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Title: Thermal and Thermoelectric Properties of Molecular Junctions

Authors:
 [1];  [1]; ORCiD logo [2]
+ Show Author Affiliations
  1. Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
  2. Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA, Department of Materials Science and EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1569292
Grant/Contract Number:  
DE‐SC0004871
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Advanced Functional Materials
Additional Journal Information:
Journal Name: Advanced Functional Materials; Journal ID: ISSN 1616-301X
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany: N. p., 2019. Web. doi:10.1002/adfm.201904534.
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Wang, Kun, Meyhofer, Edgar, & Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany. doi:10.1002/adfm.201904534.
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Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Thu . "Thermal and Thermoelectric Properties of Molecular Junctions". Germany. doi:10.1002/adfm.201904534.
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@article{osti_1569292,
title = {Thermal and Thermoelectric Properties of Molecular Junctions},
author = {Wang, Kun and Meyhofer, Edgar and Reddy, Pramod},
abstractNote = {},
doi = {10.1002/adfm.201904534},
journal = {Advanced Functional Materials},
number = ,
volume = ,
place = {Germany},
year = {2019},
month = {10}
}
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DOI:  10.1002/adfm.201904534
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