Interface reactions between copper and 50In-50Pb (wt%) alloy by solid-state aging

Vianco, P. T.; Kilgo, A. C.; McKenzie, B. M.; Grant, R. L.; Williams, S.

doi:10.1016/j.jalmes.2024.100066

Title: Interface reactions between copper and 50In-50Pb (wt%) alloy by solid-state aging

Journal Article · 29 February 2024 · Journal of Alloys and Metallurgical Systems

DOI: https://doi.org/10.1016/j.jalmes.2024.100066 · OSTI ID:2318600

Vianco, P. T.; Kilgo, A. C.; McKenzie, B. M.; Grant, R. L.; Williams, S.

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Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0003525

OSTI ID:: 2318600

Journal Information:: Journal of Alloys and Metallurgical Systems, Journal Name: Journal of Alloys and Metallurgical Systems Journal Issue: C Vol. 5; ISSN 2949-9178

Publisher:: ElsevierCopyright Statement

Country of Publication:: Country unknown/Code not available

Language:: English

References (17)

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Solid state intermetallic compound layer growth between copper and hot dipped indium coatings Vianco, P. T.; Kilgo, A. C.; Grant, R. Journal of Materials Science, Vol. 30, Issue 19 https://doi.org/10.1007/BF01154497	journal	October 1995
Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin Yeh, D. C.; Huntington, H. B. Physical Review Letters, Vol. 53, Issue 15 https://doi.org/10.1103/PhysRevLett.53.1469	journal	October 1984
Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper Vianco, P. T.; Kilgo, A. C.; Grant, R. Journal of Electronic Materials, Vol. 24, Issue 10 https://doi.org/10.1007/BF02655468	journal	October 1995
Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence Vianco, Paul; Rejent, Jerome; Zender, Gary Journal of Materials Research, Vol. 20, Issue 6 https://doi.org/10.1557/JMR.2005.0198	journal	June 2005
Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis Vianco, P. T.; Rejent, J. A. Journal of Electronic Materials, Vol. 28, Issue 10 https://doi.org/10.1007/s11664-999-0250-4	journal	October 1999
The In−Pb (Indium-Lead) system Nabot, J. P.; Ansara, I. Bulletin of Alloy Phase Diagrams, Vol. 8, Issue 3 https://doi.org/10.1007/BF02874916	journal	June 1987
Interdiffusion Between in Layer and Bulk Cu or Cu-In Alloy Manna, I.; Bader, S.; Gust, W. physica status solidi (a), Vol. 119, Issue 1 https://doi.org/10.1002/pssa.2211190143	journal	May 1990
Diffusion in Titanium. Nakajima, Hideo; Koiwa, Masahiro ISIJ International, Vol. 31, Issue 8 https://doi.org/10.2355/isijinternational.31.757	journal	January 1991
Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys Frear, D. R.; Vianco, P. T. Metallurgical and Materials Transactions A, Vol. 25, Issue 7 https://doi.org/10.1007/BF02665483	journal	July 1994
Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings Vianco, Paul T.; Hlava, Paul F.; Kilgo, Alice C. Journal of Electronic Materials, Vol. 23, Issue 7 https://doi.org/10.1007/BF02653343	journal	July 1994
The fast diffusion of Au in Pb McLellan, R. B.; Ko, C.; Brotzen, F. R. Acta Metallurgica et Materialia, Vol. 38, Issue 11 https://doi.org/10.1016/0956-7151(90)90083-S	journal	November 1990
The Cu−In (Copper-Indium) system Subramanian, P. R.; Laughlin, D. E. Bulletin of Alloy Phase Diagrams, Vol. 10, Issue 5 https://doi.org/10.1007/BF02882415	journal	October 1989
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates An, Tong; Qin, Fei Microelectronics Reliability, Vol. 54, Issue 5 https://doi.org/10.1016/j.microrel.2014.01.008	journal	May 2014
Numerical studies of anomalous fast diffusion in metallic alloys and semiconductors Hasnaoui, A.; Benmakhlouf, A.; Hoummada, A. Applied Surface Science, Vol. 162-163 https://doi.org/10.1016/S0169-4332(00)00177-X	journal	August 2000
Anomalously fast diffusion mechanism of solute atoms in Pb Ning, Chen; Zongsen, Yu Journal of Materials Science Letters, Vol. 14, Issue 8 https://doi.org/10.1007/BF00275375	journal	January 1995
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints Sayyadi, Reza; Naffakh-Moosavy, Homam Scientific Reports, Vol. 9, Issue 1 https://doi.org/10.1038/s41598-019-44758-3	journal	June 2019

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