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Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films
Abstract
We observe a crossover from electron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.
- Authors:
-
[1];
- Aalto Univ. (Finland)
- California Inst. of Technology (CalTech), Pasadena, CA (United States); Brookhaven National Lab. (BNL), Upton, NY (United States)
- Publication Date:
- Research Org.:
- Brookhaven National Lab. (BNL), Upton, NY (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Advanced Scientific Computing Research (SC-21)
- OSTI Identifier:
- 1593259
- Report Number(s):
- BNL-212426-2019-JAAM
Journal ID: ISSN 2331-7019; PRAHB2
- Grant/Contract Number:
- SC0012704
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Physical Review Applied
- Additional Journal Information:
- Journal Volume: 12; Journal Issue: 2; Journal ID: ISSN 2331-7019
- Publisher:
- American Physical Society (APS)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Wang, L. B., Saira, O. -P., Golubev, D. S., and Pekola, J. P. Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films. United States: N. p., 2019.
Web. doi:10.1103/PhysRevApplied.12.024051.
Wang, L. B., Saira, O. -P., Golubev, D. S., & Pekola, J. P. Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films. United States. doi:10.1103/PhysRevApplied.12.024051.
Wang, L. B., Saira, O. -P., Golubev, D. S., and Pekola, J. P. Fri .
"Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films". United States. doi:10.1103/PhysRevApplied.12.024051.
@article{osti_1593259,
title = {Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films},
author = {Wang, L. B. and Saira, O. -P. and Golubev, D. S. and Pekola, J. P.},
abstractNote = {We observe a crossover from electron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.},
doi = {10.1103/PhysRevApplied.12.024051},
journal = {Physical Review Applied},
number = 2,
volume = 12,
place = {United States},
year = {2019},
month = {8}
}
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