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Title: Self-assembly for electronics

Journal Article · · MRS Bulletin
 [1];  [2];  [2];  [3];  [4];  [4]
  1. Univ. of Pennsylvania, Philadelphia, PA (United States)
  2. Seoul National Univ. (South Korea). Center for Nanoparticle Research of the Inst. for Basic Science
  3. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
  4. Stanford Univ., CA (United States)

Self-assembly, a process in which molecules, polymers, and particles are driven by local interactions to organize into patterns and functional structures, is being exploited in advancing silicon electronics and in emerging, unconventional electronics. Additionally, silicon electronics has relied on lithographic patterning of polymer resists at progressively smaller lengths to scale down device dimensions. Yet, this has become increasingly difficult and costly. Assembly of block copolymers and colloidal nanoparticles allows resolution enhancement and the definition of essential shapes to pattern circuits and memory devices. As we look to a future in which electronics are integrated at large numbers and in new forms for the Internet of Things and wearable and implantable technologies, we also explore a broader material set. Semiconductor nanoparticles and biomolecules are prized for their size-, shape-, and composition-dependent properties and for their solution-based assembly and integration into devices that are enabling unconventional manufacturing and new device functions.

Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC02-05CH11231
OSTI ID:
1671767
Journal Information:
MRS Bulletin, Vol. 45, Issue 10; ISSN 0883-7694
Publisher:
Materials Research SocietyCopyright Statement
Country of Publication:
United States
Language:
English

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