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Title: Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Journal Article · · Nature Communications

The need for high-energy batteries has driven the development of binder-free electrode architectures. However, the weak bonding between the electrode particles and the current collector cannot withstand the severe volume change of active materials upon battery cycling, which largely limit the large-scale application of such electrodes. Using tin nanoarrays electrochemically deposited on copper substrate as an example, here we demonstrate a strategy of strengthening the connection between electrode and current collector by thermally alloying tin and copper at their interface. The locally formed tin-copper alloys are electron-conductive and meanwhile electrochemically inactive, working as an ideal "glue" robustly bridging tin and copper to survive harsh cycling conditions in sodium ion batteries. The working mechanism of the alloy "glue" is further characterized through a combination of electrochemical impedance spectroscopy, atomic structural analysis and in situ X-ray diffraction, presenting itself as a promising strategy for engineering binder-free electrode with endurable performance. The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division; National Natural Science Foundation of China (NSFC); Jiangsu Natural Science Foundation; Key University Science Research Project of Jiangsu Province; National Science Foundation (NSF)
Grant/Contract Number:
AC02-06CH11357; 51872192; 51672182; 51772197; BK20180002; 19KJA170001; 17KJA430013; DMR-1809439
OSTI ID:
1670200
Journal Information:
Nature Communications, Vol. 11, Issue 1; ISSN 2041-1723
Publisher:
Nature Publishing GroupCopyright Statement
Country of Publication:
United States
Language:
English

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Figures / Tables (5)