Covalently-Bonded Laminar Assembly of Van der Waals Semiconductors with Polymers: Toward High-Performance Flexible Devices

Li, Ningxin; Jabegu, Tara; He, Rui; Yun, Seokjoon; Ghosh, Sujoy; Maraba, Diren; Olunloyo, Olugbenga; Ma, Hedi; Okmi, Aisha; Xiao, Kai; Wang, Gangli; Dong, Pei; Lei, Sidong

doi:10.1002/smll.202310175

Title: Covalently-Bonded Laminar Assembly of Van der Waals Semiconductors with Polymers: Toward High-Performance Flexible Devices

Journal Article · 24 February 2024 · Small

DOI: https://doi.org/10.1002/smll.202310175 · OSTI ID:2438854

Li, Ningxin ^[1]; Jabegu, Tara ^[1]; He, Rui ^[2]; Yun, Seokjoon ^[3]; Ghosh, Sujoy ^[3]; Maraba, Diren ^[1]; Olunloyo, Olugbenga ^[4]; Ma, Hedi ^[1]; Okmi, Aisha ^[1]; Xiao, Kai ^[3]; Wang, Gangli ^[1]; Dong, Pei ^[2];

^[1]

Georgia State Univ., Atlanta, GA (United States)
George Mason Univ., Fairfax, VA (United States)
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
Univ. of Tennessee, Knoxville, TN (United States)

Van der Waals semiconductors (vdWS) offer superior mechanical and electrical properties and are promising for flexible microelectronics when combined with polymer substrates. However, the self-passivated vdWS surfaces and their weak adhesion to polymers tend to cause interfacial sliding and wrinkling, and thus, are still challenging the reliability of vdWS-based flexible devices. Here, in this study, an effective covalent vdWS–polymer lamination method with high stretch tolerance and excellent electronic performance is reported. Using molybdenum disulfide (MoS₂) and polydimethylsiloxane (PDMS) as a case study, gold–chalcogen bonding and mercapto silane bridges are leveraged. The resulting composite structures exhibit more uniform and stronger interfacial adhesion. This enhanced coupling also enables the observation of a theoretically predicted tension-induced band structure transition in MoS₂. Moreover, no obvious degradation in the devices’ structural and electrical properties is identified after numerous mechanical cycle tests. This high-quality lamination enhances the reliability of vdWS-based flexible microelectronics, accelerating their practical applications in biomedical research and consumer electronics.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Office of Sustainable Transportation. Vehicle Technologies Office (VTO); USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division (MSE); USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities (SUF); National Science Foundation (NSF)

Grant/Contract Number:: SC0019043; AC05-00OR22725

OSTI ID:: 2438854

Journal Information:: Small, Journal Name: Small Journal Issue: 28 Vol. 21; ISSN 1613-6810

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

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Title: Covalently-Bonded Laminar Assembly of Van der Waals Semiconductors with Polymers: Toward High-Performance Flexible Devices

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