The electrical sintering and fusing effects of Aerosol-Jet printed silver conductive line

He, Chao; Jin, Ning; Yu, Haoran; Lin, Jian; Ma, Chang-Qi

doi:10.1016/j.matlet.2019.03.016

Title: The electrical sintering and fusing effects of Aerosol-Jet printed silver conductive line

Journal Article · 01 July 2019 · Materials Letters

DOI: https://doi.org/10.1016/j.matlet.2019.03.016 · OSTI ID:1682445

He, Chao; Jin, Ning; Yu, Haoran;

; Ma, Chang-Qi

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Sponsoring Organization:: USDOE Office of Electricity (OE), Advanced Grid Research & Development. Power Systems Engineering Research

Grant/Contract Number:: BE2015071; 2016YFA0200700

OSTI ID:: 1682445

Journal Information:: Materials Letters, Journal Name: Materials Letters Vol. 246 Journal Issue: C; ISSN 0167-577X

Publisher:: ElsevierCopyright Statement

Country of Publication:: Netherlands

Language:: English

References (15)

A Circuits and Systems Perspective of Organic/Printed Electronics: Review, Challenges, and Contemporary and Emerging Design Approaches Chang, Joseph S.; Facchetti, Antonio F.; Reuss, Robert IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Vol. 7, Issue 1 https://doi.org/10.1109/JETCAS.2017.2673863	journal	March 2017
Conductive Nanomaterials for Printed Electronics Kamyshny, Alexander; Magdassi, Shlomo Small, Vol. 10, Issue 17 https://doi.org/10.1002/smll.201303000	journal	January 2014
Electrical sintering of nanoparticle structures Allen, Mark L.; Aronniemi, Mikko; Mattila, Tomi Nanotechnology, Vol. 19, Issue 17 https://doi.org/10.1088/0957-4484/19/17/175201	journal	March 2008
Inkjet-Printed Multi-Bit Low-Voltage Fuse-Type Write-Once-Read-Many Memory Cell Wang, Ruolin; Li, Qiaofeng; Feng, Linrun IEEE Electron Device Letters, Vol. 37, Issue 7 https://doi.org/10.1109/LED.2016.2564988	journal	July 2016
A simple technique to prevent electromigration damage in printed Ag thin wires Xu, Xiaobin; Lu, Yebo; Tang, Chengli Materials Letters, Vol. 225 https://doi.org/10.1016/j.matlet.2018.04.067	journal	August 2018
A percolative approach to investigate electromigration failure in printed Ag structures Zhao, Zhao; Mamidanna, Avinash; Lefky, Christopher Journal of Applied Physics, Vol. 120, Issue 12 https://doi.org/10.1063/1.4963755	journal	September 2016
Morphological influences on the electrical sintering process of Aerosol Jet and Ink Jet printed silver microstructures Werner, Christian; Godlinski, Dirk; Zöllmer, Volker Journal of Materials Science: Materials in Electronics, Vol. 24, Issue 11 https://doi.org/10.1007/s10854-013-1412-y	journal	August 2013
Metal aerosol jet printing for solar cell metallization Mette, A.; Richter, P. L.; Hörteis, M. Progress in Photovoltaics: Research and Applications, Vol. 15, Issue 7 https://doi.org/10.1002/pip.759	journal	January 2007
Optimization of Aerosol Jet Printing for High-Resolution, High-Aspect Ratio Silver Lines Mahajan, Ankit; Frisbie, C. Daniel; Francis, Lorraine F. ACS Applied Materials & Interfaces, Vol. 5, Issue 11 https://doi.org/10.1021/am400606y	journal	May 2013
Aerosol jet printed grid for ITO-free inverted organic solar cells Kopola, Pälvi; Zimmermann, Birger; Filipovic, Aleksander Solar Energy Materials and Solar Cells, Vol. 107 https://doi.org/10.1016/j.solmat.2012.06.042	journal	December 2012
Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects Joo, Sungchul; Baldwin, Daniel F. IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, Issue 2 https://doi.org/10.1109/TEPM.2010.2044887	journal	April 2010
Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits Clifford, Ben; Beynon, David; Phillips, Christopher Sensors and Actuators B: Chemical, Vol. 255 https://doi.org/10.1016/j.snb.2017.08.086	journal	February 2018
Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing Seifert, Tobias; Sowade, Enrico; Roscher, Frank Industrial & Engineering Chemistry Research, Vol. 54, Issue 2 https://doi.org/10.1021/ie503636c	journal	January 2015
Flexible transparent conductive films combining flexographic printed silver grids with CNT coating Mo, Lixin; Ran, Jun; Yang, Li Nanotechnology, Vol. 27, Issue 6 https://doi.org/10.1088/0957-4484/27/6/065202	journal	January 2016
Current-crowding-induced electromigration failure in flip chip solder joints Yeh, Everett C. C.; Choi, W. J.; Tu, K. N. Applied Physics Letters, Vol. 80, Issue 4 https://doi.org/10.1063/1.1432443	journal	January 2002

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