Advances in Pb-free solder microstructure control and interconnect design
Abstract
New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing β-Sn nucleation in Sn-based solders, and isothermally solidified interconnects using transient liquid phases. Issues in β-Sn nucleation in Sn-based solders were summarized in the context of Swenson’s 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. Furthermore, all of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.
- Authors:
-
- Purdue Univ., West Lafayette, IN (United States)
- Ames Lab. and Iowa State Univ., Ames, IA (United States)
- Publication Date:
- Research Org.:
- Ames Laboratory (AMES), Ames, IA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1337693
- Report Number(s):
- IS-J-9093
Journal ID: ISSN 1547-7037; PII: 476
- Grant/Contract Number:
- AC02-07CH11358
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Journal of Phase Equilibria and Diffusion
- Additional Journal Information:
- Journal Volume: 37; Journal Issue: 4; Journal ID: ISSN 1547-7037
- Publisher:
- ASM International
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; constitutional undercooling; grain nucleation; liquid phase diffusion bonding; Pb-free solder; ternary diagrams; transient liquid
Citation Formats
Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., and Handwerker, Carol A. Advances in Pb-free solder microstructure control and interconnect design. United States: N. p., 2016.
Web. doi:10.1007/s11669-016-0476-9.
Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., & Handwerker, Carol A. Advances in Pb-free solder microstructure control and interconnect design. United States. https://doi.org/10.1007/s11669-016-0476-9
Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., and Handwerker, Carol A. Thu .
"Advances in Pb-free solder microstructure control and interconnect design". United States. https://doi.org/10.1007/s11669-016-0476-9. https://www.osti.gov/servlets/purl/1337693.
@article{osti_1337693,
title = {Advances in Pb-free solder microstructure control and interconnect design},
author = {Reeve, Kathlene N. and Holaday, John R. and Choquette, Stephanie M. and Anderson, Iver E. and Handwerker, Carol A.},
abstractNote = {New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing β-Sn nucleation in Sn-based solders, and isothermally solidified interconnects using transient liquid phases. Issues in β-Sn nucleation in Sn-based solders were summarized in the context of Swenson’s 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. Furthermore, all of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.},
doi = {10.1007/s11669-016-0476-9},
journal = {Journal of Phase Equilibria and Diffusion},
number = 4,
volume = 37,
place = {United States},
year = {Thu Jun 09 00:00:00 EDT 2016},
month = {Thu Jun 09 00:00:00 EDT 2016}
}
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