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Title: High‐Resolution Crystal Truncation Rod Scattering: Application to Ultrathin Layers and Buried Interfaces

Authors:
ORCiD logo [1];  [2];  [2]
  1. Condensed Matter DepartmentMax Planck Institute for the Structure and Dynamics of Matter 22761 Hamburg Germany
  2. Department of Applied Physics and Center for Research on Interface Structures and PhenomenaYale University New Haven CT 06520 USA
Publication Date:
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1600868
Alternate Identifier(s):
OSTI ID: 1600875
Grant/Contract Number:  
[DE‐SC0019211]
Resource Type:
Published Article
Journal Name:
Advanced Materials Interfaces
Additional Journal Information:
[Journal Name: Advanced Materials Interfaces Journal Volume: 7 Journal Issue: 6]; Journal ID: ISSN 2196-7350
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Disa, Ankit S., Walker, Frederick J., and Ahn, Charles H. High‐Resolution Crystal Truncation Rod Scattering: Application to Ultrathin Layers and Buried Interfaces. Germany: N. p., 2020. Web. doi:10.1002/admi.201901772.
Disa, Ankit S., Walker, Frederick J., & Ahn, Charles H. High‐Resolution Crystal Truncation Rod Scattering: Application to Ultrathin Layers and Buried Interfaces. Germany. doi:10.1002/admi.201901772.
Disa, Ankit S., Walker, Frederick J., and Ahn, Charles H. Sun . "High‐Resolution Crystal Truncation Rod Scattering: Application to Ultrathin Layers and Buried Interfaces". Germany. doi:10.1002/admi.201901772.
@article{osti_1600868,
title = {High‐Resolution Crystal Truncation Rod Scattering: Application to Ultrathin Layers and Buried Interfaces},
author = {Disa, Ankit S. and Walker, Frederick J. and Ahn, Charles H.},
abstractNote = {},
doi = {10.1002/admi.201901772},
journal = {Advanced Materials Interfaces},
number = [6],
volume = [7],
place = {Germany},
year = {2020},
month = {3}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1002/admi.201901772

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