DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals

Abstract

The remarkable properties of nanotwinned (NT) face-centered-cubic (fcc) metals arise directly from twin boundaries, the structures of which can be initially determined by growth twinning during the deposition process. Understanding the synthesis process and its relation to the resulting microstructure, and ultimately to material properties, is key to understanding and utilizing these materials. This article presents recent studies on electrodeposition and sputtering methods that produce a high density of nanoscale growth twins in fcc metals. Nanoscale growth twins tend to form spontaneously in monolithic and alloyed fcc metals with lower stacking-fault energies, while engineered approaches are necessary for fcc metals with higher stacking-fault energies. As a result, growth defects and other microstructural features that influence nanotwin behavior and stability are introduced here, and future challenges in fabricating NT materials are highlighted.

Authors:
 [1];  [2];  [3];  [4]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  2. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
  3. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
  4. Chinese Academy of Sciences (CAS), Beijing (China)
Publication Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1304710
Alternate Identifier(s):
OSTI ID: 1341404
Report Number(s):
LA-UR-15-26739; SAND-2016-12516J
Journal ID: ISSN 0883-7694; applab
Grant/Contract Number:  
AC52-06NA25396; AC04-94AL85000; SC0010482; AC52-07NA27344; FWP 06SCPE401; W-7405-ENG-36
Resource Type:
Accepted Manuscript
Journal Name:
MRS Bulletin
Additional Journal Information:
Journal Volume: 41; Journal Issue: 04; Journal ID: ISSN 0883-7694
Publisher:
Materials Research Society
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; electrodeposition; grain boundaries; metal; microstructure; sputtering

Citation Formats

Bufford, Daniel C., Wang, Morris, Liu, Yue, and Lu, Lei. Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals. United States: N. p., 2016. Web. doi:10.1557/mrs.2016.62.
Bufford, Daniel C., Wang, Morris, Liu, Yue, & Lu, Lei. Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals. United States. https://doi.org/10.1557/mrs.2016.62
Bufford, Daniel C., Wang, Morris, Liu, Yue, and Lu, Lei. Fri . "Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals". United States. https://doi.org/10.1557/mrs.2016.62. https://www.osti.gov/servlets/purl/1304710.
@article{osti_1304710,
title = {Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals},
author = {Bufford, Daniel C. and Wang, Morris and Liu, Yue and Lu, Lei},
abstractNote = {The remarkable properties of nanotwinned (NT) face-centered-cubic (fcc) metals arise directly from twin boundaries, the structures of which can be initially determined by growth twinning during the deposition process. Understanding the synthesis process and its relation to the resulting microstructure, and ultimately to material properties, is key to understanding and utilizing these materials. This article presents recent studies on electrodeposition and sputtering methods that produce a high density of nanoscale growth twins in fcc metals. Nanoscale growth twins tend to form spontaneously in monolithic and alloyed fcc metals with lower stacking-fault energies, while engineered approaches are necessary for fcc metals with higher stacking-fault energies. As a result, growth defects and other microstructural features that influence nanotwin behavior and stability are introduced here, and future challenges in fabricating NT materials are highlighted.},
doi = {10.1557/mrs.2016.62},
journal = {MRS Bulletin},
number = 04,
volume = 41,
place = {United States},
year = {Fri Apr 01 00:00:00 EDT 2016},
month = {Fri Apr 01 00:00:00 EDT 2016}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Citation Metrics:
Cited by: 51 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Novel relaxation process in strained Si/Ge superlattices grown on Ge (001)
journal, October 1990

  • Wegscheider, W.; Eberl, K.; Abstreiter, G.
  • Applied Physics Letters, Vol. 57, Issue 15
  • DOI: 10.1063/1.103375

Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins
journal, December 2005

  • Zhang, X.; Misra, A.; Wang, H.
  • Applied Physics Letters, Vol. 87, Issue 23
  • DOI: 10.1063/1.2135871

Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness
journal, October 2015


Microstructural analysis and tensile properties of thick copper and nickel sputter deposits
journal, January 1977


Influence of stacking fault energy on twin spacing of Cu and Cu–Al alloys
journal, July 2014


Large-scale production of nano-twinned, ultrafine-grained copper
journal, August 2006

  • Hodge, A. M.; Wang, Y. M.; Barbee, T. W.
  • Materials Science and Engineering: A, Vol. 429, Issue 1-2
  • DOI: 10.1016/j.msea.2006.05.109

Stacking fault and partial dislocation dominated strengthening mechanisms in highly textured Cu/Co multilayers
journal, October 2013


High temperature stabilization of nanocrystalline grain size: Thermodynamic versus kinetic strategies
journal, January 2013

  • Koch, Carl C.; Scattergood, Ronald O.; Saber, Mostafa
  • Journal of Materials Research, Vol. 28, Issue 13
  • DOI: 10.1557/jmr.2012.429

Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition
journal, November 2011

  • Chan, Tsung-Cheng; Chueh, Yu-Lun; Liao, Chien-Neng
  • Crystal Growth & Design, Vol. 11, Issue 11
  • DOI: 10.1021/cg200877f

Pulse and pulse reverse plating—Conceptual, advantages and applications
journal, March 2008


Nanoscale growth twins in sputtered metal films
journal, September 2008


Deformation twinning in nanocrystalline materials
journal, January 2012


Epitaxial nanotwinned Cu films with high strength and high conductivity
journal, August 2008

  • Anderoglu, O.; Misra, A.; Wang, H.
  • Applied Physics Letters, Vol. 93, Issue 8
  • DOI: 10.1063/1.2969409

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
journal, August 2008


The Influence of Specific Anion Adsorption on the Surface Roughness of Electrodeposited Polycrystalline Cu Films
journal, January 2010

  • Vasiljevic, N.; Wood, M.; Heard, P. J.
  • Journal of The Electrochemical Society, Vol. 157, Issue 4
  • DOI: 10.1149/1.3298890

Work hardening of polycrystalline Cu with nanoscale twins
journal, June 2012


High strength, epitaxial nanotwinned Ag films
journal, January 2011


Mechanical properties of nanocrystalline materials
journal, May 2006


Mechanical properties of highly textured Cu/Ni multilayers
journal, March 2011


Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films
journal, April 2007

  • Zhang, X.; Anderoglu, O.; Misra, A.
  • Applied Physics Letters, Vol. 90, Issue 15
  • DOI: 10.1063/1.2720708

Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
journal, October 2007

  • Chen, X. H.; Lu, L.; Lu, K.
  • Journal of Applied Physics, Vol. 102, Issue 8
  • DOI: 10.1063/1.2799087

Mechanical deformation of high-purity sputter-deposited nano-twinned copper
journal, July 2008


On the mechanical performance and deformation of nanotwinned Ag
journal, April 2014


High Rate Thick Film Growth
journal, August 1977


Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning
journal, February 2004


Basic criteria for formation of growth twins in high stacking fault energy metals
journal, October 2013

  • Yu, K. Y.; Bufford, D.; Chen, Y.
  • Applied Physics Letters, Vol. 103, Issue 18
  • DOI: 10.1063/1.4826917

Tensile properties of copper with nano-scale twins
journal, May 2005


Optimization of strength and ductility in nanotwinned ultra-fine grained Ag: Twin density and grain orientations
journal, September 2015


High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins
journal, April 2006

  • Zhang, X.; Wang, H.; Chen, X. H.
  • Applied Physics Letters, Vol. 88, Issue 17
  • DOI: 10.1063/1.2198482

On the nature of L10 ordering in equiatomic AuNi and AuCu thin films grown on Au(001)
journal, January 1997


Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture
journal, November 2012

  • Zhao, Yifu; Furnish, Timothy Allen; Kassner, Michael Ernest
  • Journal of Materials Research, Vol. 27, Issue 24
  • DOI: 10.1557/jmr.2012.376

Eliminate Kirkendall voids in solder reactions on nanotwinned copper
journal, March 2013


Strain relaxation in heteroepitaxial films by misfit twinning: II. Equilibrium morphology
journal, March 2007

  • Zhang, Yousheng; Liu, Lilin; Zhang, Tong-Yi
  • Journal of Applied Physics, Vol. 101, Issue 6
  • DOI: 10.1063/1.2433547

Synthesis and corrosion property of pure Ni with a high density of nanoscale twins
journal, August 2008


Deformation twinning
journal, January 1995


Dislocation structures of Σ3 {112} twin boundaries in face centered cubic metals
journal, July 2009

  • Wang, J.; Anderoglu, O.; Hirth, J. P.
  • Applied Physics Letters, Vol. 95, Issue 2
  • DOI: 10.1063/1.3176979

Strengthening high-stacking-fault-energy metals via parallelogram nanotwins
journal, November 2015


Ultrahigh Strength and High Electrical Conductivity in Copper
journal, April 2004


A formation mechanism for ultra-thin nanotwins in highly textured Cu/Ni multilayers
journal, April 2012

  • Liu, Y.; Bufford, D.; Rios, S.
  • Journal of Applied Physics, Vol. 111, Issue 7
  • DOI: 10.1063/1.3702461

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
journal, April 2009


MICROSTRUCTURE DEPENDENCE OF DIRECT-CURRENT ELECTRODEPOSITED BULK Cu WITHPREFERENTIALLY ORIENTED NANOTWINSON THE CURRENT DENSITIES
journal, January 2013


Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag
journal, January 2009

  • Saldana, C.; Murthy, T. G.; Shankar, M. R.
  • Applied Physics Letters, Vol. 94, Issue 2
  • DOI: 10.1063/1.3072595

Ultrahigh Strain Hardening in Thin Palladium Films with Nanoscale Twins
journal, April 2011

  • Idrissi, Hosni; Wang, Binjie; Colla, Marie Stéphane
  • Advanced Materials, Vol. 23, Issue 18
  • DOI: 10.1002/adma.201004160

Tensile behavior of columnar grained Cu with preferentially oriented nanoscale twins
journal, October 2011


Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
journal, December 2008

  • Xu, Luhua; Xu, Di; Tu, K. N.
  • Journal of Applied Physics, Vol. 104, Issue 11
  • DOI: 10.1063/1.3035944

Defective twin boundaries in nanotwinned metals
journal, May 2013

  • Wang, Y. Morris; Sansoz, Frederic; LaGrange, Thomas
  • Nature Materials, Vol. 12, Issue 8
  • DOI: 10.1038/nmat3646

Detwinning mechanisms for growth twins in face-centered cubic metals
journal, April 2010


Topological view of the thermal stability of nanotwinned copper
journal, January 2013

  • LaGrange, Thomas; Reed, Bryan W.; Wall, Mark
  • Applied Physics Letters, Vol. 102, Issue 1
  • DOI: 10.1063/1.4772589

Thermal stability of twins and strengthening mechanisms in differently oriented epitaxial nanotwinned Ag films
journal, May 2013

  • Bufford, Daniel; Wang, Haiyan; Zhang, Xinghang
  • Journal of Materials Research, Vol. 28, Issue 13
  • DOI: 10.1557/jmr.2013.50

Nanostructured Ni-Co alloys with tailorable grain size and twin density
journal, July 2005

  • Wu, B. Y. C.; Schuh, C. A.; Ferreira, P. J.
  • Metallurgical and Materials Transactions A, Vol. 36, Issue 7
  • DOI: 10.1007/s11661-005-0056-9

Damage-tolerant nanotwinned metals with nanovoids under radiation environments
journal, April 2015

  • Chen, Y.; Yu, K. Y.; Liu, Y.
  • Nature Communications, Vol. 6, Issue 1
  • DOI: 10.1038/ncomms8036

Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins
journal, June 2011


Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading
journal, December 2014


In situ nanoindentation study on plasticity and work hardening in aluminium with incoherent twin boundaries
journal, September 2014

  • Bufford, D.; Liu, Y.; Wang, J.
  • Nature Communications, Vol. 5, Issue 1
  • DOI: 10.1038/ncomms5864

Thermal stability of sputtered Cu films with nanoscale growth twins
journal, May 2008

  • Anderoglu, O.; Misra, A.; Wang, H.
  • Journal of Applied Physics, Vol. 103, Issue 9
  • DOI: 10.1063/1.2913322

Plastic anisotropy and associated deformation mechanisms in nanotwinned metals
journal, January 2013


Deformation mechanisms in nanotwinned metal nanopillars
journal, July 2012

  • Jang, Dongchan; Li, Xiaoyan; Gao, Huajian
  • Nature Nanotechnology, Vol. 7, Issue 9
  • DOI: 10.1038/nnano.2012.116

Ultrastrong Mg Alloy via Nano-spaced Stacking Faults
journal, February 2013


Nanotwinned diamond with unprecedented hardness and stability
journal, June 2014


Orientation-dependent hardness and strain rate sensitivity in nanotwin copper
journal, June 2012

  • Ye, J. C.; Wang, Y. M.; Barbee, T. W.
  • Applied Physics Letters, Vol. 100, Issue 26
  • DOI: 10.1063/1.4731242

Formation Mechanisms of High-density Growth Twins in Aluminum with High Stacking-Fault Energy
journal, February 2013


Revealing the Maximum Strength in Nanotwinned Copper
journal, January 2009


Texture-dependent twin formation in nanocrystalline thin Pd films
journal, June 2012


Novel relaxation process in strained Si/Ge superlattices grown on Ge (001)
text, January 1990

  • Wegscheider, Werner; Eberl, Karl; Abstreiter, Gerhard
  • Universität Regensburg
  • DOI: 10.5283/epub.9980

Works referencing / citing this record:

Microscale 3D Printing of Nanotwinned Copper
journal, December 2017

  • Behroozfar, Ali; Daryadel, Soheil; Morsali, S. Reza
  • Advanced Materials, Vol. 30, Issue 4
  • DOI: 10.1002/adma.201705107

Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias
journal, November 2018

  • Yang, Hanry; Lee, Tae-Kyu; Meinshausen, Lutz
  • Journal of Electronic Materials, Vol. 48, Issue 1
  • DOI: 10.1007/s11664-018-6805-5

Effects of Ga Content on Dynamic Recrystallization and Mechanical Properties of High Strain Rate Rolled Mg–Ga Alloys
journal, July 2019


History-independent cyclic response of nanotwinned metals
journal, October 2017

  • Pan, Qingsong; Zhou, Haofei; Lu, Qiuhong
  • Nature, Vol. 551, Issue 7679
  • DOI: 10.1038/nature24266

High density of genuine growth twins in electrodeposited aluminum
journal, October 2019

  • Rafailović, Lidija D.; Gammer, Christoph; Ebner, Christian
  • Science Advances, Vol. 5, Issue 10
  • DOI: 10.1126/sciadv.aax3894

Fundamentals of ultrafast laser–material interaction
journal, December 2016

  • Shugaev, Maxim V.; Wu, Chengping; Armbruster, Oskar
  • MRS Bulletin, Vol. 41, Issue 12
  • DOI: 10.1557/mrs.2016.274