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Title: Single-event burnout in homojunction GaN vertical PiN diodes with hybrid edge termination design

Journal Article · · Applied Physics Letters
DOI: https://doi.org/10.1063/5.0189744 · OSTI ID:2345764
ORCiD logo [1]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [3]; ORCiD logo [3]; ORCiD logo [4];  [2]; ORCiD logo [5]; ORCiD logo [2];  [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [2]; ORCiD logo [2]
  1. Vanderbilt Univ., Nashville, TN (United States); Vanderbilt University
  2. Vanderbilt Univ., Nashville, TN (United States)
  3. Naval Research Lab. (NRL), Washington, DC (United States)
  4. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  5. Univ. of Central Florida, Orlando, FL (United States)

GaN devices play a major role in modern electronics, providing high-power handling, efficient high-frequency operation, and resilience in harsh environments. However, electric field crowding at the edge of the anode often limits its full potential, leading to single-event effects (SEEs) at lower bias voltages under heavy ion radiation. Here, in this work, we report on the performance of homojunction GaN vertical PiN diodes with a hybrid edge termination design under heavy ion irradiation, specifically, oxygen ions, chlorine ions, Cf-252 fission fragments, and alpha particles from an Am-241 source. The unique hybrid edge termination (HET) design provides better electric field management, preventing breakdown from occurring at the edge of the anode at lower voltages. The results of this study reveal that these devices exhibit excellent tolerance to 12-MeV oxygen and 16-MeV chlorine ions, owing to their low linear energy transfer (LET) and range in GaN. However, single-event burnout (SEB) is observed during the Cf-252 exposure at about 50% of the diodes' electrical breakdown voltage due to the presence of higher LET and longer-range ions. Optical and scanning electron microscopy (SEM) reveal that the damage that caused by SEB lies close to the center of these devices rather than the anode edge. Devices with junction termination extension (JTE) instead of HET edge termination also show similar SEB when irradiated with Cf-252 fission fragments. Physical damage due to SEB occurs at the edge of the anode for these devices. These comparative results show the benefits of HET for enhancing the resistance of GaN-based PiN diodes to heavy ion irradiation.

Research Organization:
Vanderbilt Univ., Nashville, TN (United States); Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES); USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
FG02-09ER46554; NA0003525
OSTI ID:
2345764
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 13 Vol. 124; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

References (26)

Vertical GaN-on-GaN Schottky Diodes as α-Particle Radiation Sensors journal May 2020
Wide bandgap semiconductor-based integrated circuits journal December 2023
Radiation effects in GaN materials and devices journal January 2013
The 2018 GaN power electronics roadmap journal March 2018
Scaled Projections of Empirically Verified Hybrid Edge Terminated Vertical GaN Diodes to 20 kV conference December 2023
Growth of bulk GaN crystals journal August 2020
Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization journal April 2021
Characterization of electrically stressed power device metallization using nano-CT imaging journal August 2022
Radiation Effects in AlGaN/GaN HEMTs journal May 2022
Simulating single-event burnout of n-channel power MOSFET's journal May 1993
Impact of Anode Thickness on Breakdown Mechanisms in Vertical GaN PiN Diodes with Planar Edge Termination journal April 2022
Vertical GaN devices: Process and reliability journal November 2021
Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges journal December 2017
GaN Technology for Power Electronic Applications: A Review journal March 2016
Performance and Breakdown Characteristics of Irradiated Vertical Power GaN P-i-N Diodes journal December 2015
Analysis of neutron-induced single-event burnout in SiC power MOSFETs journal August 2015
Gallium Arsenide and Gallium Nitride Semiconductors for Power and Optoelectronics Devices Applications journal February 2023
Use of CF-252 to Determine Parameters for SEU Rate Calculation journal January 1985
Review—Opportunities in Single Event Effects in Radiation-Exposed SiC and GaN Power Electronics journal July 2021
Reliability, Applications and Challenges of GaN HEMT Technology for Modern Power Devices: A Review journal November 2022
An Updated Perspective of Single Event Gate Rupture and Single Event Burnout in Power MOSFETs journal June 2013
Low-Energy Ion-Induced Single-Event Burnout in Gallium Oxide Schottky Diodes journal April 2023
Cosmic ray investigation for the Voyager missions; energetic particle studies in the outer heliosphere?And beyond journal December 1977
Study of anode doping and avalanche in foundry compatible 1.2 kV vertical GaN PiN diodes journal November 2023
Growth and characterization of freestanding GaN substrates journal April 2002
Effects of buffer leakage current on breakdown characteristics in AlGaN/GaN HEMTs with a high-k passivation layer journal November 2015