Predicting shear transmission across grain boundaries with an iterative stress relief model

Su, Yang; Han, Songyang; Eisenlohr, Philip; Crimp, Martin A.

doi:10.1016/j.actamat.2021.116992

Title: Predicting shear transmission across grain boundaries with an iterative stress relief model

Journal Article · 01 August 2021 · Acta Materialia

DOI: https://doi.org/10.1016/j.actamat.2021.116992 · OSTI ID:1818544

; Han, Songyang; Eisenlohr, Philip; Crimp, Martin A.

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Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0001525

OSTI ID:: 1818544

Journal Information:: Acta Materialia, Journal Name: Acta Materialia Journal Issue: C Vol. 215; ISSN 1359-6454

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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