Microscale Imaging of Thermal Conductivity Suppression at Grain Boundaries

Isotta, Eleonora; Jiang, Shizhou; Moller, Gregory; Zevalkink, Alexandra; Snyder, G. Jeffrey; Balogun, Oluwaseyi

doi:10.1002/adma.202302777

Title: Microscale Imaging of Thermal Conductivity Suppression at Grain Boundaries

Journal Article · 27 July 2023 · Advanced Materials

DOI: https://doi.org/10.1002/adma.202302777 · OSTI ID:1992974

^[1]; Jiang, Shizhou ^[2]; Moller, Gregory ^[3]; Zevalkink, Alexandra ^[4];

^[1]; Balogun, Oluwaseyi ^[5]

Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA
Department of Mechanical Engineering Northwestern University Evanston IL 60208 USA
Department of Chemical and Biomedical Engineering FAMU‐FSU College of Engineering Tallahassee FL 32310 USA
Department of Chemical Engineering and Materials Science Michigan State University East Lansing MI 48824 USA
Department of Mechanical Engineering Northwestern University Evanston IL 60208 USA, Department of Civil and Environmental Engineering Northwestern University Evanston IL 60208 USA

Abstract Grain‐boundary engineering is an effective strategy to tune the thermal conductivity of materials, leading to improved performance in thermoelectric, thermal‐barrier coatings, and thermal management applications. Despite the central importance to thermal transport, a clear understanding of how grain boundaries modulate the microscale heat flow is missing, owing to the scarcity of local investigations. Here, thermal imaging of individual grain boundaries is demonstrated in thermoelectric SnTe via spatially resolved frequency‐domain thermoreflectance. Measurements with microscale resolution reveal local suppressions in thermal conductivity at grain boundaries. Also, the grain‐boundary thermal resistance – extracted by employing a Gibbs excess approach – is found to be correlated with the grain‐boundary misorientation angle. Extracting thermal properties, including thermal boundary resistances, from microscale imaging can provide comprehensive understanding of how microstructure affects heat transport, crucially impacting the materials design of high‐performance thermal‐management and energy‐conversion devices.

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Sponsoring Organization:: USDOE

Grant/Contract Number:: NONE; SC0019252

OSTI ID:: 1992974

Alternate ID(s):: OSTI ID: 2421060; OSTI ID: 1992975

Journal Information:: Advanced Materials, Journal Name: Advanced Materials Journal Issue: 38 Vol. 35; ISSN 0935-9648

Publisher:: Wiley Blackwell (John Wiley & Sons)Copyright Statement

Country of Publication:: Germany

Language:: English

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