Title: Comparison of AlF3 thin films grown by thermal and plasma enhanced atomic layer deposition

Journal Article · · Journal of Vacuum Science and Technology A
DOI: https://doi.org/10.1116/6.0001468 · OSTI ID:1980705

Films of aluminum fluoride (AlF3) deposited by thermal and plasma enhanced atomic layer deposition (PEALD) have been compared using in situ multiwavelength ellipsometry (MWE) and monochromatic x-ray photoelectron spectroscopy (XPS). The AlF3 films were grown using cyclic exposures of trimethylaluminum, hydrogen fluoride, and H radicals from a remote H2 inductively coupled plasma. Films were characterized in situ using MWE and XPS for growth rate, film composition, and impurity incorporation. The MWE showed a growth rate of 1.1 and 0.7 Å per cycle, at 100 °C, for thermal and plasma enhanced ALD AlF3 films, respectively. Carbon incorporation was below the XPS detection limit. The plasma enhanced ALD AlF3 film showed the presence of Al-Al chemical states, in the Al 2p scans, suggesting the presence of Al-rich clusters with a concentration of 14%. The Al-rich clusters are thought to originate during the hydrogen plasma step of the PEALD process. Finally, the Al-rich clusters were not detected in thermal ALD AlF3 films using the same precursors and substrate temperature.

Research Organization:
Arizona State Univ., Tempe, AZ (United States); Energy Frontier Research Centers (EFRC) (United States). Ultra Materials for a Resilient, Smart Electricity Grid (ULTRA)
Sponsoring Organization:
National Aeronautics and Space Administration (NASA); National Science Foundation (NSF); USDOE; USDOE Office of Science (SC)
Grant/Contract Number:
SC0021230
OSTI ID:
1980705
Journal Information:
Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Journal Issue: 1 Vol. 40; ISSN 0734-2101
Publisher:
American Vacuum Society / AIPCopyright Statement
Country of Publication:
United States
Language:
English

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