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Title: Shock compression of fused silica: An impedance matching standard

Authors:
ORCiD logo [1]; ORCiD logo [1]; ORCiD logo [1]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87175, USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1571342
Grant/Contract Number:  
NA0003525
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 126 Journal Issue: 16; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Root, Seth, Townsend, Joshua P., and Knudson, Marcus D. Shock compression of fused silica: An impedance matching standard. United States: N. p., 2019. Web. doi:10.1063/1.5126205.
Root, Seth, Townsend, Joshua P., & Knudson, Marcus D. Shock compression of fused silica: An impedance matching standard. United States. doi:10.1063/1.5126205.
Root, Seth, Townsend, Joshua P., and Knudson, Marcus D. Mon . "Shock compression of fused silica: An impedance matching standard". United States. doi:10.1063/1.5126205.
@article{osti_1571342,
title = {Shock compression of fused silica: An impedance matching standard},
author = {Root, Seth and Townsend, Joshua P. and Knudson, Marcus D.},
abstractNote = {},
doi = {10.1063/1.5126205},
journal = {Journal of Applied Physics},
number = 16,
volume = 126,
place = {United States},
year = {2019},
month = {10}
}

Journal Article:
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This content will become publicly available on October 22, 2020
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Works referenced in this record:

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  • Physical Review Letters, Vol. 77, Issue 18, p. 3865-3868
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Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set
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Ab initio molecular-dynamics simulation of the liquid-metal–amorphous-semiconductor transition in germanium
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Ab initiomolecular dynamics for liquid metals
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