Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300°C
- Xi'an Jiaotong Univ., Shaanxi (China); DOE/OSTI
- Xi'an Jiaotong Univ., Shaanxi (China)
- Xi'an Jiaotong Univ., Shaanxi (China); Johns Hopkins Univ., Baltimore, MD (United States)
Commercial precipitation-hardened Al-Cu alloys are normally used at temperatures below its ageing temperature of ~225°C, to avoid thermally induced precipitate coarsening and resultant softening. Making such popular Al alloys creep resistant at or above 300°C is thus challenging. Here we present a modified precipitation protocol, exploiting Sc-microalloying and a carefully designed three-step heat treatment to enhance Sc segregation at the matrix/θ'-Al2Cu precipitate interfaces. The stabilized nanoprecipitates enable an order-of-magnitude reduction in creep rate at 300°C, demonstrating the room for microstructure improvement and the potential for property elevation in traditional engineering alloys through innovative processing coupled with synergetic alloying elements.
- Research Organization:
- Johns Hopkins Univ., Baltimore, MD (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- Grant/Contract Number:
- FG02-03ER46056
- OSTI ID:
- 1609477
- Journal Information:
- Materials Research Letters, Journal Name: Materials Research Letters Journal Issue: 1 Vol. 7; ISSN 2166-3831
- Publisher:
- Taylor and FrancisCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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