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Title: Mechanical Utility Structure for Testing High Field Superconducting Dipole Magnets

Journal Article · · IEEE Transactions on Applied Superconductivity

The U.S. Magnet Development Program (MDP) collaboration is designing a utility mechanical structure for testing various high-field superconducting dipole coils. The design uses a shell-based structure concept, which allows applying preload in two steps: During a room temperature assembly and during a cool down to a cryogenic temperature. The structure is designed to accommodate various coil designs - including Nb3Sn Cosine Theta (CT) and Canted CT magnets as well as hybrid magnets with high temperature superconductor cables. Superconducting coils, enclosed by bolted pads to form an octagonal coil pack, will be inserted into a reusable yoke-shell subassembly and precisely preloaded during the assembly using a bladder-and-key technology. Due to a differential thermal contraction between an external aluminum shell and the magnet core, the coil preload increases during the cool down up to level required for 17-T excitation. Such a reusable structure will serve as a testing fixture supporting goals of the MDP program, decreasing cost and simplifying coil performance testing at different preload levels. We present a finite-element analysis of the structure preloading various coil designs and examine the predicted coil stress at each step of the magnet assembly and excitation.

Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States); Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
Grant/Contract Number:
AC02-05CH11231; AC02-07CH11359
OSTI ID:
1564052
Report Number(s):
FERMILAB-PUB--19-401-TD; ark:/13030/qt1n173815
Journal Information:
IEEE Transactions on Applied Superconductivity, Journal Name: IEEE Transactions on Applied Superconductivity Journal Issue: 5 Vol. 29; ISSN 1051-8223
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)Copyright Statement
Country of Publication:
United States
Language:
English