Highly Effective GeNi Alloy Contact Diffusion Barrier for BiSbTe Long-Term Thermal Exposure

Song, Erdong; Swartzentruber, Brian S.; Koripella, Chowdary R.; Martinez, Julio A.

doi:10.1021/acsomega.9b00551

Title: Highly Effective GeNi Alloy Contact Diffusion Barrier for BiSbTe Long-Term Thermal Exposure

Journal Article · 28 May 2019 · ACS Omega

DOI: https://doi.org/10.1021/acsomega.9b00551 · OSTI ID:1618093

Song, Erdong ^[1]; Swartzentruber, Brian S. ^[2]; Koripella, Chowdary R. ^[2];

^[3]

New Mexico State Univ., Las Cruces, NM (United States)
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
City Univ. of New York (CUNY), Bronx, NY (United States)

A GeNi alloy diffusion barrier for contacts on bismuth antimony telluride is proposed. Multiple gold contact diffusion barriers were tested at different thermal aging conditions in air and reducing atmospheres. Among all diffusion barriers, the GeNi alloy barrier shows the best performance for bulk samples with no substantial degradation of the contact resistance, no contact color change, and no change of thermoelectric properties. We observed D_Au–GeNi = (9.8 ± 2.7) × 10^–20 m²/s within the GeNi alloy barrier, which is 4 times smaller than D_Au–BiSbTe. The presence of the initial Ge layer also proves to be effective in reducing nickel diffusion yielding D_Ni–BiSbTe = (8.57 ± 0.49) × 10^–19 m²/s. During GeNi alloy formation, Ge diffusion into BiSbTe produces GeTe, which apparently blocks the van der Waals gaps eliminating Au and Ni fast diffusion pathways. Thermal aging of BiSbTe nanowires shows that Au and Ni diffusion degrades the thermoelectric power factor, whereas the GeNi alloy barrier sample is mostly preserved. The GeNi alloy barrier is a reliable solution to long-term thermal applications of BiTe-based materials.

View Accepted Manuscript (DOE)

Cite

Export

Save

Research Organization:: Sandia National Laboratories (SNL-CA), Livermore, CA (United States); Sandia National Laboratories, Albuquerque, NM

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: AC04-94AL85000; NA0003525

OSTI ID:: 1618093

Report Number(s):: SAND--2019-1645J; {"Journal ID: ISSN 2470-1343",672587}

Journal Information:: ACS Omega, Journal Name: ACS Omega Journal Issue: 5 Vol. 4; ISSN 2470-1343

Publisher:: American Chemical Society (ACS)Copyright Statement

Country of Publication:: United States

Language:: English

References (82)

Enhancement of Thermoelectric Figure of Merit for Bi0.5Sb1.5Te3 by Metal Nanoparticle Decoration Lee, Kyu-Hyoung; Kim, Hyun-Sik; Kim, Sang-Il Journal of Electronic Materials, Vol. 41, Issue 6 https://doi.org/10.1007/s11664-012-1913-0	journal	February 2012
Energetics and diffusion of gold in bismuth telluride-based thermoelectric compounds Shaughnessy, M. C.; Bartelt, N. C.; Zimmerman, J. A. Journal of Applied Physics, Vol. 115, Issue 6 https://doi.org/10.1063/1.4865735	journal	February 2014
Anisotropic diffusion of copper into bismuth telluride Carlson, R. O. Journal of Physics and Chemistry of Solids, Vol. 13, Issue 1-2 https://doi.org/10.1016/0022-3697(60)90127-x	journal	May 1960
Metallurgical and electrical properties of alloyed Ni/AuGe films on n-type GaAs Robinson, G. Y. Solid-State Electronics, Vol. 18, Issue 4 https://doi.org/10.1016/0038-1101(75)90088-x	journal	April 1975
Formation and Thermal Stability of Nickel Germanide on Germanium Substrate Zhang, Qingchun; Wu, Nan; Osipowicz, Thomas Japanese Journal of Applied Physics, Vol. 44, Issue 10L https://doi.org/10.1143/jjap.44.l1389	journal	October 2005
Electrical transport characteristics of Au/n-GaAs Schottky diodes on n-Ge at low temperatures Hudait, M. K.; Venkateswarlu, P.; Krupanidhi, S. B. Solid-State Electronics, Vol. 45, Issue 1 https://doi.org/10.1016/s0038-1101(00)00230-6	journal	January 2001
Electronic structure and thermoelectric properties of bismuth telluride and bismuth selenide Mishra, S. K.; Satpathy, S.; Jepsen, O. Journal of Physics: Condensed Matter, Vol. 9, Issue 2 https://doi.org/10.1088/0953-8984/9/2/014	journal	January 1997
The Ge−Ni (Germanium-Nickel) system Nash, A.; Nash, P. Bulletin of Alloy Phase Diagrams, Vol. 8, Issue 3 https://doi.org/10.1007/bf02874917	journal	June 1987
Thermal annealing behaviour of platinum, nickel and titanium Schottky barrier diodes on n-Ge (100) Chawanda, A.; Nyamhere, C.; Auret, F. D. Journal of Alloys and Compounds, Vol. 492, Issue 1-2 https://doi.org/10.1016/j.jallcom.2009.11.202	journal	March 2010
Metastability of Au−Ge Liquid Nanocatalysts: Ge Vapor–Liquid–Solid Nanowire Growth Far below the Bulk Eutectic Temperature Adhikari, Hemant; Marshall, Ann F.; Goldthorpe, Irene A. ACS Nano, Vol. 1, Issue 5 https://doi.org/10.1021/nn7001486	journal	December 2007
Bismuth telluride nanotubes and the effects on the thermoelectric properties of nanotube-containing nanocomposites Zhao, X. B.; Ji, X. H.; Zhang, Y. H. Applied Physics Letters, Vol. 86, Issue 6 https://doi.org/10.1063/1.1863440	journal	February 2005
Thermoelectric transport in Bi 2 Te 3 /Sb 2 Te 3 superlattices Hinsche, N. F.; Yavorsky, B. Yu.; Gradhand, M. Physical Review B, Vol. 86, Issue 8 https://doi.org/10.1103/physrevb.86.085323	journal	August 2012
Metastability of Au−Ge Liquid Nanocatalysts: Ge Vapor–Liquid–Solid Nanowire Growth Far below the Bulk Eutectic Temperature Adhikari, Hemant; Marshall, Ann F.; Goldthorpe, Irene A. ACS Nano, Vol. 1, Issue 5 https://doi.org/10.1021/nn7001486	journal	December 2007
Large bulk resistivity and surface quantum oscillations in the topological insulator Bi2Te2Se Ren, Zhi; Taskin, A. A.; Sasaki, Satoshi arXiv https://doi.org/10.48550/arxiv.1011.2846	text	January 2010
Diffusion and Solid Solubility of Gold in Single‐Crystal Bismuth Telluride Keys, J. D.; Dutton, H. M. Journal of Applied Physics, Vol. 34, Issue 6 https://doi.org/10.1063/1.1702694	journal	June 1963
Energetics and diffusion of gold in bismuth telluride-based thermoelectric compounds Shaughnessy, M. C.; Bartelt, N. C.; Zimmerman, J. A. Journal of Applied Physics, Vol. 115, Issue 6 https://doi.org/10.1063/1.4865735	journal	February 2014
Germanium Nanowire Growth Below the Eutectic Temperature Kodambaka, S.; Tersoff, J.; Reuter, M. C. Science, Vol. 316, Issue 5825 https://doi.org/10.1126/science.1139105	journal	May 2007
High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys Poudel, B.; Hao, Q.; Ma, Y. Science, Vol. 320, Issue 5876, p. 634-638 https://doi.org/10.1126/science.1156446	journal	May 2008
Ohmic contacts to n-type germanium with low specific contact resistivity Gallacher, K.; Velha, P.; Paul, D. J. Applied Physics Letters, Vol. 100, Issue 2 https://doi.org/10.1063/1.3676667	journal	January 2012
Determination of Contact Resistivity by the Cox and Strack Method for Metal Contacts to Bulk Bismuth Antimony Telluride Gupta, R. P.; White, J. B.; Iyore, O. D. Electrochemical and Solid-State Letters, Vol. 12, Issue 8 https://doi.org/10.1149/1.3143918	journal	January 2009
Diffusion and solubility of copper, silver, and gold in germanium Bracht, H.; Stolwijk, N. A.; Mehrer, H. Physical Review B, Vol. 43, Issue 18 https://doi.org/10.1103/physrevb.43.14465	journal	June 1991
Electronic structure and thermoelectric properties of bismuth telluride and bismuth selenide Mishra, S. K.; Satpathy, S.; Jepsen, O. Journal of Physics: Condensed Matter, Vol. 9, Issue 2 https://doi.org/10.1088/0953-8984/9/2/014	journal	January 1997
Fabrication of Nanostructured Thermoelectric Bismuth Telluride Thick Films by Electrochemical Deposition Li, Shanghua; Toprak, Muhammet S.; Soliman, Hesham M. A. Chemistry of Materials, Vol. 18, Issue 16 https://doi.org/10.1021/cm060171o	journal	July 2006
Thermodynamic evaluation of the Germanium — Tellurium system Schlieper, A.; Feutelais, Y.; Fries, S. G. Calphad, Vol. 23, Issue 1 https://doi.org/10.1016/s0364-5916(99)00012-7	journal	March 1999
Fabrication of Nanostructured Thermoelectric Bismuth Telluride Thick Films by Electrochemical Deposition Li, Shanghua; Toprak, Muhammet S.; Soliman, Hesham M. A. Chemistry of Materials, Vol. 18, Issue 16 https://doi.org/10.1021/cm060171o	journal	July 2006
Electrical transport characteristics of Au/n-GaAs Schottky diodes on n-Ge at low temperatures Hudait, M. K.; Venkateswarlu, P.; Krupanidhi, S. B. Solid-State Electronics, Vol. 45, Issue 1 https://doi.org/10.1016/s0038-1101(00)00230-6	journal	January 2001
Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper Liao, Chien-Neng; Lee, Ching-Hua; Chen, Wen-Jin Electrochemical and Solid-State Letters, Vol. 10, Issue 9 https://doi.org/10.1149/1.2749330	journal	January 2007
Colloquium: Topological insulators Hasan, M. Z.; Kane, C. L. Reviews of Modern Physics, Vol. 82, Issue 4, p. 3045-3067 https://doi.org/10.1103/revmodphys.82.3045	journal	November 2010
Real Structure and Thermoelectric Properties of GeTe-Rich Germanium Antimony Tellurides Rosenthal, Tobias; Schneider, Matthias N.; Stiewe, Christian Chemistry of Materials, Vol. 23, Issue 19 https://doi.org/10.1021/cm201717z	journal	October 2011
Diffusion at interfaces of micro thermoelectric devices Bae, Nam-Ho; Han, Seungwoo; Lee, Kwang Eun Current Applied Physics, Vol. 11, Issue 5 https://doi.org/10.1016/j.cap.2011.05.036	journal	September 2011
Effect of metal electrode on thermoelectric power in bismuth telluride compounds Yamashita, O.; Odahara, H.; Tomiyoshi, S. Journal of Materials Science, Vol. 39, Issue 18 https://doi.org/10.1023/b:jmsc.0000040072.92877.cd	journal	September 2004
Germanium Nanowire Growth Below the Eutectic Temperature Kodambaka, S.; Tersoff, J.; Reuter, M. C. Science, Vol. 316, Issue 5825 https://doi.org/10.1126/science.1139105	journal	May 2007
Large bulk resistivity and surface quantum oscillations in the topological insulator Bi 2 Te 2 Se Ren, Zhi; Taskin, A. A.; Sasaki, Satoshi Physical Review B, Vol. 82, Issue 24 https://doi.org/10.1103/physrevb.82.241306	journal	December 2010
Thermal Diffusion of Silver in Single‐Crystal Bismuth Telluride Dibbs, H. P.; Tremblay, J. R. Journal of Applied Physics, Vol. 39, Issue 6 https://doi.org/10.1063/1.1656714	journal	May 1968
Thermoelectric properties of p-type (Bi2Te3)x(Sb2Te3)1−x crystals prepared via zone melting Jiang, Jun; Chen, Lidong; Bai, Shengqiang Journal of Crystal Growth, Vol. 277, Issue 1-4 https://doi.org/10.1016/j.jcrysgro.2004.12.144	journal	April 2005
Variation of Schottky‐barrier energy with interdiffusion in Au and Ni/Au–Ge films on GaAs Robinson, G. Y. Journal of Vacuum Science and Technology, Vol. 13, Issue 4 https://doi.org/10.1116/1.569011	journal	July 1976
Enhanced thermoelectric transport in modulation-doped GaN/AlGaN core/shell nanowires Song, Erdong; Li, Qiming; Swartzentruber, Brian Nanotechnology, Vol. 27, Issue 1 https://doi.org/10.1088/0957-4484/27/1/015204	journal	November 2015
Numerical Simulation of Performance and Thermomechanical Behavior of Thermoelectric Modules with Segmented Bismuth-Telluride-Based Legs Picard, M.; Turenne, S.; Vasilevskiy, D. Journal of Electronic Materials, Vol. 42, Issue 7 https://doi.org/10.1007/s11664-012-2435-5	journal	February 2013
Enhanced Thermoelectric Figure-of-Merit in p-Type Nanostructured Bismuth Antimony Tellurium Alloys Made from Elemental Chunks Ma, Yi; Hao, Qing; Poudel, Bed Nano Letters, Vol. 8, Issue 8 https://doi.org/10.1021/nl8009928	journal	August 2008
Nickel-Rich Solid Solutions in Binary Alloys with tin, Germanium, and Silicon Klement Jr., W. Canadian Journal of Physics, Vol. 40, Issue 10 https://doi.org/10.1139/p62-147	journal	October 1962
Thermal Stability of Nickel Germanide Formed on Tensile-Strained Ge Epilayer on Si Substrate IEEE Electron Device Letters, Vol. 31, Issue 8 https://doi.org/10.1109/led.2010.2049979	journal	August 2010
Colloquium: Topological insulators Hasan, M. Z.; Kane, C. L. Reviews of Modern Physics, Vol. 82, Issue 4, p. 3045-3067 https://doi.org/10.1103/revmodphys.82.3045	journal	November 2010
Bismuth Telluride and Its Alloys as Materials for Thermoelectric Generation Goldsmid, H. Materials, Vol. 7, Issue 4 https://doi.org/10.3390/ma7042577	journal	March 2014
Nickel-Rich Solid Solutions in Binary Alloys with tin, Germanium, and Silicon Klement Jr., W. Canadian Journal of Physics, Vol. 40, Issue 10 https://doi.org/10.1139/p62-147	journal	October 1962
The Ge−Ni (Germanium-Nickel) system Nash, A.; Nash, P. Bulletin of Alloy Phase Diagrams, Vol. 8, Issue 3 https://doi.org/10.1007/bf02874917	journal	June 1987
Diffusion of nickel and tin in p-type (Bi,Sb)2Te3 and n-type Bi2(Te,Se)3 thermoelectric materials Lan, Y. C.; Wang, D. Z.; Chen, G. Applied Physics Letters, Vol. 92, Issue 10 https://doi.org/10.1063/1.2896310	journal	March 2008
Lower limit to the lattice thermal conductivity of nanostructured Bi2Te3-based materials Chiritescu, Catalin; Mortensen, Clay; Cahill, David G. Journal of Applied Physics, Vol. 106, Issue 7 https://doi.org/10.1063/1.3226884	journal	October 2009
Enhancement of Thermoelectric Figure of Merit for Bi0.5Sb1.5Te3 by Metal Nanoparticle Decoration Lee, Kyu-Hyoung; Kim, Hyun-Sik; Kim, Sang-Il Journal of Electronic Materials, Vol. 41, Issue 6 https://doi.org/10.1007/s11664-012-1913-0	journal	February 2012
Thermoelectric properties of p-type (Bi2Te3)x(Sb2Te3)1−x crystals prepared via zone melting Jiang, Jun; Chen, Lidong; Bai, Shengqiang Journal of Crystal Growth, Vol. 277, Issue 1-4 https://doi.org/10.1016/j.jcrysgro.2004.12.144	journal	April 2005
Publisher's Note: Ab initio and molecular dynamics predictions for electron and phonon transport in bismuth telluride [Phys. Rev. B 77 , 125209 (2008)] Huang, Bao-Ling; Kaviany, Massoud Physical Review B, Vol. 77, Issue 12 https://doi.org/10.1103/physrevb.77.129904	journal	March 2008
Lower limit to the lattice thermal conductivity of nanostructured Bi2Te3-based materials Chiritescu, Catalin; Mortensen, Clay; Cahill, David G. Journal of Applied Physics, Vol. 106, Issue 7 https://doi.org/10.1063/1.3226884	journal	October 2009
Metallurgical and electrical properties of alloyed Ni/AuGe films on n-type GaAs Robinson, G. Y. Solid-State Electronics, Vol. 18, Issue 4 https://doi.org/10.1016/0038-1101(75)90088-x	journal	April 1975
Metal-semiconductor contacts Rhoderick, E. H. IEE Proceedings I Solid State and Electron Devices, Vol. 129, Issue 1 https://doi.org/10.1049/ip-i-1.1982.0001	journal	January 1982
Formation and Thermal Stability of Nickel Germanide on Germanium Substrate Zhang, Qingchun; Wu, Nan; Osipowicz, Thomas Japanese Journal of Applied Physics, Vol. 44, Issue 10L https://doi.org/10.1143/jjap.44.l1389	journal	October 2005
Tunneling behavior of bismuth telluride nanoplates in electrical transport Eginligil, Mustafa; Zhang, Weiqing; Kalitsov, Alan Chemical Physics Letters, Vol. 546 https://doi.org/10.1016/j.cplett.2012.07.068	journal	September 2012
Obtaining the specific contact resistance from transmission line model measurements Reeves, G. K.; Harrison, H. B. IEEE Electron Device Letters, Vol. 3, Issue 5 https://doi.org/10.1109/edl.1982.25502	journal	May 1982
Phonon scattering due to van der Waals forces in the lattice thermal conductivity of Bi ₂ Te ₃ thin films Park, Kyeong Hyun; Mohamed, Mohamed; Aksamija, Zlatan Journal of Applied Physics, Vol. 117, Issue 1 https://doi.org/10.1063/1.4905294	journal	January 2015
Thermal annealing behaviour of platinum, nickel and titanium Schottky barrier diodes on n-Ge (100) Chawanda, A.; Nyamhere, C.; Auret, F. D. Journal of Alloys and Compounds, Vol. 492, Issue 1-2 https://doi.org/10.1016/j.jallcom.2009.11.202	journal	March 2010
Bismuth Telluride and Its Alloys as Materials for Thermoelectric Generation Goldsmid, H. Materials, Vol. 7, Issue 4 https://doi.org/10.3390/ma7042577	journal	March 2014
Diffusion of nickel and tin in p-type (Bi,Sb)2Te3 and n-type Bi2(Te,Se)3 thermoelectric materials Lan, Y. C.; Wang, D. Z.; Chen, G. Applied Physics Letters, Vol. 92, Issue 10 https://doi.org/10.1063/1.2896310	journal	March 2008
Metal-semiconductor contacts Rhoderick, E. H. IEE Proceedings I Solid State and Electron Devices, Vol. 129, Issue 1 https://doi.org/10.1049/ip-i-1.1982.0001	journal	January 1982
Diffusion and solubility of copper, silver, and gold in germanium Bracht, H.; Stolwijk, N. A.; Mehrer, H. Physical Review B, Vol. 43, Issue 18 https://doi.org/10.1103/physrevb.43.14465	journal	June 1991
Diffusion at interfaces of micro thermoelectric devices Bae, Nam-Ho; Han, Seungwoo; Lee, Kwang Eun Current Applied Physics, Vol. 11, Issue 5 https://doi.org/10.1016/j.cap.2011.05.036	journal	September 2011
Ohmic contacts to n-type germanium with low specific contact resistivity Gallacher, K.; Velha, P.; Paul, D. J. Applied Physics Letters, Vol. 100, Issue 2 https://doi.org/10.1063/1.3676667	journal	January 2012
Real Structure and Thermoelectric Properties of GeTe-Rich Germanium Antimony Tellurides Rosenthal, Tobias; Schneider, Matthias N.; Stiewe, Christian Chemistry of Materials, Vol. 23, Issue 19 https://doi.org/10.1021/cm201717z	journal	October 2011
Diffusion and Solid Solubility of Gold in Single‐Crystal Bismuth Telluride Keys, J. D.; Dutton, H. M. Journal of Applied Physics, Vol. 34, Issue 6 https://doi.org/10.1063/1.1702694	journal	June 1963
Shifting up the optimum figure of merit of p-type bismuth telluride-based thermoelectric materials for power generation by suppressing intrinsic conduction Hu, Li-Peng; Zhu, Tie-Jun; Wang, Ya-Guang NPG Asia Materials, Vol. 6, Issue 2 https://doi.org/10.1038/am.2013.86	journal	February 2014
High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys Poudel, B.; Hao, Q.; Ma, Y. Science, Vol. 320, Issue 5876, p. 634-638 https://doi.org/10.1126/science.1156446	journal	May 2008
Enhanced Thermoelectric Figure-of-Merit in p-Type Nanostructured Bismuth Antimony Tellurium Alloys Made from Elemental Chunks Ma, Yi; Hao, Qing; Poudel, Bed Nano Letters, Vol. 8, Issue 8 https://doi.org/10.1021/nl8009928	journal	August 2008
Shifting up the optimum figure of merit of p-type bismuth telluride-based thermoelectric materials for power generation by suppressing intrinsic conduction Hu, Li-Peng; Zhu, Tie-Jun; Wang, Ya-Guang NPG Asia Materials, Vol. 6, Issue 2 https://doi.org/10.1038/am.2013.86	journal	February 2014
Publisher's Note: Ab initio and molecular dynamics predictions for electron and phonon transport in bismuth telluride [Phys. Rev. B 77 , 125209 (2008)] Huang, Bao-Ling; Kaviany, Massoud Physical Review B, Vol. 77, Issue 12 https://doi.org/10.1103/physrevb.77.129904	journal	March 2008
Thermal Stability of Nickel Germanide Formed on Tensile-Strained Ge Epilayer on Si Substrate IEEE Electron Device Letters, Vol. 31, Issue 8 https://doi.org/10.1109/led.2010.2049979	journal	August 2010
Thermoelectric transport in $\text{Bi}_2\text{Te}_3/\text{Sb}_2\text{Te}_3$ superlattices Hinsche, N. F.; Yavorsky, B. Yu.; Gradhand, M. arXiv https://doi.org/10.48550/arxiv.1206.4078	text	January 2012
Thermal Diffusion of Silver in Single‐Crystal Bismuth Telluride Dibbs, H. P.; Tremblay, J. R. Journal of Applied Physics, Vol. 39, Issue 6 https://doi.org/10.1063/1.1656714	journal	May 1968
Enhanced thermoelectric transport in modulation-doped GaN/AlGaN core/shell nanowires Song, Erdong; Li, Qiming; Swartzentruber, Brian Nanotechnology, Vol. 27, Issue 1 https://doi.org/10.1088/0957-4484/27/1/015204	journal	November 2015
A micro-integrated Peltier heat pump for localized on-chip temperature control Shafai, C.; Brett, M. J. Canadian Journal of Physics, Vol. 74, Issue S1 https://doi.org/10.1139/p96-847	journal	December 1996
Numerical Simulation of Performance and Thermomechanical Behavior of Thermoelectric Modules with Segmented Bismuth-Telluride-Based Legs Picard, M.; Turenne, S.; Vasilevskiy, D. Journal of Electronic Materials, Vol. 42, Issue 7 https://doi.org/10.1007/s11664-012-2435-5	journal	February 2013
Bismuth telluride nanotubes and the effects on the thermoelectric properties of nanotube-containing nanocomposites Zhao, X. B.; Ji, X. H.; Zhang, Y. H. Applied Physics Letters, Vol. 86, Issue 6 https://doi.org/10.1063/1.1863440	journal	February 2005
Obtaining the specific contact resistance from transmission line model measurements Reeves, G. K.; Harrison, H. B. IEEE Electron Device Letters, Vol. 3, Issue 5 https://doi.org/10.1109/edl.1982.25502	journal	May 1982
Variation of Schottky‐barrier energy with interdiffusion in Au and Ni/Au–Ge films on GaAs Robinson, G. Y. Journal of Vacuum Science and Technology, Vol. 13, Issue 4 https://doi.org/10.1116/1.569011	journal	July 1976
A micro-integrated Peltier heat pump for localized on-chip temperature control Shafai, C.; Brett, M. J. Canadian Journal of Physics, Vol. 74, Issue S1 https://doi.org/10.1139/p96-847	journal	December 1996
Experimental Realization of a Three-Dimensional Topological Insulator, Bi₂Te₃ Chen, Y. L.; Analytis, J. G.; Chu, J.-H. Science, Vol. 325, Issue 5937, p. 178-181 https://doi.org/10.1126/science.1173034	journal	June 2009

Similar Records

Material compatibility and thermal aging of thermoelectric materials.

Technical Report · 2009 · OSTI ID:986608

Gardea, Andrew D; Nishimoto, Ryan; Yang, Nancy Y. C.; +4 more

Charge carrier effective mass and concentration derived from combination of Seebeck coefficient and

{}^{125}{Te}

NMR measurements in complex tellurides

Journal Article · 2016 · Physical Review B · OSTI ID:1278781

Levin, E. M.

SOLID STATE DIVISION ANNUAL PROGRESS REPORT FOR PERIOD ENDING AUGUST 31, 1959

Technical Report · 1959 · OSTI ID:4193524

Related Subjects

36
physiology
thermoelectrics
alloys
diffusion
gold

Title: Highly Effective GeNi Alloy Contact Diffusion Barrier for BiSbTe Long-Term Thermal Exposure

Citation Formats

References (82)

Similar Records

Related Subjects