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Title: Thermal and Thermoelectric Properties of Molecular Junctions

 [1];  [1]; ORCiD logo [2]
  1. Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
  2. Department of Mechanical EngineeringUniversity of Michigan Ann Arbor MI 48109 USA, Department of Materials Science and EngineeringUniversity of Michigan Ann Arbor MI 48109 USA
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Publisher's Accepted Manuscript
Journal Name:
Advanced Functional Materials
Additional Journal Information:
Journal Name: Advanced Functional Materials Journal Volume: 30 Journal Issue: 8; Journal ID: ISSN 1616-301X
Wiley Blackwell (John Wiley & Sons)
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Citation Formats

Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany: N. p., 2019. Web. doi:10.1002/adfm.201904534.
Wang, Kun, Meyhofer, Edgar, & Reddy, Pramod. Thermal and Thermoelectric Properties of Molecular Junctions. Germany. doi:10.1002/adfm.201904534.
Wang, Kun, Meyhofer, Edgar, and Reddy, Pramod. Fri . "Thermal and Thermoelectric Properties of Molecular Junctions". Germany. doi:10.1002/adfm.201904534.
title = {Thermal and Thermoelectric Properties of Molecular Junctions},
author = {Wang, Kun and Meyhofer, Edgar and Reddy, Pramod},
abstractNote = {},
doi = {10.1002/adfm.201904534},
journal = {Advanced Functional Materials},
number = 8,
volume = 30,
place = {Germany},
year = {2019},
month = {8}

Journal Article:
Free Publicly Available Full Text
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DOI: 10.1002/adfm.201904534

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