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Title: Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source

Authors:
 [1];  [1];  [1];  [1];  [1]
  1. Department of Nuclear, Plasma, and Radiological Engineering, Center for Plasma-Material Interactions, University of Illinois at Urbana-Champaign, 216 Talbot Lab, 104 S. Wright St., Urbana, Illinois 61801
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1648600
Grant/Contract Number:  
DEFG02-07ER46453; FG02-07ER46471
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology B
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology B Journal Volume: 38 Journal Issue: 5; Journal ID: ISSN 2166-2746
Publisher:
American Vacuum Society
Country of Publication:
United States
Language:
English

Citation Formats

Qerimi, Dren, Panici, Gianluca, Jain, Arihant, Jacobson, Daniel, and Ruzic, David N. Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source. United States: N. p., 2020. Web. https://doi.org/10.1116/6.0000200.
Qerimi, Dren, Panici, Gianluca, Jain, Arihant, Jacobson, Daniel, & Ruzic, David N. Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source. United States. https://doi.org/10.1116/6.0000200
Qerimi, Dren, Panici, Gianluca, Jain, Arihant, Jacobson, Daniel, and Ruzic, David N. Tue . "Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source". United States. https://doi.org/10.1116/6.0000200.
@article{osti_1648600,
title = {Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source},
author = {Qerimi, Dren and Panici, Gianluca and Jain, Arihant and Jacobson, Daniel and Ruzic, David N.},
abstractNote = {},
doi = {10.1116/6.0000200},
journal = {Journal of Vacuum Science and Technology B},
number = 5,
volume = 38,
place = {United States},
year = {2020},
month = {9}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on August 21, 2021
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