Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Jia, Haikun; Wang, Shi Bin; Tamura, Nobumichi; Goudeau, Philippe

doi:10.3390/qubs3010001

Title: Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

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Abstract

Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top ofmore »« less

Authors:

Jia, Haikun ^[1]; Wang, Shi Bin ^[2];

^[3]; Goudeau, Philippe ^[4]

China Electric Power Research Inst., Beijing (China)
Tianjin Univ. (China)
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)
Univ. of Poitiers (France)

Publication Date:: Thu Dec 20 00:00:00 EST 2018

Research Org.:: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

OSTI Identifier:: 1580425

Grant/Contract Number:: AC02-05CH11231

Resource Type:: Accepted Manuscript

Journal Name:: Quantum Beam Science

Additional Journal Information:: Journal Volume: 3; Journal Issue: 1; Journal ID: ISSN 2412-382X

Publisher:: MDPI

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; metallic thin films; residual stresses; delamination; synchrotron X-ray diffraction; finite element method (FEM); strain/stress measurements

Citation Formats


                    Jia, Haikun, Wang, Shi Bin, Tamura, Nobumichi, and Goudeau, Philippe. Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis.  United States: N. p., 2018. 
Web.  doi:10.3390/qubs3010001.

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                    Jia, Haikun, Wang, Shi Bin, Tamura, Nobumichi, & Goudeau, Philippe. Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis.  United States.  https://doi.org/10.3390/qubs3010001

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                    Jia, Haikun, Wang, Shi Bin, Tamura, Nobumichi, and Goudeau, Philippe. Thu .  
"Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis".  United States.  https://doi.org/10.3390/qubs3010001.  https://www.osti.gov/servlets/purl/1580425.

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@article{osti_1580425,

  title        = {Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis},

  author       = {Jia, Haikun and Wang, Shi Bin and Tamura, Nobumichi and Goudeau, Philippe},

  abstractNote = {Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model.},

  doi          = {10.3390/qubs3010001},

  journal      = {Quantum Beam Science},

  number       = 1,

  volume       = 3,

  place        = {United States},

  year         = {Thu Dec 20 00:00:00 EST 2018},

  month        = {Thu Dec 20 00:00:00 EST 2018}

}

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