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Title: Predicting strength distributions of MEMS structures using flaw size and spatial density

Abstract

The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.

Authors:
ORCiD logo [1]; ORCiD logo [2];  [3]
  1. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Material Measurement Laboratory
  2. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Applied Chemicals and Materials Division
  3. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Materials Science and Engineering Center
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1624021
Grant/Contract Number:  
NA0003525
Resource Type:
Accepted Manuscript
Journal Name:
Microsystems & Nanoengineering (Online)
Additional Journal Information:
Journal Name: Microsystems & Nanoengineering (Online); Journal Volume: 5; Journal Issue: 1; Journal ID: ISSN 2055-7434
Publisher:
Springer Nature
Country of Publication:
United States
Language:
English
Subject:
Science & Technology - Other Topics; Instruments & Instrumentation

Citation Formats

Cook, Robert F., DelRio, Frank W., and Boyce, Brad L.. Predicting strength distributions of MEMS structures using flaw size and spatial density. United States: N. p., 2019. Web. https://doi.org/10.1038/s41378-019-0093-y.
Cook, Robert F., DelRio, Frank W., & Boyce, Brad L.. Predicting strength distributions of MEMS structures using flaw size and spatial density. United States. https://doi.org/10.1038/s41378-019-0093-y
Cook, Robert F., DelRio, Frank W., and Boyce, Brad L.. Mon . "Predicting strength distributions of MEMS structures using flaw size and spatial density". United States. https://doi.org/10.1038/s41378-019-0093-y. https://www.osti.gov/servlets/purl/1624021.
@article{osti_1624021,
title = {Predicting strength distributions of MEMS structures using flaw size and spatial density},
author = {Cook, Robert F. and DelRio, Frank W. and Boyce, Brad L.},
abstractNote = {The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.},
doi = {10.1038/s41378-019-0093-y},
journal = {Microsystems & Nanoengineering (Online)},
number = 1,
volume = 5,
place = {United States},
year = {2019},
month = {11}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Table 1 Table 1: MEMS polysilicon specimens and dimensions

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    Works referencing / citing this record:

    Effects of nano‐grain structures and surface defects on fracture of micro‐scaled polysilicon components
    journal, February 2020

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      Figures/Tables have been extracted from DOE-funded journal article accepted manuscripts.