Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process
Abstract
Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting-and-spreading) to realize the proper joint geometry. Here, the soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance of the molten filler metal to successfully fill the gap and complete the fillet.
- Authors:
-
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1347531
- Report Number(s):
- SAND-2017-1069J
Journal ID: ISSN 0043-2296; 650891
- Grant/Contract Number:
- AC04-94AL85000
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Welding Journal
- Additional Journal Information:
- Journal Volume: 96; Related Information: Research Supplement; Journal ID: ISSN 0043-2296
- Publisher:
- American Welding Society
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Vianco, Paul T. Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process. United States: N. p., 2017.
Web.
Vianco, Paul T. Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process. United States.
Vianco, Paul T. Wed .
"Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process". United States. https://www.osti.gov/servlets/purl/1347531.
@article{osti_1347531,
title = {Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process},
author = {Vianco, Paul T.},
abstractNote = {Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting-and-spreading) to realize the proper joint geometry. Here, the soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance of the molten filler metal to successfully fill the gap and complete the fillet.},
doi = {},
journal = {Welding Journal},
number = ,
volume = 96,
place = {United States},
year = {Wed Feb 01 00:00:00 EST 2017},
month = {Wed Feb 01 00:00:00 EST 2017}
}
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