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Title: Predicting strength distributions of MEMS structures using flaw size and spatial density

Abstract

The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.

Authors:
ORCiD logo [1]; ORCiD logo [2];  [3]
+ Show Author Affiliations
  1. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Material Measurement Laboratory
  2. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Applied Chemicals and Materials Division
  3. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Materials Science and Engineering Center
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1624021
Alternate Identifier(s):
OSTI ID: 1870472
Report Number(s):
SAND2022-3867J
Journal ID: ISSN 2055-7434; PII: 93
Grant/Contract Number:  
NA0003525
Resource Type:
Accepted Manuscript
Journal Name:
Microsystems & Nanoengineering (Online)
Additional Journal Information:
Journal Name: Microsystems & Nanoengineering (Online); Journal Volume: 5; Journal Issue: 1; Journal ID: ISSN 2055-7434
Publisher:
Springer Nature
Country of Publication:
United States
Language:
English
Subject:
Science & Technology - Other Topics; Instruments & Instrumentation

Citation Formats

Cook, Robert F., DelRio, Frank W., and Boyce, Brad L.. Predicting strength distributions of MEMS structures using flaw size and spatial density. United States: N. p., 2019. Web. doi:10.1038/s41378-019-0093-y.
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Cook, Robert F., DelRio, Frank W., & Boyce, Brad L.. Predicting strength distributions of MEMS structures using flaw size and spatial density. United States. https://doi.org/10.1038/s41378-019-0093-y
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Cook, Robert F., DelRio, Frank W., and Boyce, Brad L.. Mon . "Predicting strength distributions of MEMS structures using flaw size and spatial density". United States. https://doi.org/10.1038/s41378-019-0093-y. https://www.osti.gov/servlets/purl/1624021.
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@article{osti_1624021,
title = {Predicting strength distributions of MEMS structures using flaw size and spatial density},
author = {Cook, Robert F. and DelRio, Frank W. and Boyce, Brad L.},
abstractNote = {The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.},
doi = {10.1038/s41378-019-0093-y},
journal = {Microsystems & Nanoengineering (Online)},
number = 1,
volume = 5,
place = {United States},
year = {2019},
month = {11}
}
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Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1038/s41378-019-0093-y
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Figures / Tables:

Table 1 Table 1: MEMS polysilicon specimens and dimensions
All figures and tables (8 total)
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Works referenced in this record:

An argument for proof testing brittle microsystems in high-reliability applications
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Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS
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Crystal orientation-dependent fatigue characteristics in micrometer-sized single-crystal silicon
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Size and Frequency of Defects in Silicon MEMS
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  • Lavan, David A.; Boyce, B. L.; Buchheit, T. E.
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Mechanical Characterization of Polysilicon Through On-Chip Tensile Tests
journal, April 2004

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Controlling and Testing the Fracture Strength of Silicon on the Mesoscale
journal, June 2000

Strength Distributions in Polycrystalline Silicon MEMS
journal, April 2007

  • Boyce, Brad L.; Grazier, J. Mark; Buchheit, Thomas E.
  • Journal of Microelectromechanical Systems, Vol. 16, Issue 2
  • DOI: 10.1109/JMEMS.2007.892794

Predicting Fracture in Micrometer-Scale Polycrystalline Silicon MEMS Structures
journal, August 2011

  • Reedy, E. David; Boyce, Brad L.; Foulk, James W.
  • Journal of Microelectromechanical Systems, Vol. 20, Issue 4
  • DOI: 10.1109/JMEMS.2011.2153824

Strength distribution of single-crystal silicon theta-like specimens
journal, August 2010

Etching Process Effects on Surface Structure, Fracture Strength, and Reliability of Single-Crystal Silicon Theta-Like Specimens
journal, June 2013

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  • Journal of Microelectromechanical Systems, Vol. 22, Issue 3
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Validated Prediction of the Strength Size Effect in Polycrystalline Silicon Using the Three-Parameter Weibull Function
journal, September 2014

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On-chip fracture testing of freestanding nanoscale materials
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journal, June 2015

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  • Applied Physics Reviews, Vol. 2, Issue 2
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Material Flaw Populations and Component Strength Distributions in the Context of the Weibull Function
journal, August 2018

Determination of ceramic flaw populations from component strengths
journal, February 2019

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  • Journal of the American Ceramic Society, Vol. 102, Issue 8
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Stronger silicon for microsystems
journal, January 2010

Statistical determination of surface flaw distributions in brittle materials
journal, January 1995

Size Effects and Stochastic Behavior of Nanoindentation Pop In
journal, April 2011

Scale effects in convoluted thermal/spatial statistics of plasticity initiation in small stressed volumes during nanoindentation
journal, October 2012

Strength statistics of single crystals and metallic glasses under small stressed volumes
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Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures
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A first passage based model for probabilistic fracture of polycrystalline silicon MEMS structures
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Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM
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Size and Frequency of Defects in Silicon MEMS
conference, June 2008

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Material Flaw Populations and Component Strength Distributions in the Context of the Weibull Function
journal, August 2018

Stronger silicon for microsystems
journal, January 2010

On-chip fracture testing of freestanding nanoscale materials
journal, December 2015

A first passage based model for probabilistic fracture of polycrystalline silicon MEMS structures
journal, February 2017

Strength statistics of single crystals and metallic glasses under small stressed volumes
journal, September 2016

Strength distribution of single-crystal silicon theta-like specimens
journal, August 2010

The mechanical strength of polysilicon films: Part 1. The influence of fabrication governed surface conditions
journal, August 2003

Crystal orientation-dependent fatigue characteristics in micrometer-sized single-crystal silicon
journal, July 2016

Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures
journal, April 1999

  • Suwito, Wan; Dunn, Martin L.; Cunningham, Shawn J.
  • Journal of Applied Physics, Vol. 85, Issue 7
  • DOI: 10.1063/1.369711

Controlling and Testing the Fracture Strength of Silicon on the Mesoscale
journal, June 2000

Validated Prediction of the Strength Size Effect in Polycrystalline Silicon Using the Three-Parameter Weibull Function
journal, September 2014

  • Saleh, Mohamed E.; Beuth, Jack L.; de Boer, Maarten P.
  • Journal of the American Ceramic Society, Vol. 97, Issue 12
  • DOI: 10.1111/jace.13226

Determination of ceramic flaw populations from component strengths
journal, February 2019

  • Cook, Robert F.; DelRio, Frank W.
  • Journal of the American Ceramic Society, Vol. 102, Issue 8
  • DOI: 10.1111/jace.16262

Size and Frequency of Defects in Silicon MEMS
journal, October 2003

  • Lavan, David A.; Boyce, B. L.; Buchheit, T. E.
  • International Journal of Damage Mechanics, Vol. 12, Issue 4
  • DOI: 10.1177/105678903036226
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    Works referencing / citing this record:

    Effects of nano‐grain structures and surface defects on fracture of micro‐scaled polysilicon components
    journal, February 2020

    • Xu, Ran; Hu, Xiaozhi
    • Journal of the American Ceramic Society, Vol. 103, Issue 6
    • DOI: 10.1111/jace.17032
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      Figures / Tables found in this record:

      Table 1 (p. 2)table
      Fig. 1 (p. 3)figure
      Fig. 2 (p. 4)figure
      Fig. 3 (p. 6)figure
      Table 2 (p. 6)table
      Fig. 4 (p. 7)figure
      Fig. 5 (p. 8)figure
      Fig. 6 (p. 9)figure
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