Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent
Abstract
Physical stress relaxation in rubbery, thermoset polymers is limited by cross-links, which impede segmental motion and restrict relaxation to network defects, such as chain ends. In parallel, the cure shrinkage associated with thermoset polymerizations leads to the development of internal residual stress that cannot be effectively relaxed. Recent strategies have reduced or eliminated such cure stress in thermoset polymers largely by exploiting chemical relaxation processes, wherein temporary cross-links or otherwise transient bonds are incorporated into the polymer network. In this paper, we explore an alternative approach, wherein physical relaxation is enhanced by the incorporation of organometallic sandwich moieties into the backbone of the polymer network. A standard epoxy resin is cured with a diamine derivative of ferrocene and compared to conventional diamine curing agents. The ferrocene-based thermoset is clearly distinguished from the conventional materials by reduced cure stress with increasing cure temperature as well as unique stress relaxation behavior above its glass transition in the fully cured state. The relaxation experiments exhibit features characteristic of a physical relaxation process. Furthermore, the cure stress is observed to vanish precipitously upon deliberate introduction of network defects through an increasing imbalance of epoxy and amine functional groups. Finally, we postulate that these beneficialmore »
- Authors:
-
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE Laboratory Directed Research and Development (LDRD) Program; USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1372307
- Report Number(s):
- SAND2017-7074J
Journal ID: ISSN 0024-9297; 655061
- Grant/Contract Number:
- NA0003525
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Macromolecules
- Additional Journal Information:
- Journal Volume: 50; Journal Issue: 13; Journal ID: ISSN 0024-9297
- Publisher:
- American Chemical Society
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Citation Formats
Jones, Brad H., Wheeler, David R., Black, Hayden T., Stavig, Mark E., Sawyer, Patricia S., Giron, Nicholas H., Celina, Mathias C., Lambert, Timothy N., and Alam, Todd M. Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent. United States: N. p., 2017.
Web. doi:10.1021/acs.macromol.7b00501.
Jones, Brad H., Wheeler, David R., Black, Hayden T., Stavig, Mark E., Sawyer, Patricia S., Giron, Nicholas H., Celina, Mathias C., Lambert, Timothy N., & Alam, Todd M. Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent. United States. https://doi.org/10.1021/acs.macromol.7b00501
Jones, Brad H., Wheeler, David R., Black, Hayden T., Stavig, Mark E., Sawyer, Patricia S., Giron, Nicholas H., Celina, Mathias C., Lambert, Timothy N., and Alam, Todd M. Thu .
"Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent". United States. https://doi.org/10.1021/acs.macromol.7b00501. https://www.osti.gov/servlets/purl/1372307.
@article{osti_1372307,
title = {Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent},
author = {Jones, Brad H. and Wheeler, David R. and Black, Hayden T. and Stavig, Mark E. and Sawyer, Patricia S. and Giron, Nicholas H. and Celina, Mathias C. and Lambert, Timothy N. and Alam, Todd M.},
abstractNote = {Physical stress relaxation in rubbery, thermoset polymers is limited by cross-links, which impede segmental motion and restrict relaxation to network defects, such as chain ends. In parallel, the cure shrinkage associated with thermoset polymerizations leads to the development of internal residual stress that cannot be effectively relaxed. Recent strategies have reduced or eliminated such cure stress in thermoset polymers largely by exploiting chemical relaxation processes, wherein temporary cross-links or otherwise transient bonds are incorporated into the polymer network. In this paper, we explore an alternative approach, wherein physical relaxation is enhanced by the incorporation of organometallic sandwich moieties into the backbone of the polymer network. A standard epoxy resin is cured with a diamine derivative of ferrocene and compared to conventional diamine curing agents. The ferrocene-based thermoset is clearly distinguished from the conventional materials by reduced cure stress with increasing cure temperature as well as unique stress relaxation behavior above its glass transition in the fully cured state. The relaxation experiments exhibit features characteristic of a physical relaxation process. Furthermore, the cure stress is observed to vanish precipitously upon deliberate introduction of network defects through an increasing imbalance of epoxy and amine functional groups. Finally, we postulate that these beneficial properties arise from fluxional motion of the cyclopentadienyl ligands on the polymer backbone.},
doi = {10.1021/acs.macromol.7b00501},
journal = {Macromolecules},
number = 13,
volume = 50,
place = {United States},
year = {Thu Jun 29 00:00:00 EDT 2017},
month = {Thu Jun 29 00:00:00 EDT 2017}
}
Web of Science
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