Mechanistic modeling of copper corrosions in data center environments

Zhang, Rui; Zhang, Jianshun; Schmidt, Roger; Gilbert, Jeremy L.

doi:10.1007/s12273-023-1088-z

Title: Mechanistic modeling of copper corrosions in data center environments

Journal Article · 26 December 2023 · Building Simulation

DOI: https://doi.org/10.1007/s12273-023-1088-z · OSTI ID:2320391

Zhang, Rui ^[1]; Zhang, Jianshun ^[2]; Schmidt, Roger ^[2]; Gilbert, Jeremy L. ^[3]

Syracuse Univ., NY (United States); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Syracuse Univ., NY (United States)
Clemson Univ., SC (United States); Medical Univ. of South Carolina, Charleston, SC (United States)

Air-side economizers are increasingly used to take advantage of “free-cooling” in data centers with the intent of reducing the carbon footprint of buildings. However, they can introduce outdoor pollutants to indoor environment of data centers and cause corrosion damage to the information technology equipment. Here, to evaluate the reliability of information technology equipment under various thermal and air-pollution conditions, a mechanistic model based on multi-ion transport and chemical reactions was developed. The model was used to predict Cu corrosion caused by Cl2-containing pollutant mixtures. It also accounted for the effects of temperature (25 °C and 28 °C), relative humidity (50%, 75%, and 95%), and synergism. It also identified higher air temperature as a corrosion barrier and higher relative humidity as a corrosion accelerator, which agreed well with the experimental results. The average root mean square error of the prediction was 13.7 Å. The model can be used to evaluate the thermal guideline for data centers design and operation when Cl2 is present based on pre-established acceptable risk of corrosion in data centers’ environment.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 2320391

Journal Information:: Building Simulation, Journal Name: Building Simulation Vol. 17; ISSN 1996-3599

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

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37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
chloride pollutant mixture
copper corrosion model
data center
temperature
relative humidity
synergistic effect

Title: Mechanistic modeling of copper corrosions in data center environments

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