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Title: Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles

Abstract

Here, silicon carbide (SiC) is a wide band gap semiconductor with a variety of industrial applications. Among its many useful properties is its high thermal conductivity, which makes it advantageous for thermal management applications. In this paper we present ab initio calculations of the in-plane and cross-plane thermal conductivities, κin and κout, of three common hexagonal polytypes of SiC: 2H, 4H and 6H. The phonon Boltzmann transport equation is solved iteratively using as input interatomic force constants determined from density functional theory. Both κin and κout decrease with increasing n in nH SiC because of additional low-lying optic phonon branches. These optic branches are characterized by low phonon group velocities, and they increase the phase space for phonon-phonon scattering of acoustic modes. Also, for all n, κin is found to be larger than κout in the temperature range considered. At electron concentrations present in experimental samples, scattering of phonons by electrons is shown to be negligible except well below room temperature where it can lead to a significant reduction of the lattice thermal conductivity. This work highlights the power of ab initio approaches in giving quantitative, predictive descriptions of thermal transport in materials. It helps explain the qualitative disagreement thatmore » exists among different sets of measured thermal conductivity data and provides information of the relative quality of samples from which measured data was obtained.« less

Authors:
 [1];  [2]; ORCiD logo [3];  [4];  [2];  [1]
  1. Boston College, Chestnut Hill, MA (United States)
  2. LITEN, Grenoble cedex (France)
  3. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  4. TU Wien, Vienna (Austria)
Publication Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1376463
Alternate Identifier(s):
OSTI ID: 1550279
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Accepted Manuscript
Journal Name:
Materials Today Physics
Additional Journal Information:
Journal Volume: 1; Journal Issue: C; Journal ID: ISSN 2542-5293
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Silicon carbide; Thermal conductivity; Phonon-phonon interaction; Electron-phonon interaction; Density functional theory; Boltzmann transport equation

Citation Formats

Protik, Nakib Haider, Katre, Ankita, Lindsay, Lucas R., Carrete, Jesus, Mingo, Natalio, and Broido, David. Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles. United States: N. p., 2017. Web. doi:10.1016/j.mtphys.2017.05.004.
Protik, Nakib Haider, Katre, Ankita, Lindsay, Lucas R., Carrete, Jesus, Mingo, Natalio, & Broido, David. Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles. United States. https://doi.org/10.1016/j.mtphys.2017.05.004
Protik, Nakib Haider, Katre, Ankita, Lindsay, Lucas R., Carrete, Jesus, Mingo, Natalio, and Broido, David. Wed . "Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles". United States. https://doi.org/10.1016/j.mtphys.2017.05.004. https://www.osti.gov/servlets/purl/1376463.
@article{osti_1376463,
title = {Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles},
author = {Protik, Nakib Haider and Katre, Ankita and Lindsay, Lucas R. and Carrete, Jesus and Mingo, Natalio and Broido, David},
abstractNote = {Here, silicon carbide (SiC) is a wide band gap semiconductor with a variety of industrial applications. Among its many useful properties is its high thermal conductivity, which makes it advantageous for thermal management applications. In this paper we present ab initio calculations of the in-plane and cross-plane thermal conductivities, κin and κout, of three common hexagonal polytypes of SiC: 2H, 4H and 6H. The phonon Boltzmann transport equation is solved iteratively using as input interatomic force constants determined from density functional theory. Both κin and κout decrease with increasing n in nH SiC because of additional low-lying optic phonon branches. These optic branches are characterized by low phonon group velocities, and they increase the phase space for phonon-phonon scattering of acoustic modes. Also, for all n, κin is found to be larger than κout in the temperature range considered. At electron concentrations present in experimental samples, scattering of phonons by electrons is shown to be negligible except well below room temperature where it can lead to a significant reduction of the lattice thermal conductivity. This work highlights the power of ab initio approaches in giving quantitative, predictive descriptions of thermal transport in materials. It helps explain the qualitative disagreement that exists among different sets of measured thermal conductivity data and provides information of the relative quality of samples from which measured data was obtained.},
doi = {10.1016/j.mtphys.2017.05.004},
journal = {Materials Today Physics},
number = C,
volume = 1,
place = {United States},
year = {Wed Jun 07 00:00:00 EDT 2017},
month = {Wed Jun 07 00:00:00 EDT 2017}
}

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Works referencing / citing this record:

Thermal conductivity of GaN, GaN 71 , and SiC from 150 K to 850 K
journal, January 2019


Thermal boundary resistance measurement and analysis across SiC/SiO 2 interface
journal, September 2019

  • Deng, Shichen; Xiao, Chengdi; Yuan, Jiale
  • Applied Physics Letters, Vol. 115, Issue 10
  • DOI: 10.1063/1.5111157

Molecular dynamics simulations of silicon carbide nanowires under single-ion irradiation
journal, September 2019

  • He, Wanzhen; Chen, Changqing; Xu, Zhiping
  • Journal of Applied Physics, Vol. 126, Issue 12
  • DOI: 10.1063/1.5121873

Strong effect of electron-phonon interaction on the lattice thermal conductivity in 3C-SiC
journal, August 2017


Modeling ballistic phonon transport from a cylindrical electron beam heat source
journal, September 2019

  • Wehmeyer, Geoff
  • Journal of Applied Physics, Vol. 126, Issue 12
  • DOI: 10.1063/1.5115165

Thermal Boundary Resistance Measurement and Analysis Across SiC/SiO2 Interface
text, January 2019