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Title: Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Abstract

The need for high-energy batteries has driven the development of binder-free electrode architectures. However, the weak bonding between the electrode particles and the current collector cannot withstand the severe volume change of active materials upon battery cycling, which largely limit the large-scale application of such electrodes. Using tin nanoarrays electrochemically deposited on copper substrate as an example, here we demonstrate a strategy of strengthening the connection between electrode and current collector by thermally alloying tin and copper at their interface. The locally formed tin-copper alloys are electron-conductive and meanwhile electrochemically inactive, working as an ideal "glue" robustly bridging tin and copper to survive harsh cycling conditions in sodium ion batteries. The working mechanism of the alloy "glue" is further characterized through a combination of electrochemical impedance spectroscopy, atomic structural analysis and in situ X-ray diffraction, presenting itself as a promising strategy for engineering binder-free electrode with endurable performance. The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.

Authors:
ORCiD logo [1];  [1]; ORCiD logo [2];  [1];  [3];  [4];  [4]; ORCiD logo [4]; ORCiD logo [4]; ORCiD logo [5]; ORCiD logo [4];  [1]
+ Show Author Affiliations
  1. Soochow Univ., Suzhou (China)
  2. Argonne National Lab. (ANL), Argonne, IL (United States); Univ. of Illinois, Chicago, IL (United States)
  3. Tianjin Univ. (China)
  4. Argonne National Lab. (ANL), Argonne, IL (United States)
  5. Univ. of Illinois, Chicago, IL (United States)
Publication Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division; National Natural Science Foundation of China (NSFC); Jiangsu Natural Science Foundation; Key University Science Research Project of Jiangsu Province; National Science Foundation (NSF)
OSTI Identifier:
1670200
Grant/Contract Number:  
AC02-06CH11357; 51872192; 51672182; 51772197; BK20180002; 19KJA170001; 17KJA430013; DMR-1809439
Resource Type:
Accepted Manuscript
Journal Name:
Nature Communications
Additional Journal Information:
Journal Volume: 11; Journal Issue: 1; Journal ID: ISSN 2041-1723
Publisher:
Nature Publishing Group
Country of Publication:
United States
Language:
English
Subject:
25 ENERGY STORAGE; Ti nano-array; nanoglue; sodium-ion battery; volume swelling

Citation Formats

Ni, Jiangfeng, Zhu, Xiaocui, Yuan, Yifei, Wang, Zhenzhu, Li, Yingbo, Ma, Lu, Dai, Alvin, Li, Matthew, Wu, Tianpin, Shahbazian-Yassar, Reza, Lu, Jun, and Li, Liang. Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage. United States: N. p., 2020. Web. doi:10.1038/s41467-020-15045-x.
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Ni, Jiangfeng, Zhu, Xiaocui, Yuan, Yifei, Wang, Zhenzhu, Li, Yingbo, Ma, Lu, Dai, Alvin, Li, Matthew, Wu, Tianpin, Shahbazian-Yassar, Reza, Lu, Jun, & Li, Liang. Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage. United States. https://doi.org/10.1038/s41467-020-15045-x
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Ni, Jiangfeng, Zhu, Xiaocui, Yuan, Yifei, Wang, Zhenzhu, Li, Yingbo, Ma, Lu, Dai, Alvin, Li, Matthew, Wu, Tianpin, Shahbazian-Yassar, Reza, Lu, Jun, and Li, Liang. Thu . "Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage". United States. https://doi.org/10.1038/s41467-020-15045-x. https://www.osti.gov/servlets/purl/1670200.
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@article{osti_1670200,
title = {Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage},
author = {Ni, Jiangfeng and Zhu, Xiaocui and Yuan, Yifei and Wang, Zhenzhu and Li, Yingbo and Ma, Lu and Dai, Alvin and Li, Matthew and Wu, Tianpin and Shahbazian-Yassar, Reza and Lu, Jun and Li, Liang},
abstractNote = {The need for high-energy batteries has driven the development of binder-free electrode architectures. However, the weak bonding between the electrode particles and the current collector cannot withstand the severe volume change of active materials upon battery cycling, which largely limit the large-scale application of such electrodes. Using tin nanoarrays electrochemically deposited on copper substrate as an example, here we demonstrate a strategy of strengthening the connection between electrode and current collector by thermally alloying tin and copper at their interface. The locally formed tin-copper alloys are electron-conductive and meanwhile electrochemically inactive, working as an ideal "glue" robustly bridging tin and copper to survive harsh cycling conditions in sodium ion batteries. The working mechanism of the alloy "glue" is further characterized through a combination of electrochemical impedance spectroscopy, atomic structural analysis and in situ X-ray diffraction, presenting itself as a promising strategy for engineering binder-free electrode with endurable performance. The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.},
doi = {10.1038/s41467-020-15045-x},
journal = {Nature Communications},
number = 1,
volume = 11,
place = {United States},
year = {2020},
month = {3}
}
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Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1038/s41467-020-15045-x
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Figures / Tables:

Figure 1 Figure 1: Synthesis, morphology and structure analyses of SnNA. (a) Schematic illustration of electrochemical synthesis process. SEM images of (b) top view and (c) side view. (d-g) Elemental mapping of energy dispersive X-ray spectroscopy reveals the diffusion of Cu throughout the nanowall. e is for Cu, f is for Sn,more » and g is for Cu and Sn. (h) Low-mag STEM-HAADF image of one SnNA. (i, j) EDS mapping of Cu (green) and Sn (yellow). (k) STEM-ABF image of the Cu6Sn5 atomic structure viewed along the zone axis of [-1 5 8]. (l) STEM-ABF image of the Sn atomic structure viewed along the zone axis of [0 0 1]. In (k, l), the line profiles are given and compared in the insets to highlight the presence of Cu columns in Cu6Sn5. Atomic models matching each experimental observation are also given in the right bottom insets with yellow sphere for Sn and green sphere for Cu. Scale bar: (b) 1 μm, (c-g) 2 μm, (h) 1 μm, (k, l) 1 nm.« less
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