Influence of grain boundary characteristics on thermal stability in nanotwinned copper
Abstract
High density grain boundaries provide high strength, but may introduce undesirable features, such as high Fermi levels and instability. We investigated the kinetics of recovery and recrystallization of Cu that was manufactured to include both nanotwins (NT) and high-angle columnar boundaries. We used the isothermal Johnson-Mehl-Avrami-Kolmogorov (JMAK) model to estimate activation energy values for recovery and recrystallization and compared those to values derived using the non-isothermal Kissinger equation. The JMAK model hinges on an exponent that expresses the growth mechanism of a material. The exponent for this Cu was close to 0.5, indicating low-dimensional microstructure evolution, which is associated with anisotropic twin coarsening, heterogeneous recrystallization, and high stability. Since this Cu was of high purity, there was a negligible impurity-drag-effect on boundaries. The twin coarsening and heterogeneous recrystallization resulted from migration of high-angle columnar boundaries with their triple junctions in one direction, assisted by the presence of high concentration vacancies at boundaries. Analyses performed by electron energy loss spectroscopy of atomic columns at twin boundaries (TBs) and in the interior showed similar plasma peak shapes and L3 edge positions. As a result, this implies that values for conductivity and Fermi level are equal for atoms at TBs and in themore »
- Authors:
-
- Florida State Univ., Tallahassee, FL (United States)
- Northeastern Univ., Shenyang (China)
- Publication Date:
- Research Org.:
- Florida State Univ., Tallahassee, FL (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1326644
- Grant/Contract Number:
- SC0008832
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Scientific Reports
- Additional Journal Information:
- Journal Volume: 6; Journal ID: ISSN 2045-2322
- Publisher:
- Nature Publishing Group
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., and Zuo, Xiaowei. Influence of grain boundary characteristics on thermal stability in nanotwinned copper. United States: N. p., 2016.
Web. doi:10.1038/srep31410.
Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., & Zuo, Xiaowei. Influence of grain boundary characteristics on thermal stability in nanotwinned copper. United States. https://doi.org/10.1038/srep31410
Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., and Zuo, Xiaowei. Fri .
"Influence of grain boundary characteristics on thermal stability in nanotwinned copper". United States. https://doi.org/10.1038/srep31410. https://www.osti.gov/servlets/purl/1326644.
@article{osti_1326644,
title = {Influence of grain boundary characteristics on thermal stability in nanotwinned copper},
author = {Niu, Rongmei and Han, Ke and Su, Yi-feng and Besara, Tiglet and Siegrist, Theo M. and Zuo, Xiaowei},
abstractNote = {High density grain boundaries provide high strength, but may introduce undesirable features, such as high Fermi levels and instability. We investigated the kinetics of recovery and recrystallization of Cu that was manufactured to include both nanotwins (NT) and high-angle columnar boundaries. We used the isothermal Johnson-Mehl-Avrami-Kolmogorov (JMAK) model to estimate activation energy values for recovery and recrystallization and compared those to values derived using the non-isothermal Kissinger equation. The JMAK model hinges on an exponent that expresses the growth mechanism of a material. The exponent for this Cu was close to 0.5, indicating low-dimensional microstructure evolution, which is associated with anisotropic twin coarsening, heterogeneous recrystallization, and high stability. Since this Cu was of high purity, there was a negligible impurity-drag-effect on boundaries. The twin coarsening and heterogeneous recrystallization resulted from migration of high-angle columnar boundaries with their triple junctions in one direction, assisted by the presence of high concentration vacancies at boundaries. Analyses performed by electron energy loss spectroscopy of atomic columns at twin boundaries (TBs) and in the interior showed similar plasma peak shapes and L3 edge positions. As a result, this implies that values for conductivity and Fermi level are equal for atoms at TBs and in the interior.},
doi = {10.1038/srep31410},
journal = {Scientific Reports},
number = ,
volume = 6,
place = {United States},
year = {Fri Aug 12 00:00:00 EDT 2016},
month = {Fri Aug 12 00:00:00 EDT 2016}
}
Web of Science
Works referenced in this record:
Ultrahigh Strength and High Electrical Conductivity in Copper
journal, April 2004
- Lu, L.
- Science, Vol. 304, Issue 5669
High strength and high electrical conductivity bulk Cu
journal, December 2004
- Han ¶, K.; Walsh, R. P.; Ishmaku, A.
- Philosophical Magazine, Vol. 84, Issue 34
Twin stability in highly nanotwinned Cu under compression, torsion and tension
journal, June 2012
- Hodge, A. M.; Furnish, T. A.; Shute, C. J.
- Scripta Materialia, Vol. 66, Issue 11
Superior thermal stability of coherent twin boundaries in nanotwinned metals
journal, June 2012
- Zhang, X.; Misra, A.
- Scripta Materialia, Vol. 66, Issue 11
Strain hardening and softening in nanotwinned Cu
journal, June 2013
- Niu, Rongmei; Han, Ke
- Scripta Materialia, Vol. 68, Issue 12
Atomic-scale studies on the effect of boundary coherency on stability in twinned Cu
journal, January 2014
- Niu, Rongmei; Han, Ke; Su, Yi-Feng
- Applied Physics Letters, Vol. 104, Issue 1
Topological view of the thermal stability of nanotwinned copper
journal, January 2013
- LaGrange, Thomas; Reed, Bryan W.; Wall, Mark
- Applied Physics Letters, Vol. 102, Issue 1
Defective twin boundaries in nanotwinned metals
journal, May 2013
- Wang, Y. Morris; Sansoz, Frederic; LaGrange, Thomas
- Nature Materials, Vol. 12, Issue 8
Thermodynamics and kinetics of grain boundary triple junctions in metals: Recent developments
journal, June 2010
- Gottstein, G.; Shvindlerman, L. S.; Zhao, B.
- Scripta Materialia, Vol. 62, Issue 12
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
journal, October 2007
- Chen, X. H.; Lu, L.; Lu, K.
- Journal of Applied Physics, Vol. 102, Issue 8
Current issues in recrystallization: a review
journal, November 1997
- Doherty, R. D.; Hughes, D. A.; Humphreys, F. J.
- Materials Science and Engineering: A, Vol. 238, Issue 2
Nucleation and growth during recrystallization
journal, September 2005
- Rios, Paulo Rangel; Siciliano Jr, Fulvio; Sandim, Hugo Ricardo Zschommler
- Materials Research, Vol. 8, Issue 3
Zur kinetik der rekristallisation von kupfer nach tieftemperaturverformung
journal, July 1965
- Mengelberg, H. D.; Meixner, M.; Lücke, K.
- Acta Metallurgica, Vol. 13, Issue 7
Recrystallization of Electrodeposited Copper Thin Films During Annealing
journal, September 2010
- Alshwawreh, N.; Militzer, M.; Bizzotto, D.
- Journal of Electronic Materials, Vol. 39, Issue 11
Comparative measurements of the recrystallization energy by different calorimeters
journal, July 1975
- Gottstein, G.; Steffen, H.; Hemminger, W.
- Scripta Metallurgica, Vol. 9, Issue 7
Stored energy and recrystallization temperature of rolled copper and silver single crystals with defined solute contents
journal, September 1979
- Haessner, Frank; Hoschek, Günter; Tölg, Günther
- Acta Metallurgica, Vol. 27, Issue 9
The release of energy during annealing of deformed metals
journal, October 1955
- Clarebrough, L. M.; Hargreaves, M. E.; West, G. W.
- Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, Vol. 232, Issue 1189, p. 252-270
Stored energy and electrical resistivity in deformed metals
journal, June 1961
- Clarebrough, L. M.; Hargreaves, M. E.; Loretto, M. H.
- Philosophical Magazine, Vol. 6, Issue 66
Stored energy of 78 K tensile deformed copper crystals
journal, May 1975
- Gottstein, G.; Bewerunge, J.; Mecking, H.
- Acta Metallurgica, Vol. 23, Issue 5
Kinetics of Phase Change. II Transformation‐Time Relations for Random Distribution of Nuclei
journal, February 1940
- Avrami, Melvin
- The Journal of Chemical Physics, Vol. 8, Issue 2
Kinetics of Phase Change. I General Theory
journal, December 1939
- Avrami, Melvin
- The Journal of Chemical Physics, Vol. 7, Issue 12, p. 1103-1112
III. Dislocation densities in some annealed and cold-worked metals from measurements on the X-ray debye-scherrer spectrum
journal, January 1956
- Williamson, G. K.; Smallman, R. E.
- Philosophical Magazine, Vol. 1, Issue 1
Highly textured and twinned Cu films fabricated by pulsed electrodeposition
journal, August 2007
- Cui, B. Z.; Han, K.; Xin, Y.
- Acta Materialia, Vol. 55, Issue 13
Proceedings of SCANNING 99 Chicago, Illinois, USA Sunday, April 11
journal, March 1999
- Youngblom, J. H.; Youngblom, J. J.; Wilkinson, J.
- Scanning, Vol. 21, Issue 2, p. 53-170
Atomic mechanisms of grain boundary diffusion: Low versus high temperatures
journal, June 2005
- Suzuki, A.; Mishin, Y.
- Journal of Materials Science, Vol. 40, Issue 12
Atomic mechanism for dislocation emission from nanosized grain boundaries
journal, June 2002
- Van Swygenhoven, H.; Derlet, P. M.; Hasnaoui, A.
- Physical Review B, Vol. 66, Issue 2
Re-evaluation of the Ibe–Lücke growth selection experiment in a Fe–Si single crystal
journal, May 2005
- Verbeken, K.; Kestens, L.; Nave, M. D.
- Acta Materialia, Vol. 53, Issue 9
Crystallization kinetics and the JMAK equation
journal, October 1997
- Weinberg, Michael C.; Birnie, Dunbar P.; Shneidman, Vitaly A.
- Journal of Non-Crystalline Solids, Vol. 219
The influence of glass composition on the crystal growth kinetics of heavy metal fluoride glasses
journal, April 1985
- Bansal, N. P.; Bruce, A. J.; Doremus, R. H.
- Journal of Non-Crystalline Solids, Vol. 70, Issue 3
Grain boundary self-diffusion in Cu polycrystals of different purity
journal, September 1997
- Surholt, T.; Herzig, Chr.
- Acta Materialia, Vol. 45, Issue 9
A quantitative theory of grain-boundary motion and recrystallization in metals in the presence of impurities
journal, November 1957
- Lücke, K.; Detert, K.
- Acta Metallurgica, Vol. 5, Issue 11
The impurity-drag effect in grain boundary motion
journal, September 1962
- Cahn, John W.
- Acta Metallurgica, Vol. 10, Issue 9
The Role of Solute Segregation in Grain Boundary Diffusion
journal, January 1982
- Bernardini, J.; Gas, P.; Hondros, E. D.
- Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 379, Issue 1776
On the retardation of grain boundary motion by small particles
journal, November 2010
- Gottstein, G.; Shvindlerman, L. S.
- Scripta Materialia, Vol. 63, Issue 11
Thermal stability of sputtered Cu films with nanoscale growth twins
journal, May 2008
- Anderoglu, O.; Misra, A.; Wang, H.
- Journal of Applied Physics, Vol. 103, Issue 9
Grain boundary migration: misorientation dependence
journal, January 2001
- Gottstein, G.; Molodov, D. A.; Shvindlerman, L. S.
- Current Opinion in Solid State and Materials Science, Vol. 5, Issue 1
Isothermal Annealing Effects in Irradiated Copper
journal, May 1953
- Overhauser, Albert W.
- Physical Review, Vol. 90, Issue 3
Calculating the vacancy formation energy in metals: Pt, Pd, and Mo
journal, December 2002
- Mattsson, Thomas R.; Mattsson, Ann E.
- Physical Review B, Vol. 66, Issue 21
A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure
journal, August 2007
- Kalu, P. N.; Waryoba, D. R.
- Materials Science and Engineering: A, Vol. 464, Issue 1-2
Structure of electroplated and vapor‐deposited copper films. III. Recrystallization and grain growth
journal, September 1974
- Gangulee, A.
- Journal of Applied Physics, Vol. 45, Issue 9
Mechanical properties of MP35N as a reinforcement material for pulsed magnets
journal, March 2002
- Ke Han, ; Ishmaku, A.
- IEEE Transactions on Appiled Superconductivity, Vol. 12, Issue 1
The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C
journal, April 1972
- Staker, M. R.; Holt, D. L.
- Acta Metallurgica, Vol. 20, Issue 4
Structural and calorimetric investigations during recrystallization of rolled copper
journal, January 1979
- Haessner, F.
- Metals Technology, Vol. 6, Issue 1
An Introduction to Electron Energy-Loss Spectroscopy
book, January 1996
- Egerton, R. F.
- Electron Energy-Loss Spectroscopy in the Electron Microscope
Recovery revisited
journal, May 2005
- Dybkaer, René
- Accreditation and Quality Assurance, Vol. 10, Issue 6
Current issues in recrystallization: A review
journal, January 1998
- Doherty, R. D.; Hughes, D. A.; Humphreys, F. J.
- Materials Today, Vol. 1, Issue 2
Phase Transformations in Metals and Alloys
journal, August 1973
- Meyrick, G.; Powell, G. W.
- Annual Review of Materials Science, Vol. 3, Issue 1
Recrystallization Textures
book, January 1995
- Humphreys, F. J.; Hatherly, M.
- Recrystallization and Related Annealing Phenomena
Atomic mechanisms of grain boundary diffusion: Low versus high temperatures
journal, June 2005
- Suzuki, A.; Mishin, Y.
- Journal of Materials Science, Vol. 40, Issue 12
Recrystallization of Electrodeposited Copper Thin Films During Annealing
journal, September 2010
- Alshwawreh, N.; Militzer, M.; Bizzotto, D.
- Journal of Electronic Materials, Vol. 39, Issue 11
A quantitative theory of grain-boundary motion and recrystallization in metals in the presence of impurities
journal, November 1957
- Lücke, K.; Detert, K.
- Acta Metallurgica, Vol. 5, Issue 11
The impurity-drag effect in grain boundary motion
journal, September 1962
- Cahn, John W.
- Acta Metallurgica, Vol. 10, Issue 9
The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C
journal, April 1972
- Staker, M. R.; Holt, D. L.
- Acta Metallurgica, Vol. 20, Issue 4
Stored energy and recrystallization temperature of rolled copper and silver single crystals with defined solute contents
journal, September 1979
- Haessner, Frank; Hoschek, Günter; Tölg, Günther
- Acta Metallurgica, Vol. 27, Issue 9
The influence of glass composition on the crystal growth kinetics of heavy metal fluoride glasses
journal, April 1985
- Bansal, N. P.; Bruce, A. J.; Doremus, R. H.
- Journal of Non-Crystalline Solids, Vol. 70, Issue 3
Re-evaluation of the Ibe–Lücke growth selection experiment in a Fe–Si single crystal
journal, May 2005
- Verbeken, K.; Kestens, L.; Nave, M. D.
- Acta Materialia, Vol. 53, Issue 9
Highly textured and twinned Cu films fabricated by pulsed electrodeposition
journal, August 2007
- Cui, B. Z.; Han, K.; Xin, Y.
- Acta Materialia, Vol. 55, Issue 13
A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure
journal, August 2007
- Kalu, P. N.; Waryoba, D. R.
- Materials Science and Engineering: A, Vol. 464, Issue 1-2
Thermodynamics and kinetics of grain boundary triple junctions in metals: Recent developments
journal, June 2010
- Gottstein, G.; Shvindlerman, L. S.; Zhao, B.
- Scripta Materialia, Vol. 62, Issue 12
On the retardation of grain boundary motion by small particles
journal, November 2010
- Gottstein, G.; Shvindlerman, L. S.
- Scripta Materialia, Vol. 63, Issue 11
Superior thermal stability of coherent twin boundaries in nanotwinned metals
journal, June 2012
- Zhang, X.; Misra, A.
- Scripta Materialia, Vol. 66, Issue 11
Twin stability in highly nanotwinned Cu under compression, torsion and tension
journal, June 2012
- Hodge, A. M.; Furnish, T. A.; Shute, C. J.
- Scripta Materialia, Vol. 66, Issue 11
Strain hardening and softening in nanotwinned Cu
journal, June 2013
- Niu, Rongmei; Han, Ke
- Scripta Materialia, Vol. 68, Issue 12
Defective twin boundaries in nanotwinned metals
journal, May 2013
- Wang, Y. Morris; Sansoz, Frederic; LaGrange, Thomas
- Nature Materials, Vol. 12, Issue 8
Structure of electroplated and vapor‐deposited copper films. III. Recrystallization and grain growth
journal, September 1974
- Gangulee, A.
- Journal of Applied Physics, Vol. 45, Issue 9
Kinetics of Phase Change. I General Theory
journal, December 1939
- Avrami, Melvin
- The Journal of Chemical Physics, Vol. 7, Issue 12, p. 1103-1112
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
journal, October 2007
- Chen, X. H.; Lu, L.; Lu, K.
- Journal of Applied Physics, Vol. 102, Issue 8
Thermal stability of sputtered Cu films with nanoscale growth twins
journal, May 2008
- Anderoglu, O.; Misra, A.; Wang, H.
- Journal of Applied Physics, Vol. 103, Issue 9
Topological view of the thermal stability of nanotwinned copper
journal, January 2013
- LaGrange, Thomas; Reed, Bryan W.; Wall, Mark
- Applied Physics Letters, Vol. 102, Issue 1
High strength and high electrical conductivity bulk Cu
journal, December 2004
- Han ¶, K.; Walsh, R. P.; Ishmaku, A.
- Philosophical Magazine, Vol. 84, Issue 34
III. Dislocation densities in some annealed and cold-worked metals from measurements on the X-ray debye-scherrer spectrum
journal, January 1956
- Williamson, G. K.; Smallman, R. E.
- Philosophical Magazine, Vol. 1, Issue 1
Stored energy and electrical resistivity in deformed metals
journal, June 1961
- Clarebrough, L. M.; Hargreaves, M. E.; Loretto, M. H.
- Philosophical Magazine, Vol. 6, Issue 66
The release of energy during annealing of deformed metals
journal, October 1955
- Clarebrough, L. M.; Hargreaves, M. E.; West, G. W.
- Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, Vol. 232, Issue 1189, p. 252-270
The Role of Solute Segregation in Grain Boundary Diffusion
journal, January 1982
- Bernardini, J.; Gas, P.; Hondros, E. D.
- Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 379, Issue 1776
Ultrahigh Strength and High Electrical Conductivity in Copper
journal, April 2004
- Lu, L.
- Science, Vol. 304, Issue 5669
Structural and calorimetric investigations during recrystallization of rolled copper
journal, January 1979
- Haessner, F.
- Metals Technology, Vol. 6, Issue 1
Works referencing / citing this record:
In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films
journal, September 2017
- Cheng, Gong; Li, Heng; Xu, Gaowei
- Scientific Reports, Vol. 7, Issue 1