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Title: Influence of grain boundary characteristics on thermal stability in nanotwinned copper

Abstract

High density grain boundaries provide high strength, but may introduce undesirable features, such as high Fermi levels and instability. We investigated the kinetics of recovery and recrystallization of Cu that was manufactured to include both nanotwins (NT) and high-angle columnar boundaries. We used the isothermal Johnson-Mehl-Avrami-Kolmogorov (JMAK) model to estimate activation energy values for recovery and recrystallization and compared those to values derived using the non-isothermal Kissinger equation. The JMAK model hinges on an exponent that expresses the growth mechanism of a material. The exponent for this Cu was close to 0.5, indicating low-dimensional microstructure evolution, which is associated with anisotropic twin coarsening, heterogeneous recrystallization, and high stability. Since this Cu was of high purity, there was a negligible impurity-drag-effect on boundaries. The twin coarsening and heterogeneous recrystallization resulted from migration of high-angle columnar boundaries with their triple junctions in one direction, assisted by the presence of high concentration vacancies at boundaries. Analyses performed by electron energy loss spectroscopy of atomic columns at twin boundaries (TBs) and in the interior showed similar plasma peak shapes and L3 edge positions. As a result, this implies that values for conductivity and Fermi level are equal for atoms at TBs and in themore » interior.« less

Authors:
 [1];  [1];  [1];  [1];  [1];  [2]
  1. Florida State Univ., Tallahassee, FL (United States)
  2. Northeastern Univ., Shenyang (China)
Publication Date:
Research Org.:
Florida State Univ., Tallahassee, FL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1326644
Grant/Contract Number:  
SC0008832
Resource Type:
Accepted Manuscript
Journal Name:
Scientific Reports
Additional Journal Information:
Journal Volume: 6; Journal ID: ISSN 2045-2322
Publisher:
Nature Publishing Group
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., and Zuo, Xiaowei. Influence of grain boundary characteristics on thermal stability in nanotwinned copper. United States: N. p., 2016. Web. doi:10.1038/srep31410.
Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., & Zuo, Xiaowei. Influence of grain boundary characteristics on thermal stability in nanotwinned copper. United States. https://doi.org/10.1038/srep31410
Niu, Rongmei, Han, Ke, Su, Yi-feng, Besara, Tiglet, Siegrist, Theo M., and Zuo, Xiaowei. Fri . "Influence of grain boundary characteristics on thermal stability in nanotwinned copper". United States. https://doi.org/10.1038/srep31410. https://www.osti.gov/servlets/purl/1326644.
@article{osti_1326644,
title = {Influence of grain boundary characteristics on thermal stability in nanotwinned copper},
author = {Niu, Rongmei and Han, Ke and Su, Yi-feng and Besara, Tiglet and Siegrist, Theo M. and Zuo, Xiaowei},
abstractNote = {High density grain boundaries provide high strength, but may introduce undesirable features, such as high Fermi levels and instability. We investigated the kinetics of recovery and recrystallization of Cu that was manufactured to include both nanotwins (NT) and high-angle columnar boundaries. We used the isothermal Johnson-Mehl-Avrami-Kolmogorov (JMAK) model to estimate activation energy values for recovery and recrystallization and compared those to values derived using the non-isothermal Kissinger equation. The JMAK model hinges on an exponent that expresses the growth mechanism of a material. The exponent for this Cu was close to 0.5, indicating low-dimensional microstructure evolution, which is associated with anisotropic twin coarsening, heterogeneous recrystallization, and high stability. Since this Cu was of high purity, there was a negligible impurity-drag-effect on boundaries. The twin coarsening and heterogeneous recrystallization resulted from migration of high-angle columnar boundaries with their triple junctions in one direction, assisted by the presence of high concentration vacancies at boundaries. Analyses performed by electron energy loss spectroscopy of atomic columns at twin boundaries (TBs) and in the interior showed similar plasma peak shapes and L3 edge positions. As a result, this implies that values for conductivity and Fermi level are equal for atoms at TBs and in the interior.},
doi = {10.1038/srep31410},
journal = {Scientific Reports},
number = ,
volume = 6,
place = {United States},
year = {Fri Aug 12 00:00:00 EDT 2016},
month = {Fri Aug 12 00:00:00 EDT 2016}
}

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Cited by: 22 works
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Works referenced in this record:

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  • DOI: 10.1007/s11664-010-1342-x

A quantitative theory of grain-boundary motion and recrystallization in metals in the presence of impurities
journal, November 1957


The impurity-drag effect in grain boundary motion
journal, September 1962


The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C
journal, April 1972


Stored energy and recrystallization temperature of rolled copper and silver single crystals with defined solute contents
journal, September 1979


The influence of glass composition on the crystal growth kinetics of heavy metal fluoride glasses
journal, April 1985


Recovery revisited
journal, June 1995


Re-evaluation of the Ibe–Lücke growth selection experiment in a Fe–Si single crystal
journal, May 2005


Highly textured and twinned Cu films fabricated by pulsed electrodeposition
journal, August 2007


A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure
journal, August 2007


Thermodynamics and kinetics of grain boundary triple junctions in metals: Recent developments
journal, June 2010


On the retardation of grain boundary motion by small particles
journal, November 2010


Superior thermal stability of coherent twin boundaries in nanotwinned metals
journal, June 2012


Twin stability in highly nanotwinned Cu under compression, torsion and tension
journal, June 2012


Strain hardening and softening in nanotwinned Cu
journal, June 2013


Defective twin boundaries in nanotwinned metals
journal, May 2013

  • Wang, Y. Morris; Sansoz, Frederic; LaGrange, Thomas
  • Nature Materials, Vol. 12, Issue 8
  • DOI: 10.1038/nmat3646

Structure of electroplated and vapor‐deposited copper films. III. Recrystallization and grain growth
journal, September 1974


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journal, December 1939

  • Avrami, Melvin
  • The Journal of Chemical Physics, Vol. 7, Issue 12, p. 1103-1112
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Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
journal, October 2007

  • Chen, X. H.; Lu, L.; Lu, K.
  • Journal of Applied Physics, Vol. 102, Issue 8
  • DOI: 10.1063/1.2799087

Thermal stability of sputtered Cu films with nanoscale growth twins
journal, May 2008

  • Anderoglu, O.; Misra, A.; Wang, H.
  • Journal of Applied Physics, Vol. 103, Issue 9
  • DOI: 10.1063/1.2913322

Topological view of the thermal stability of nanotwinned copper
journal, January 2013

  • LaGrange, Thomas; Reed, Bryan W.; Wall, Mark
  • Applied Physics Letters, Vol. 102, Issue 1
  • DOI: 10.1063/1.4772589

High strength and high electrical conductivity bulk Cu
journal, December 2004


III. Dislocation densities in some annealed and cold-worked metals from measurements on the X-ray debye-scherrer spectrum
journal, January 1956


Stored energy and electrical resistivity in deformed metals
journal, June 1961

  • Clarebrough, L. M.; Hargreaves, M. E.; Loretto, M. H.
  • Philosophical Magazine, Vol. 6, Issue 66
  • DOI: 10.1080/14786436108238374

The release of energy during annealing of deformed metals
journal, October 1955

  • Clarebrough, L. M.; Hargreaves, M. E.; West, G. W.
  • Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, Vol. 232, Issue 1189, p. 252-270
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The Role of Solute Segregation in Grain Boundary Diffusion
journal, January 1982

  • Bernardini, J.; Gas, P.; Hondros, E. D.
  • Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 379, Issue 1776
  • DOI: 10.1098/rspa.1982.0011

Ultrahigh Strength and High Electrical Conductivity in Copper
journal, April 2004


Structural and calorimetric investigations during recrystallization of rolled copper
journal, January 1979


Works referencing / citing this record:

In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films
journal, September 2017