System-on-chip integrated circuit technology applications on the DIII-D tokamak for multi-field measurements

Journal Article · 04 January 2022 · Journal of Instrumentation

DOI: https://doi.org/10.1088/1748-0221/17/01/c01013 · OSTI ID:2478410

Zheng, Y. ^[1]; Yu, G. Y. ^[2]; Chen, J. ^[3]; Chen, Y. ^[2]; Zhu, Y. L.  ^[2]; Domier, C. W. ^[2]; Brower, D. L. ^[3]; Luhmann, Jr., N. C. ^[2]

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1. University of California, Davis, CA (United States); University of California, Davis, CA
2. University of California, Davis, CA (United States)
3. University of California, Los Angeles, CA (United States)

Several mm-wave diagnostics on the DIII-D tokamak provide multi-scale and multi-dimensional measurements of plasma profile evolution and turbulence fluctuations. Mm-wave fusion plasma diagnostics that adopt system-on-chip integrated circuit technology can provide better space utilization, flexible installation, and improved sensitivity. In order to further extend this technology for additional fusion facilities with a higher toroidal magnetic field, V-band (55–75 GHz) and F-band (90–140 GHz) chips for Microwave Imaging Reflectometer (MIR) and Electron Cyclotron Emission Imaging (ECEI) instruments are developed and tested in the Davis Millimeter Wave Research Center (DMRC). Current measurement data show that correlation between these SoC-based diagnostic instruments with other state-of-the-art diagnostics enables co-located multi-field turbulence fluctuation measurement.

• Research Organization: University of California, Davis, CA (United States)
• Sponsoring Organization: USDOE
• Grant/Contract Number: FC02-04ER54698; FG02-01ER54615; FG02-99ER54531
• OSTI ID: 2478410
• Journal Information: Journal of Instrumentation, Journal Name: Journal of Instrumentation Journal Issue: 01 Vol. 17; ISSN 1748-0221
• Publisher: Institute of Physics (IOP)Copyright Statement
• Country of Publication: United States
• Language: English