Anisotropic Thermal Response of Packed Copper Wire

Wereszczak, Andrew A.; Emily Cousineau, J.; Bennion, Kevin; Wang, Hsin; Wiles, Randy H.; Burress, Timothy B.; Wu, Tong

doi:10.1115/1.4035972

Title: Anisotropic Thermal Response of Packed Copper Wire

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Abstract

The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-μm-diameter copper wires that both had an insulation coating thickness of 37 μm. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5–1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model and an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.

Authors:

Wereszczak, Andrew A. ^[1]; Emily Cousineau, J. ^[2]; Bennion, Kevin ^[2]; Wang, Hsin ^[1]; Wiles, Randy H. ^[1]; Burress, Timothy B. ^[1]; Wu, Tong ^[3]

Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Univ. of Tennessee, Knoxville, TN (United States). Department of Electrical Engineering and Computer Science

Publication Date:: Wed Apr 19 00:00:00 EDT 2017

Research Org.:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)

OSTI Identifier:: 1352756

Alternate Identifier(s):: OSTI ID: 1352996

Report Number(s):: NREL/JA-5400-66937
Journal ID: ISSN 1948-5085

Grant/Contract Number:: AC05-00OR22725; AC36-08GO28308

Resource Type:: Accepted Manuscript

Journal Name:: Journal of Thermal Science and Engineering Applications

Additional Journal Information:: Journal Volume: 9; Journal Issue: 4; Journal ID: ISSN 1948-5085

Publisher:: ASME

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 36 MATERIALS SCIENCE; apparent thermal conductivity; transverse isotropy; laser flash; transient plane source; thermal transmittance; representative volume element; thermal conductivity percolation; 30 DIRECT ENERGY CONVERSION; copper; wire; anisotropy; thermal conductivity; packing; shipments; packings; cushioning; transients; dynamics; lasers; coating processes; coatings

Citation Formats


                    Wereszczak, Andrew A., Emily Cousineau, J., Bennion, Kevin, Wang, Hsin, Wiles, Randy H., Burress, Timothy B., and Wu, Tong. Anisotropic Thermal Response of Packed Copper Wire.  United States: N. p., 2017. 
Web.  doi:10.1115/1.4035972.

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                    Wereszczak, Andrew A., Emily Cousineau, J., Bennion, Kevin, Wang, Hsin, Wiles, Randy H., Burress, Timothy B., & Wu, Tong. Anisotropic Thermal Response of Packed Copper Wire.  United States.  https://doi.org/10.1115/1.4035972

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                    Wereszczak, Andrew A., Emily Cousineau, J., Bennion, Kevin, Wang, Hsin, Wiles, Randy H., Burress, Timothy B., and Wu, Tong. Wed .  
"Anisotropic Thermal Response of Packed Copper Wire".  United States.  https://doi.org/10.1115/1.4035972.  https://www.osti.gov/servlets/purl/1352756.

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@article{osti_1352756,

  title        = {Anisotropic Thermal Response of Packed Copper Wire},

  author       = {Wereszczak, Andrew A. and Emily Cousineau, J. and Bennion, Kevin and Wang, Hsin and Wiles, Randy H. and Burress, Timothy B. and Wu, Tong},

  abstractNote = {The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-μm-diameter copper wires that both had an insulation coating thickness of 37 μm. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5–1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model and an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.},

  doi          = {10.1115/1.4035972},

  journal      = {Journal of Thermal Science and Engineering Applications},

  number       = 4,

  volume       = 9,

  place        = {United States},

  year         = {Wed Apr 19 00:00:00 EDT 2017},

  month        = {Wed Apr 19 00:00:00 EDT 2017}

}

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