A Multichannel Silicon Package for Large-Scale Skipper-CCD Experiments
The next generation of experiments for light-dark-matter and neutrino searches based on skipper charge-coupled devices (skipper-CCDs) introduces new challenges for the sensor packaging and readout architecture. Scaling the active mass while simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present a silicon multichip module design capable of hosting up to 16 skipper-CCDs, along with the fabrication process for the first prototypes. We thoroughly tested and characterized the assembled prototypes to build an empirical model for the video output signal of skipper-CCDs integrated into the silicon package. We then used this model in simulations to optimize the fabrication process and achieve the robust performance required for the full-scale array, which we validated through a new round of prototype fabrication. We outline the specifications selected for the ongoing production of 1500 silicon wafers that will ultimately add up to a 10-kg skipper-CCD array with 24000 readout channels.
- Research Organization:
- Argonne National Laboratory (ANL), Argonne, IL (United States); Bahia Blanca, U. Natl. Del Sur; Cordoba U.; Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- US Department of Energy
- Grant/Contract Number:
- 89243024CSC000002
- OSTI ID:
- 2474977
- Report Number(s):
- FERMILAB-PUB-24-0716-PPD; oai:inspirehep.net:2838612; arXiv:2410.06417
- Journal Information:
- IEEE Sensors J., Journal Name: IEEE Sensors J. Journal Issue: 5 Vol. 25
- Country of Publication:
- United States
- Language:
- English
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