Thermal and Thermoelectric Properties of Molecular Junctions
- Authors:
-
[2]
- Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
- Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA, Department of Materials Science and EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1569292
- Grant/Contract Number:
- DE‐SC0004871
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Advanced Functional Materials
- Additional Journal Information:
- Journal Name: Advanced Functional Materials Journal Volume: 30 Journal Issue: 8; Journal ID: ISSN 1616-301X
- Publisher:
- Wiley Blackwell (John Wiley & Sons)
- Country of Publication:
- Germany
- Language:
- English
Citation Formats
Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany: N. p., 2019.
Web. doi:10.1002/adfm.201904534.
Wang, Kun, Meyhofer, Edgar, & Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany. doi:10.1002/adfm.201904534.
Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Fri .
"Thermal and Thermoelectric Properties of Molecular Junctions". Germany. doi:10.1002/adfm.201904534.
@article{osti_1569292,
title = {Thermal and Thermoelectric Properties of Molecular Junctions},
author = {Wang, Kun and Meyhofer, Edgar and Reddy, Pramod},
abstractNote = {},
doi = {10.1002/adfm.201904534},
journal = {Advanced Functional Materials},
number = 8,
volume = 30,
place = {Germany},
year = {2019},
month = {8}
}
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DOI: 10.1002/adfm.201904534
DOI: 10.1002/adfm.201904534
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