Title: Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Abstract

Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject to high mechanical stress due to coefficient of thermal expansion mismatch between the copper and the ceramic. For wide-bandgap (WBG) devices, it is of interest exploring new substrate technologies that can overcome some of the challenges of direct bonded copper substrates. In this technical paper, the design, analysis, and comparison of insulated metal substrates (IMSs) for high-power wide-bandgap semiconductor-based power modules are discussed. This paper starts with technical description and discussion of state-of-the-art DBC substrates with different ceramic insulators such as aluminum nitride (AlN), Al₂O₃, and Si₃N₄. Next, an introduction of IMSs and their material properties, and a design approach for SiC (silicon carbide) metal-oxide-semiconductor field-effect transistor (MOSFET)-based power modules for high-power applications is provided. The influence of dielectric thickness on the power handling capability of the substrate are also discussed. The designed IMS and DBC substrates were characterized in terms of steady-state and transient thermal performance using finite element simulation. Finally, the performance of the IMS and DBC are validated in an experimental setup under different loading andmore » cooling temperature conditions. We report the simulation and experimental results showed that the IMS can provide high steady-state thermal performance for high-power modules based on SiC MOSFETs. Furthermore, the IMS provided enhanced transient thermal performance, which provided a reduced junction temperature when the module is operated at low fundamental output frequencies in traction drive systems.« less

Authors:

Gurpinar, Emre  ^[1];

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• Search DOE PAGES for ORCID "0000-0002-2763-7218"

Ozpineci, Burak  ^[1];

• Search DOE PAGES for author "Ozpineci, Burak"
• Search DOE PAGES for ORCID "0000-0002-1672-3348"

Chowdhury, Shajjad ^[1]

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+ Show Author Affiliations

1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Publication Date:

Fri Jun 26 00:00:00 EDT 2020

Research Org.:

Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Sponsoring Org.:

USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office

OSTI Identifier:

1649170

Grant/Contract Number:  

AC05-00OR22725

Resource Type:

Accepted Manuscript

Journal Name:

Journal of Electronic Packaging

Additional Journal Information:

Journal Volume: 142; Journal Issue: 4; Journal ID: ISSN 1043-7398

Publisher:

ASME

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING; Design; Energy gap; Heat; Junctions; Metals; MOSFET transistors; Steady state; Temperature; Thermal analysis; Transients (Dynamics); Copper; Stress; Coolants; Simulation; Thermal resistance; Finite element analysis; Semiconductors (Materials); Bridges (Structures); Ceramics