Advancing next generation nanolithography with infiltration synthesis of hybrid nanocomposite resists

Tiwale, Nikhil; Subramanian, Ashwanth; Kisslinger, Kim; Lu, Ming; Kim, Jiyoung; Stein, Aaron; Nam, Chang-Yong

doi:10.1039/C9TC02974E

Title: Advancing next generation nanolithography with infiltration synthesis of hybrid nanocomposite resists

Journal Article · 08 July 2019 · Journal of Materials Chemistry C

DOI: https://doi.org/10.1039/C9TC02974E · OSTI ID:1561253

^[1];

^[2]; Kisslinger, Kim ^[1]; Lu, Ming ^[1]; Kim, Jiyoung ^[3]; Stein, Aaron ^[1];

^[1]

Brookhaven National Lab. (BNL), Upton, NY (United States)
Stony Brook Univ., NY (United States)
Univ. of Texas-Dallas, Richardson, TX (United States)

Organic–inorganic hybrid resists are emerging as an effective way of addressing stringent process requirements for aggressive down-scaling of semiconducting devices. Yet, hybrid resists generally require complex chemical synthesis while being predominantly negative-tone with high dose requirements. For positive-tone processes and high-aspect-ratio pattern transfers, resist choices are limited to costly, non-hybrid alternatives, whose etch resistance is still inferior compared with hybrid resists. In this work, we demonstrate a novel hybrid positive-tone resist platform utilizing simple ex situ vapor-phase inorganic infiltration into standard resist materials. A model system based on poly(methyl methacrylate) (PMMA) thin film hybridized with aluminum oxide has been demonstrated for electron-beam lithography patterning, featuring a fully controllable critical exposure dose, contrast, and etch resistance. The hybrid resist not only achieves contrast as high as ~30, six-fold enhancement over standard PMMA, but also enables Si nanostructures with resolution down to ~30 nm and an aspect ratio as high as ~17, owing to enhancement of the Si etch selectivity to ~70, with an estimated achievable maximum of ~300, far exceeding known commercial positive-tone resist systems. The easy implementabilility, combined with versatile ex situ control of resist characteristics, makes this hybrid resist synthesis method uniquely suited for addressing the resist performance and high throughput required for advanced nanolithography techniques, such as extreme ultraviolet lithography, possibly.

View Accepted Manuscript (DOE)

Cite

Export

Save

Research Organization:: Brookhaven National Laboratory (BNL), Upton, NY (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0012704

OSTI ID:: 1561253

Alternate ID(s):: OSTI ID: 1542528

Report Number(s):: BNL-212064-2019-JAAM; BNL-213624-2020-JAAM; JMCCCX

Journal Information:: Journal of Materials Chemistry C, Vol. 7, Issue 29; ISSN 2050-7526

Publisher:: Royal Society of ChemistryCopyright Statement

Country of Publication:: United States

Language:: English

References (77)

Deep reactive ion etching of commercial PMMA in O ₂ /CHF ₃ , and O ₂ /Ar-based discharges Zhang, Congchun; Yang, Chunsheng; Ding, Duifu Journal of Micromechanics and Microengineering, Vol. 14, Issue 5 https://doi.org/10.1088/0960-1317/14/5/001	journal	March 2004
Directed self-assembly of block copolymers for nanocircuitry fabrication Morris, M. A. Microelectronic Engineering, Vol. 132 https://doi.org/10.1016/j.mee.2014.08.009	journal	January 2015
Infiltrated Zinc Oxide in Poly(methyl methacrylate): An Atomic Cycle Growth Study Ocola, Leonidas E.; Connolly, Aine; Gosztola, David J. The Journal of Physical Chemistry C, Vol. 121, Issue 3 https://doi.org/10.1021/acs.jpcc.6b08007	journal	December 2016
Sub-10-nm high aspect ratio patterning of ZnO in a 500 μm main field Saifullah, M. S. M.; Subramanian, K. R. V.; Anderson, D. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 24, Issue 3 https://doi.org/10.1116/1.2192545	journal	January 2006
Boehmite filled hybrid sol–gel system as directly writable hard etching mask for pattern transfer Grenci, Gianluca; Della Giustina, Gioia; Pozzato, Alessandro Microelectronic Engineering, Vol. 88, Issue 8 https://doi.org/10.1016/j.mee.2011.01.012	journal	August 2011
Platinum and palladium oxalates: positive-tone extreme ultraviolet resists Sortland, Miriam; Hotalen, Jodi; Re, Ryan Del Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, Issue 4 https://doi.org/10.1117/1.JMM.14.4.043511	journal	October 2015
High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films Kulsreshath, M.; Vital, A.; Lefaucheux, P. Micro and Nano Engineering, Vol. 1 https://doi.org/10.1016/j.mne.2018.10.007	journal	November 2018
Chemical and Structural Investigation of High-Resolution Patterning with HafSOx Oleksak, Richard P.; Ruther, Rose E.; Luo, Feixiang ACS Applied Materials & Interfaces, Vol. 6, Issue 4 https://doi.org/10.1021/am405463u	journal	February 2014
High-index nanocomposite photoresist for 193-nm lithography Bae, Woo Jin; Trikeriotis, Makros; Rodriguez, Robert SPIE Advanced Lithography, SPIE Proceedings https://doi.org/10.1117/12.814154	conference	March 2009
Mechanistic understanding of tungsten oxide in-plane nanostructure growth via sequential infiltration synthesis Kim, Jae Jin; Suh, Hyo Seon; Zhou, Chun Nanoscale, Vol. 10, Issue 7 https://doi.org/10.1039/C7NR07642H	journal	January 2018
Organosilicate polymer e-beam resists with high resolution, sensitivity and stability: Organosilicate polymer e-beam resists Lee, Sung-Il; Sim, Jae Hwan; Lee, Hae-Jeong Applied Organometallic Chemistry, Vol. 27, Issue 11 https://doi.org/10.1002/aoc.2985	journal	October 2013
Enhanced Lithographic Imaging Layer Meets Semiconductor Manufacturing Specification a Decade Early Tseng, Yu-Chih; Mane, Anil U.; Elam, Jeffrey W. Advanced Materials, Vol. 24, Issue 19, p. 2608-2613 https://doi.org/10.1002/adma.201104871	journal	April 2012
High sensitive negative silylation process for 193nm lithography Endo, M.; Satou, I.; Watanabe, H. Microelectronic Engineering, Vol. 53, Issue 1-4, p. 485-488 https://doi.org/10.1016/S0167-9317(00)00361-0	journal	June 2000
Three-dimensional electroactive ZnO nanomesh directly derived from hierarchically self-assembled block copolymer thin films Subramanian, Ashwanth; Doerk, Gregory; Kisslinger, Kim Nanoscale, Vol. 11, Issue 19 https://doi.org/10.1039/C9NR00206E	journal	January 2019
Extreme Carrier Depletion and Superlinear Photoconductivity in Ultrathin Parallel-Aligned ZnO Nanowire Array Photodetectors Fabricated by Infiltration Synthesis Nam, Chang-Yong; Stein, Aaron Advanced Optical Materials, Vol. 5, Issue 24 https://doi.org/10.1002/adom.201700807	journal	November 2017
Low temperature development of PMMA for sub-10-nm electron beam lithography 2003 Third IEEE Conference on Nanotechnology, 2003. IEEE-NANO 2003. https://doi.org/10.1109/NANO.2003.1230983	conference	January 2003
Novel polymeric anionic photoacid generators (PAGs) and corresponding polymers for 193 nm lithography Wang, Mingxing; Jarnagin, Nathan D.; Lee, Cheng-Tsung Journal of Materials Chemistry, Vol. 16, Issue 37 https://doi.org/10.1039/b607918k	journal	January 2006
Imaging results for resist films exposed to EUV radiation Ryoo, Manhyoung; Shirayone, Shigeru; Yano, Ei Microelectronic Engineering, Vol. 61-62 https://doi.org/10.1016/S0167-9317(02)00504-X	journal	July 2002
Photo-induced Fragmentation of a Tin-oxo Cage Compound Haitjema, Jarich; Wu, Lianjia; Giuliani, Alexandre Journal of Photopolymer Science and Technology, Vol. 31, Issue 2 https://doi.org/10.2494/photopolymer.31.243	journal	January 2018
Direct patterning of high density sub-15 nm gold dot arrays using ultrahigh contrast electron beam lithography process on positive tone resist Tobing, L. Y. M.; Tjahjana, L.; Zhang, D. H. Nanotechnology, Vol. 24, Issue 7 https://doi.org/10.1088/0957-4484/24/7/075303	journal	January 2013
Ultrahigh Elastic Strain Energy Storage in Metal-Oxide-Infiltrated Patterned Hybrid Polymer Nanocomposites Dusoe, Keith J.; Ye, Xinyi; Kisslinger, Kim Nano Letters, Vol. 17, Issue 12 https://doi.org/10.1021/acs.nanolett.7b03238	journal	November 2017
Effect of Nanostructured Domains in Self-Assembled Block Copolymer Films on Sequential Infiltration Synthesis Peng, Qing; Tseng, Yu-Chih; Long, Yun Langmuir, Vol. 33, Issue 46 https://doi.org/10.1021/acs.langmuir.7b02922	journal	November 2017
Ultrathin photoresists for 193-nm lithography Peters, Richard D.; Amblard, Gilles R.; Lee, Jen-Jiang Microlithography 2003, SPIE Proceedings https://doi.org/10.1117/12.485132	conference	June 2003
Antimony photoresists for EUV lithography: mechanistic studies Murphy, Michael; Narasimhan, Amrit; Grzeskowiak, Steven SPIE Advanced Lithography, SPIE Proceedings https://doi.org/10.1117/12.2258119	conference	March 2017
A Top Surface Imaging Method Using Area Selective ALD on Chemically Amplified Polymer Photoresist Films Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L. Electrochemical and Solid-State Letters, Vol. 9, Issue 11 https://doi.org/10.1149/1.2335939	journal	January 2006
Approaches to deep ultraviolet photolithography utilizing acid hardened resin photoresist systems Thackeray, James W.; Orsula, George W.; Bohland, John F. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 7, Issue 6, Article No. 1620 https://doi.org/10.1116/1.584502	journal	November 1989
Chemical Semi-Amplified positive E-beam Resist (CSAR 62) for highest resolution Schirmer, M.; Büttner, B.; Syrowatka, F. 29th European Mask and Lithography Conference, SPIE Proceedings https://doi.org/10.1117/12.2030576	conference	October 2013
Extreme ultraviolet resist materials for sub-7 nm patterning Li, Li; Liu, Xuan; Pal, Shyam Chemical Society Reviews, Vol. 46, Issue 16 https://doi.org/10.1039/C7CS00080D	journal	January 2017
Sub-10 nm electron and helium ion beam lithography using a recently developed alumina resist Cattoni, Andrea; Mailly, Dominique; Dalstein, Olivier Microelectronic Engineering, Vol. 193 https://doi.org/10.1016/j.mee.2018.02.015	journal	June 2018
Negative hybrid sol–gel resist as hard etching mask for pattern transfer with dry etching Grenci, Gianluca; Della Giustina, Gioia; Pozzato, Alessandro Microelectronic Engineering, Vol. 98 https://doi.org/10.1016/j.mee.2012.07.070	journal	October 2012
Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications Kontziampasis, D.; Beltsios, K.; Tegou, E. Journal of Applied Polymer Science, Vol. 117, Issue 4, p. 2189-2195 https://doi.org/10.1002/app.31644	journal	April 2010
Chemical Modification Mechanisms in Hybrid Hafnium Oxo-methacrylate Nanocluster Photoresists for Extreme Ultraviolet Patterning Mattson, Eric C.; Cabrera, Yasiel; Rupich, Sara M. Chemistry of Materials, Vol. 30, Issue 17 https://doi.org/10.1021/acs.chemmater.8b03149	journal	August 2018
Surface imaging techniques Roland, B. Microelectronic Engineering, Vol. 13, Issue 1-4 https://doi.org/10.1016/0167-9317(91)90038-F	journal	March 1991
Hydrogen silsesquioxane (HSQ): a perfect negative tone resist for developing nanostructure patterns on a silicon platform Singh, G.; Stenberg, P.; Vahima, P. SPIE MOEMS-MEMS, SPIE Proceedings https://doi.org/10.1117/12.874851	conference	February 2011
Metal-carbonyl organometallic polymers, PFpP, as resists for high-resolution positive and negative electron beam lithography Zhang, J.; Cao, K.; Wang, X. S. Chemical Communications, Vol. 51, Issue 99 https://doi.org/10.1039/C5CC07117H	journal	January 2015
Sub-10 nm High-Aspect-Ratio Patterning of ZnO Using an Electron Beam Saifullah, M. S. M.; Subramanian, K. R. V.; Kang, D. -J. Advanced Materials, Vol. 17, Issue 14 https://doi.org/10.1002/adma.200500484	journal	July 2005
Systematic studies of functionalized calixarenes as negative tone electron beam Prins, F. E.; Pfeiffer, J.; Raible, S. Microelectronic Engineering, Vol. 41-42 https://doi.org/10.1016/S0167-9317(98)00083-5	journal	March 1998
Review of Recent Advances in Applications of Vapor-Phase Material Infiltration Based on Atomic Layer Deposition Subramanian, Ashwanth; Tiwale, Nikhil; Nam, Chang-Yong JOM, Vol. 71, Issue 1 https://doi.org/10.1007/s11837-018-3141-4	journal	September 2018
Negative resist image by dry etching: a novel surface imaging resist scheme Arshak, K.; Mihov, M.; Sutton, D. Microelectronic Engineering, Vol. 67-68 https://doi.org/10.1016/S0167-9317(03)00169-2	journal	June 2003
High resolution spin-on electron beam lithography resist with exceptional dry etching resistance Grenci, G.; Zanchetta, E.; Pozzato, A. Applied Materials Today, Vol. 1, Issue 1 https://doi.org/10.1016/j.apmt.2015.06.003	journal	November 2015
Directed self-assembly of block copolymers for use in bit patterned media fabrication Griffiths, Rhys Alun; Williams, Aled; Oakland, Chloe Journal of Physics D: Applied Physics, Vol. 46, Issue 50 https://doi.org/10.1088/0022-3727/46/50/503001	journal	November 2013
Effect of chelating agents on high resolution electron beam nanolithography of spin-coatable Al/sub 2/O/sub 3/ gel films Saifullah, M. S. M.; Namatsu, H.; Yamaguchi, T. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International Microprocesses and Nanotechnology Conference https://doi.org/10.1109/IMNC.1999.797526	conference	January 1999
Water soluble and metal-containing electron beam resist poly(sodium 4-styrenesulfonate) Abbas, Arwa Saud; Alqarni, Sondos; Shokouhi, Babak Baradaran Materials Research Express, Vol. 1, Issue 4 https://doi.org/10.1088/2053-1591/1/4/045102	journal	November 2014
Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca Advanced Materials, Vol. 25, Issue 43 https://doi.org/10.1002/adma.201301555	journal	August 2013
Application of Plasmask R resist and the DESIRE process to lithography at 248 nm Hutton, Richard S. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 8, Issue 6 https://doi.org/10.1116/1.585105	journal	November 1990
Silylated acid hardened resist process: A deep ultraviolet surface imaging technique Pavelchek, Edward K. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 8, Issue 6 https://doi.org/10.1116/1.585104	journal	November 1990
Vapor phase infiltration (VPI) for transforming polymers into organic–inorganic hybrid materials: a critical review of current progress and future challenges Leng, Collen Z.; Losego, Mark D. Materials Horizons, Vol. 4, Issue 5 https://doi.org/10.1039/C7MH00196G	journal	January 2017
Combination photo and electron beam lithography with polymethyl methacrylate (PMMA) resist Carbaugh, Daniel J.; Pandya, Sneha G.; Wright, Jason T. Nanotechnology, Vol. 28, Issue 45 https://doi.org/10.1088/1361-6528/aa8bd5	journal	October 2017
Sub-10 nm Electron Beam Nanolithography Using Spin-Coatable TiO ₂ Resists Saifullah, M. S. M.; Subramanian, K. R. V.; Tapley, E. Nano Letters, Vol. 3, Issue 11 https://doi.org/10.1021/nl034584p	journal	November 2003
Aberration-Corrected Electron Beam Lithography at the One Nanometer Length Scale Manfrinato, Vitor R.; Stein, Aaron; Zhang, Lihua Nano Letters, Vol. 17, Issue 8 https://doi.org/10.1021/acs.nanolett.7b00514	journal	April 2017
Spin-coatable HfO2 resist for optical and electron beam lithographies Saifullah, M. S. M.; Khan, M. Z. R.; Hasko, David G. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 28, Issue 1 https://doi.org/10.1116/1.3273536	journal	January 2010
New Positive EB Resist with Strong Resistance to Plasma Damage Yamaguchi, Kazuo Journal of The Electrochemical Society, Vol. 139, Issue 3 https://doi.org/10.1149/1.2069330	journal	January 1992
Studying the Mechanism of Hybrid Nanoparticle Photoresists: Effect of Particle Size on Photopatterning Li, Li; Chakrabarty, Souvik; Spyrou, Konstantinos Chemistry of Materials, Vol. 27, Issue 14 https://doi.org/10.1021/acs.chemmater.5b01506	journal	July 2015
Electron beam lithography process for T- and Γ-shaped gate fabrication using chemically amplified DUV resists and PMMA Chen, Y.; Macintyre, D.; Thoms, S. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 17, Issue 6 https://doi.org/10.1116/1.591119	journal	January 1999
Study of nanometer resolution resist slope for the UVIII chemically amplified resist Gerardino, A.; Gentili, M.; Di Fabrizio, E. Microelectronic Engineering, Vol. 46, Issue 1-4 https://doi.org/10.1016/S0167-9317(99)00062-3	journal	May 1999
Lithography and Other Patterning Techniques for Future Electronics Pease, R. F.; Chou, S. Y. Proceedings of the IEEE, Vol. 96, Issue 2 https://doi.org/10.1109/JPROC.2007.911853	journal	February 2008
Direct e-beam writing of dense and high aspect ratio nanostructures in thick layers of PMMA for electroplating Gorelick, Sergey; Guzenko, Vitaliy A.; Vila-Comamala, Joan Nanotechnology, Vol. 21, Issue 29 https://doi.org/10.1088/0957-4484/21/29/295303	journal	July 2010
10nm lines and spaces written in HSQ, using electron beam lithography Grigorescu, A. E.; van der Krogt, M. C.; Hagen, C. W. Microelectronic Engineering, Vol. 84, Issue 5-8 https://doi.org/10.1016/j.mee.2007.01.022	journal	May 2007
Nanoparticle Photoresists: Ligand Exchange as a New, Sensitive EUV Patterning Mechanism Kryask, Marie; Trikeriotis, Markos; Ouyang, Christine Journal of Photopolymer Science and Technology, Vol. 26, Issue 5 https://doi.org/10.2494/photopolymer.26.659	journal	January 2013
Reactivity of metal-oxalate EUV resists as a function of the central metal Grzeskowiak, Steven; Narasimhan, Amrit; Murphy, Michael SPIE Advanced Lithography, SPIE Proceedings https://doi.org/10.1117/12.2258151	conference	March 2017
New hybrid organic–inorganic sol–gel positive resist Brigo, L.; Pistore, A.; Grenci, G. Microelectronic Engineering, Vol. 87, Issue 5-8 https://doi.org/10.1016/j.mee.2009.11.151	journal	May 2010
New Insight into the Mechanism of Sequential Infiltration Synthesis from Infrared Spectroscopy Biswas, Mahua; Libera, Joseph A.; Darling, Seth B. Chemistry of Materials, Vol. 26, Issue 21 https://doi.org/10.1021/cm502427q	journal	October 2014
Improved etch resistance of ZEP 520A in reactive ion etching through heat and ultraviolet light treatment Czaplewski, David A.; Tallant, David R.; Patrizi, Gary A. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 27, Issue 2 https://doi.org/10.1116/1.3086721	journal	January 2009
Metal methacrylates as sensitizers for poly methyl methacrylate electron resists Webb, David J.; Hatzakis, M. Journal of Vacuum Science and Technology, Vol. 16, Issue 6 https://doi.org/10.1116/1.570331	journal	November 1979
PRIME process for deep UV and E-beam lithography Pierrat, C.; Tedesco, S.; Vinet, F. Microelectronic Engineering, Vol. 11, Issue 1-4, p. 507-514 https://doi.org/10.1016/0167-9317(90)90160-U	journal	April 1990
Chemically Enhancing Block Copolymers for Block-Selective Synthesis of Self-Assembled Metal Oxide Nanostructures Kamcev, Jovan; Germack, David S.; Nykypanchuk, Dmytro ACS Nano, Vol. 7, Issue 1 https://doi.org/10.1021/nn304122b	journal	December 2012
High aspect ratio silicon etch: A review Wu, Banqiu; Kumar, Ajay; Pamarthy, Sharma Journal of Applied Physics, Vol. 108, Issue 5 https://doi.org/10.1063/1.3474652	journal	September 2010
Alternatives to chemical amplification for 193nm lithography Baylav, Burak; Zhao, Meng; Yin, Ran SPIE Advanced Lithography, SPIE Proceedings https://doi.org/10.1117/12.846924	conference	March 2010
Fabrication of Sub-10 nm Metallic Lines of Low Line-Width Roughness by Hydrogen Reduction of Patterned Metal-Organic Materials Nedelcu, Mihaela; Saifullah, Mohammad S. M.; Hasko, David G. Advanced Functional Materials, Vol. 20, Issue 14 https://doi.org/10.1002/adfm.201000219	journal	June 2010
Electron Beam Nanolithography of -Ketoester Modified Aluminium Tri-Sec-Butoxide Saifullah, M. S. M.; Kang, Dae-Joon; Subramanian, K. R. V. Journal of Sol-Gel Science and Technology, Vol. 29, Issue 1 https://doi.org/10.1023/B:JSST.0000016131.35342.2f	journal	January 2004
Elemental depth profiles and plasma etching rates of positive-tone electron beam resists after sequential infiltration synthesis of alumina Ozaki, Yuki; Ito, Shunya; Hiroshiba, Nobuya Japanese Journal of Applied Physics, Vol. 57, Issue 6S1 https://doi.org/10.7567/JJAP.57.06HG01	journal	May 2018
Direct writing of ZrO ₂ on a sub-10 nm scale using an electron beam Subramanian, K. R. V.; Saifullah, M. S. M.; Tapley, E. Nanotechnology, Vol. 15, Issue 1 https://doi.org/10.1088/0957-4484/15/1/031	journal	November 2003
PRIME process with Shipley SPR505A resist—simulations and experiments Arshak, K.; Mihov, M.; Arshak, A. Microelectronic Engineering, Vol. 61-62 https://doi.org/10.1016/S0167-9317(02)00446-X	journal	July 2002
Effects of Residual Solvent Molecules Facilitating the Infiltration Synthesis of ZnO in a Nonreactive Polymer Ye, Xinyi; Kestell, John; Kisslinger, Kim Chemistry of Materials, Vol. 29, Issue 10 https://doi.org/10.1021/acs.chemmater.7b01222	journal	May 2017
Solubility studies of inorganic–organic hybrid nanoparticle photoresists with different surface functional groups Li, Li; Chakrabarty, Souvik; Jiang, Jing Nanoscale, Vol. 8, Issue 3 https://doi.org/10.1039/C5NR07334K	journal	January 2016
Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the art Grigorescu, A. E.; Hagen, C. W. Nanotechnology, Vol. 20, Issue 29 https://doi.org/10.1088/0957-4484/20/29/292001	journal	July 2009
Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca Advanced Materials, Vol. 26, Issue 5 https://doi.org/10.1002/adma.201303707	journal	February 2014

Cited By (1)

The chemical physics of sequential infiltration synthesis—A thermodynamic and kinetic perspective Waldman, Ruben Z.; Mandia, David J.; Yanguas-Gil, Angel The Journal of Chemical Physics, Vol. 151, Issue 19 https://doi.org/10.1063/1.5128108	journal	November 2019