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Title: Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation

Authors:
; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1671164
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
International Journal of Heat and Mass Transfer
Additional Journal Information:
Journal Name: International Journal of Heat and Mass Transfer Journal Volume: 164 Journal Issue: C; Journal ID: ISSN 0017-9310
Publisher:
Elsevier
Country of Publication:
United Kingdom
Language:
English

Citation Formats

Feng, Tianli, Rai, Amit, Hun, Diana, and Shrestha, Som S. Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation. United Kingdom: N. p., 2021. Web. doi:10.1016/j.ijheatmasstransfer.2020.120459.
Feng, Tianli, Rai, Amit, Hun, Diana, & Shrestha, Som S. Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation. United Kingdom. doi:10.1016/j.ijheatmasstransfer.2020.120459.
Feng, Tianli, Rai, Amit, Hun, Diana, and Shrestha, Som S. Fri . "Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation". United Kingdom. doi:10.1016/j.ijheatmasstransfer.2020.120459.
@article{osti_1671164,
title = {Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation},
author = {Feng, Tianli and Rai, Amit and Hun, Diana and Shrestha, Som S.},
abstractNote = {},
doi = {10.1016/j.ijheatmasstransfer.2020.120459},
journal = {International Journal of Heat and Mass Transfer},
number = C,
volume = 164,
place = {United Kingdom},
year = {2021},
month = {1}
}

Journal Article:
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This content will become publicly available on October 8, 2021
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