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Title: Prediction of curing kinetics of resorcinol‐added resole phenolic resins using differential scanning calorimetry for the fabrication of carbon/carbon composites

Journal Article · · Journal of Applied Polymer Science
DOI: https://doi.org/10.1002/app.52949 · OSTI ID:2418658

Phenolic resins are commonly used as carbon precursors for the fabrication of carbon/carbon composites due to their high carbon yield and aromatic nature. To decrease curing times, acid catalysts are generally used, but the addition of resorcinol was found to have a similar effect while being incorporated into the resin matrix with no contamination or corrosion issues. In this work, the curing kinetics of pure, 10, 20, and 30 wt% resorcinol-added phenolic resins were investigated through differential scanning calorimetry. Heating rates of 0.5, 1, 2.5, and 5°C min-1 were used with several curing models to predict isothermal curing. Averaged mean absolute error (MAE) for the isoconversional mathematical approaches namely Kissinger–Akahira–Sunose (MAE = 12.9 min), Flynn–Wall–Ozawa (15.8 min), and Vyazovkin (14 min) show that these methods provide the best predictions, attributed to their adoption of an activation energy that depends on the extent of cure (Ea(α)). The Kissinger method (MAE = 36 min), which depends only on peak temperature with a constant activation energy assumption, and the data noise sensitive Friedman model (MAE = 1144.7 min) provide the least accurate results. Thermogravimetric analysis revealed that resorcinol decreases the curing times by up to 71% without lowering carbon yield.

Research Organization:
Univ. of Tulsa, Tulsa, OK (United States)
Sponsoring Organization:
USDOE; USDOE Office of Energy Efficiency and Renewable Energy (EERE)
Grant/Contract Number:
EE0008736
OSTI ID:
2418658
Journal Information:
Journal of Applied Polymer Science, Journal Name: Journal of Applied Polymer Science Journal Issue: 39 Vol. 139; ISSN 0021-8995
Publisher:
WileyCopyright Statement
Country of Publication:
United States
Language:
English

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