Title: Bi-material strip based temperature sensor design and optimization through thermo-mechanical multi-physics modeling

Journal Article · · International journal of smart and nano materials

With the capability of additive manufacturing, complex structures are easily fabricated to achieve various design purposes. In this work, a bi-material strip temperature sensor with complex periodic pattern design is purposed and investigated through both the analytical modeling and multi-physics finite element analysis. Three design patterns are considered: standard, E-shape and S-shape. In the standard solid strip design, the curvature of the bi-material strip under temperature variation is in a linear relationship with the coefficient of thermal expansion (CTE) difference, but in a reciprocal relationship with the strip thickness. The curvature of the bi-material strip depends on the Young’s modulus ratio and layer thickness ratio of the two materials, but is independent of the magnitude of the materials’ Young’s modulus. Based on analytical derivation and numerical validation, the optimized design parameters can be provided. Compared to S-shape pattern design, E-shape pattern design can significantly increase the temperature sensitivity of the bi-material strip. An analytical prediction of the E-shape pattern’s temperature sensitivity is introduced and discussed. This work proves the concept that new design space becomes available with the capability of additive manufacturing, and provides the general design guideline for a bi-material strip based temperature sensor with possible design patterns.

Research Organization:
Clemson Univ., SC (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
Grant/Contract Number:
EE0007683
OSTI ID:
1841653
Journal Information:
International journal of smart and nano materials, Journal Name: International journal of smart and nano materials Journal Issue: 1 Vol. 10; ISSN 1947-5411
Publisher:
Taylor & FrancisCopyright Statement
Country of Publication:
United States
Language:
English

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