Power Cycle Testing of Power Switches: A Literature Survey

GopiReddy, Lakshmi Reddy; Tolbert, Leon M.; Ozpineci, Burak

doi:10.1109/TPEL.2014.2359015

Title: Power Cycle Testing of Power Switches: A Literature Survey

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Abstract

Reliability of power converters and lifetime prediction has been a major topic of research in the last few decades, especially for traction applications. The main failures in high power semiconductors are caused by thermomechanical fatigue. Power cycling and temperature cycling are the two most common thermal acceleration tests used in assessing reliability. The objective of this paper is to study the various power cycling tests found in the literature and to develop generalized steps in planning application specific power cycling tests. A comparison of different tests based on the failures, duration, test circuits, and monitored electrical parameters is presented.

Authors:

GopiReddy, Lakshmi Reddy ^[1]; Tolbert, Leon M. ^[2]; Ozpineci, Burak ^[3]

Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Science
Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Scienc; Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Group

Publication Date:: Thu Sep 18 00:00:00 EDT 2014

Research Org.:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Oak Ridge National Environmental Research Park

Sponsoring Org.:: USDOE; National Science Foundation (NSF)

OSTI Identifier:: 1325461

Grant/Contract Number:: AC05-00OR22725; EEC-1041877

Resource Type:: Accepted Manuscript

Journal Name:: IEEE Transactions on Power Electronics

Additional Journal Information:: Journal Volume: 30; Journal Issue: 5; Journal ID: ISSN 0885-8993

Publisher:: IEEE

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; Failure mechanisms; lifetime estimation; physics of failure; power cycling; precursor indicators; semiconductor reliability; IGBT MODULES; HEALTH MANAGEMENT; RELIABILITY; TRACTION; LIFETIME; TECHNOLOGIES; FAILURE; PHYSICS; SYSTEM

Citation Formats


                    GopiReddy, Lakshmi Reddy, Tolbert, Leon M., and Ozpineci, Burak. Power Cycle Testing of Power Switches: A Literature Survey.  United States: N. p., 2014. 
Web.  doi:10.1109/TPEL.2014.2359015.

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                    GopiReddy, Lakshmi Reddy, Tolbert, Leon M., & Ozpineci, Burak. Power Cycle Testing of Power Switches: A Literature Survey.  United States.  https://doi.org/10.1109/TPEL.2014.2359015

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                    GopiReddy, Lakshmi Reddy, Tolbert, Leon M., and Ozpineci, Burak. Thu .  
"Power Cycle Testing of Power Switches: A Literature Survey".  United States.  https://doi.org/10.1109/TPEL.2014.2359015.  https://www.osti.gov/servlets/purl/1325461.

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@article{osti_1325461,

  title        = {Power Cycle Testing of Power Switches: A Literature Survey},

  author       = {GopiReddy, Lakshmi Reddy and Tolbert, Leon M. and Ozpineci, Burak},

  abstractNote = {Reliability of power converters and lifetime prediction has been a major topic of research in the last few decades, especially for traction applications. The main failures in high power semiconductors are caused by thermomechanical fatigue. Power cycling and temperature cycling are the two most common thermal acceleration tests used in assessing reliability. The objective of this paper is to study the various power cycling tests found in the literature and to develop generalized steps in planning application specific power cycling tests. A comparison of different tests based on the failures, duration, test circuits, and monitored electrical parameters is presented.},

  doi          = {10.1109/TPEL.2014.2359015},

  journal      = {IEEE Transactions on Power Electronics},

  number       = 5,

  volume       = 30,

  place        = {United States},

  year         = {Thu Sep 18 00:00:00 EDT 2014},

  month        = {Thu Sep 18 00:00:00 EDT 2014}

}

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