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Title: Enhanced Surface Passivation by Atomic Layer Deposited Al2O3 for Ultraviolet Sensitive Silicon Photomultipliers

Journal Article · · IEEE Transactions on Nuclear Science
 [1];  [2]
  1. Georgia Institute of Technology, Atlanta, GA (United States); Georgia Institute of Technology
  2. Georgia Institute of Technology, Atlanta, GA (United States)

Here, we describe a superior passivation of p-type (p+) Si surface by Al2O3 thin film that is synthesized by plasma-assisted atomic layer deposition for ultraviolet sensitive silicon photomultipliers (SiPM), compared to conventional SiO2 and SiNx passivation schemes. The superiority of Al2O3 passivation is due to not only a sufficiently low interface defect density but also a high density of built-in negative charges. A 7 nm thin Al2O3 film can yield an emitter saturation current density of ~8 fA/cm2 on high sheet resistance p+ layer, compared to ~60 and ~1480 fA/cm2 for thermal SiO2 and SiNx passivation. This superior surface passivation allows the photon-generated carriers to have higher probabilities to reach the high-field region to trigger an avalanche event. In addition, Al2O3 thin film provides very low values of effective surface recombination velocity on low resistivity n-type and p-type Si surfaces, which can lead to well-passivated surface features on guard ring and trench isolation regions of SiPM. These demonstrate the potential of Al2O3 thin film passivation to improve quantum efficiency and thus photo-detection efficiency of ultraviolet sensitive SiPM with p+/n-/n/n+ structure.

Research Organization:
Georgia Institute of Technology, Atlanta, GA (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
NA0003921
OSTI ID:
1842682
Journal Information:
IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 2 Vol. 69; ISSN 0018-9499
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

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