That Do Not Deteriorate Plasmon Resonances
journal, March 2013

Siegfried, Thomas; Ekinci, Yasin; Martin, Olivier J. F.
ACS Nano, Vol. 7, Issue 3
DOI: 10.1021/nn4002006

Dewetting of Au and AuPt alloy films: A dewetting zone model
journal, March 2013

Manuela Müller, Claudia; Spolenak, Ralph
Journal of Applied Physics, Vol. 113, Issue 9
DOI: 10.1063/1.4794028

Thin‐film interdiffusion. I. Au‐Pd, Pd‐Au, Ti‐Pd, Ti‐Au, Ti‐Pd‐Au, and Ti‐Au‐Pd
journal, October 1975

Poate, J. M.; Turner, P. A.; DeBonte, W. J.
Journal of Applied Physics, Vol. 46, Issue 10
DOI: 10.1063/1.321411

Grain boundary diffusion in thin films under stress fields
journal, May 2001

Ostrovsky, Anatoly S.; Bokstein, Boris S.
Applied Surface Science, Vol. 175-176
DOI: 10.1016/s0169-4332(01)00164-7

Stress-induced spontaneous dewetting of heteroepitaxial $Y {Ba}_{2} {Cu}_{3} O_{7}$ thin films
journal, February 2006

Coll, M.; Gázquez, J.; Pomar, A.
Physical Review B, Vol. 73, Issue 7
DOI: 10.1103/physrevb.73.075420

Half-width at half-maximum, full-width at half-maximum analysis for resolution of asymmetrically apodized optical systems with slit apertures
journal, November 2014

Kumar Reddy, Andra Naresh; Sagar, Dasari Karuna
Pramana, Vol. 84, Issue 1
DOI: 10.1007/s12043-014-0828-0

Works referencing / citing this record:

Adhesion layer influence on controlling the local temperature in plasmonic gold nanoholes
journal, January 2020

Jiang, Quanbo; Rogez, Benoît; Claude, Jean-Benoît
Nanoscale, Vol. 12, Issue 4
DOI: 10.1039/c9nr08113e

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Title: Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers

Abstract

Citation Formats

Ultra-thin films for plasmonics: a technology overview journal, January 2015

Gold in hybrid microelectronics: The complementary use of thin and thick film integrated circuits journal, June 1974

Dewetting behavior of electron-beam-deposited Au thin films on various substrates: graphenes, quartz, and SiO2 wafers journal, December 2014

Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films journal, October 2017

Titanium diffusion in gold thin films journal, March 2010

Effects of temperature, thickness and atmosphere on mixing in Au-Ti bilayer thin films journal, September 1993

Improvement of bonding strength between Au/Ti and SiO2 films by Si layer insertion journal, May 1999

Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative journal, May 2012

Observing Plasmon Damping Due to Adhesion Layers in Gold Nanostructures Using Electron Energy Loss Spectroscopy journal, January 2017

Thermo-plasmonics: using metallic nanostructures as nano-sources of heat: Thermoplasmonics journal, April 2012

On the lifetime of plasmonic transducers in heat assisted magnetic recording journal, August 2012

Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks journal, December 2016

Characterization of thin titanium oxide adhesion layers on gold: resistivity, morphology, and composition journal, January 1994

Annealing of CoFeB/MgO based single and double barrier magnetic tunnel junctions: Tunnel magnetoresistance, bias dependence, and output voltage journal, February 2009

Solid-State Dewetting of Thin Films journal, August 2012

Solid state dewetting of thin plasmonic films under focused cw-laser irradiation journal, February 2018

Capillary instabilities in thin, continuous films journal, February 1992

The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy journal, May 2015

Platinum Hillocks in Pt/Ti Film Stacks Deposited on Thermally Oxidized Si Substrate journal, October 2001

Spectroscopy of ultrathin epitaxial rutile TiO2(110) films grown on W(100) journal, August 2007

Evaluation of Calculated and Measured Electron Inelastic Mean Free Paths Near Solid Surfaces journal, January 1999

Plasmonic Films Can Easily Be Better: Rules and Recipes journal, February 2015

Engineering Metal Adhesion Layers That Do Not Deteriorate Plasmon Resonances journal, March 2013

Dewetting of Au and AuPt alloy films: A dewetting zone model journal, March 2013

Thin‐film interdiffusion. I. Au‐Pd, Pd‐Au, Ti‐Pd, Ti‐Au, Ti‐Pd‐Au, and Ti‐Au‐Pd journal, October 1975

Grain boundary diffusion in thin films under stress fields journal, May 2001

Stress-induced spontaneous dewetting of heteroepitaxial Y Ba 2 Cu 3 O 7 thin films journal, February 2006

Half-width at half-maximum, full-width at half-maximum analysis for resolution of asymmetrically apodized optical systems with slit apertures journal, November 2014

Adhesion layer influence on controlling the local temperature in plasmonic gold nanoholes journal, January 2020

Ultra-thin films for plasmonics: a technology overview
journal, January 2015

Gold in hybrid microelectronics: The complementary use of thin and thick film integrated circuits
journal, June 1974

Dewetting behavior of electron-beam-deposited Au thin films on various substrates: graphenes, quartz, and SiO2 wafers
journal, December 2014

Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films
journal, October 2017

Titanium diffusion in gold thin films
journal, March 2010

Effects of temperature, thickness and atmosphere on mixing in Au-Ti bilayer thin films
journal, September 1993

Improvement of bonding strength between Au/Ti and SiO2 films by Si layer insertion
journal, May 1999

Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative
journal, May 2012

Observing Plasmon Damping Due to Adhesion Layers in Gold Nanostructures Using Electron Energy Loss Spectroscopy
journal, January 2017

Thermo-plasmonics: using metallic nanostructures as nano-sources of heat: Thermoplasmonics
journal, April 2012

On the lifetime of plasmonic transducers in heat assisted magnetic recording
journal, August 2012

Surface plasmon damping effects due to Ti adhesion layer in individual gold nanodisks
journal, December 2016

Characterization of thin titanium oxide adhesion layers on gold: resistivity, morphology, and composition
journal, January 1994

Annealing of CoFeB/MgO based single and double barrier magnetic tunnel junctions: Tunnel magnetoresistance, bias dependence, and output voltage
journal, February 2009

Solid-State Dewetting of Thin Films
journal, August 2012

Solid state dewetting of thin plasmonic films under focused cw-laser irradiation
journal, February 2018

Capillary instabilities in thin, continuous films
journal, February 1992

The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy
journal, May 2015

Platinum Hillocks in Pt/Ti Film Stacks Deposited on Thermally Oxidized Si Substrate
journal, October 2001

Spectroscopy of ultrathin epitaxial rutile TiO2(110) films grown on W(100)
journal, August 2007

Evaluation of Calculated and Measured Electron Inelastic Mean Free Paths Near Solid Surfaces
journal, January 1999

Plasmonic Films Can Easily Be Better: Rules and Recipes
journal, February 2015

Engineering Metal Adhesion Layers That Do Not Deteriorate Plasmon Resonances
journal, March 2013

Dewetting of Au and AuPt alloy films: A dewetting zone model
journal, March 2013

Thin‐film interdiffusion. I. Au‐Pd, Pd‐Au, Ti‐Pd, Ti‐Au, Ti‐Pd‐Au, and Ti‐Au‐Pd
journal, October 1975

Grain boundary diffusion in thin films under stress fields
journal, May 2001

Stress-induced spontaneous dewetting of heteroepitaxial $Y {Ba}_{2} {Cu}_{3} O_{7}$ thin films
journal, February 2006

Half-width at half-maximum, full-width at half-maximum analysis for resolution of asymmetrically apodized optical systems with slit apertures
journal, November 2014

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journal, January 2020