Hillock formation in co-deposited thin films of immiscible metal alloy systems

Journal Article · 08 November 2019 · Thin Solid Films

DOI: https://doi.org/10.1016/j.tsf.2019.137692 · OSTI ID:1574372

Powers, Max ^[1]; Derby, Benjamin ^[2]; Raeker, Evan ^[2]; Champion, Nicholas ^[2]; Misra, Amit ^[2]

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1. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Materials Science and Engineering; Texas A&M University
2. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Materials Science and Engineering

Hillocks are protruding sections of a surface that can influence the electronic and mechanical properties of a thin film. In monolithic films, these hillocks are formed due to thermally induced stress gradients during deposition. In this study, the surface morphology of co-sputtered immiscible Cu-X (X is a body centered cubic (BCC) group V or VI metal) thin films is characterized to elucidate the conditions that lead to hillock formation. Cu-Ta and Cu-Mo-Ag films were co-deposited with physical vapor deposition (PVD) magnetron sputtering at 25, 400, 600, and 800°C. A significant number of homogeneously distributed surface hillocks were observed only in the 600 and 800°C films. High-angle annular dark field (HAADF) cross-sectional imaging revealed significant Cu agglomerations underneath the protruding features. For the Cu-Ta films, the Cu was enveloped in a Cu-Ta nanocrystalline matrix. For Cu-Mo-Ag, the Cu was surrounded by Mo-Ag concentration modulations. While thermal stress gradients arise during deposition of immiscible metal films, biaxial stress calculations and literature cases reveal that they are not solely responsible for hillock formation. The observed morphologies align with a surface diffusion kinetic model that evaluates diffusion length of adatoms during deposition as a function of deposition temperature. Finally, this indicates a phase separation driving force paired with the constituent elements’ dissimilar mobilities at elevated deposition temperatures contribute to the presence of hillocks.

• Research Organization: Univ. of Michigan, Ann Arbor, MI (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• Grant/Contract Number: NA0003857
• OSTI ID: 1574372
• Journal Information: Thin Solid Films, Journal Name: Thin Solid Films Journal Issue: C Vol. 693; ISSN 0040-6090
• Publisher: ElsevierCopyright Statement
• Country of Publication: United States
• Language: English