SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology

Liu, Tianshi; Zhang, Hua; Isukapati, Sundar Babu; Ashik, Emran; Morgan, Adam J.; Lee, Bongmook; Sung, Woongje; Fayed, Ayman; White, Marvin H.; Agarwal, Anant K.

doi:10.1109/JEDS.2022.3150364

Title: SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology

Journal Article · 01 January 2022 · IEEE Journal of the Electron Devices Society

DOI: https://doi.org/10.1109/JEDS.2022.3150364 · OSTI ID:1845907

^[1];

^[2]; Ashik, Emran ^[3]; Morgan, Adam J. ^[2];

^[3];

^[2];

^[1]; White, Marvin H. ^[1];

^[1]

Department of Electrical &, Computer Engineering, The Ohio State University, Columbus, OH, USA
College of Nanoscale Science and Engineering, State University of New York Polytechnic Institute, Albany, NY, USA
Department of Electrical &, Computer Engineering, North Carolina State University, Raleigh, NC, USA

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Sponsoring Organization:: USDOE

Grant/Contract Number:: AR0001028

OSTI ID:: 1845907

Journal Information:: IEEE Journal of the Electron Devices Society, Journal Name: IEEE Journal of the Electron Devices Society Vol. 10; ISSN 2168-6734

Publisher:: Institute of Electrical and Electronics EngineersCopyright Statement

Country of Publication:: United States

Language:: English

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