Fin Design Topology Optimization for Direct Liquid Cooling of Multi-Chip Power Modules
Journal Article
·
· IEEE Transactions on Components, Packaging, and Manufacturing Technology
Not Available
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- Grant/Contract Number:
- AR0000895
- OSTI ID:
- 2311036
- Journal Information:
- IEEE Transactions on Components, Packaging, and Manufacturing Technology, Journal Name: IEEE Transactions on Components, Packaging, and Manufacturing Technology; ISSN 2156-3950
- Publisher:
- Institute of Electrical and Electronics EngineersCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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