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Title: Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies

Abstract

Gold-plated copper alloys are used extensively in electrical contacts where diffusional processes are known to cause contact degradation. An in situ transmission electron microscopy (TEM) heating study was carried out to provide fundamental understanding of the aging phenomena in reasonable timescales. Samples to visualize the interface in TEM were prepared by focused ion beam (FIB) microscopy and heated in situ up to 350°C while holding at intermediate temperatures to enable imaging. The grain boundaries in Au coatings, specifically the columnar boundaries, provided rapid pathways for diffusion of Cu all the way to the Au surface. This unequal diffusion created vacancies in Cu which coalesced into Kirkendall voids. This in situ technique has been applied to visualize the diffusion pathways in electroplated and sputtered Au films deposited directly on Cu, as well the role of Ni and NiP as barrier layers for mitigating Cu diffusion.

Authors:
ORCiD logo [1];  [1]
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  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1559505
Report Number(s):
SAND2019-8951J
Journal ID: ISSN 1047-4838; 678064; TRN: US2000352
Grant/Contract Number:  
AC04-94AL85000
Resource Type:
Accepted Manuscript
Journal Name:
JOM. Journal of the Minerals, Metals & Materials Society
Additional Journal Information:
Journal Name: JOM. Journal of the Minerals, Metals & Materials Society; Journal ID: ISSN 1047-4838
Publisher:
Springer
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Kotula, Paul G., and Prasad, Somuri V. Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies. United States: N. p., 2019. Web. doi:10.1007/s11837-019-03708-0.
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Kotula, Paul G., & Prasad, Somuri V. Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies. United States. doi:10.1007/s11837-019-03708-0.
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Kotula, Paul G., and Prasad, Somuri V. Wed . "Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies". United States. doi:10.1007/s11837-019-03708-0. https://www.osti.gov/servlets/purl/1559505.
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@article{osti_1559505,
title = {Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies},
author = {Kotula, Paul G. and Prasad, Somuri V.},
abstractNote = {Gold-plated copper alloys are used extensively in electrical contacts where diffusional processes are known to cause contact degradation. An in situ transmission electron microscopy (TEM) heating study was carried out to provide fundamental understanding of the aging phenomena in reasonable timescales. Samples to visualize the interface in TEM were prepared by focused ion beam (FIB) microscopy and heated in situ up to 350°C while holding at intermediate temperatures to enable imaging. The grain boundaries in Au coatings, specifically the columnar boundaries, provided rapid pathways for diffusion of Cu all the way to the Au surface. This unequal diffusion created vacancies in Cu which coalesced into Kirkendall voids. This in situ technique has been applied to visualize the diffusion pathways in electroplated and sputtered Au films deposited directly on Cu, as well the role of Ni and NiP as barrier layers for mitigating Cu diffusion.},
doi = {10.1007/s11837-019-03708-0},
journal = {JOM. Journal of the Minerals, Metals & Materials Society},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {8}
}
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DOI:  10.1007/s11837-019-03708-0
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Works referenced in this record:

Quantitative analysis for in situ sintering of 3% yttria-stablized zirconia in the transmission electron microscope
journal, May 2015

Low‐temperature diffusion of copper through gold
journal, September 1976

  • Tompkins, H. G.; Pinnel, M. R.
  • Journal of Applied Physics, Vol. 47, Issue 9
  • DOI: 10.1063/1.323265

Analysis of grain‐boundary diffusion in thin films: Chromium in gold
journal, September 1976

  • Holloway, P. H.; Amos, D. E.; Nelson, G. C.
  • Journal of Applied Physics, Vol. 47, Issue 9
  • DOI: 10.1063/1.323259

Interdiffusion in the CuAu thin film system at 25°C to 250°C
journal, March 1977

In situ TEM sintering of nano-sized ZrO2 particles
journal, December 1995

Grain growth mechanisms in ultrafine-grained steel: an electron backscatter diffraction and in situ TEM study
journal, April 2019

  • Ahmels, Laura; Kashiwar, Ankush; Scherer, Torsten
  • Journal of Materials Science, Vol. 54, Issue 14
  • DOI: 10.1007/s10853-019-03611-8

What limits the application of TEM in the semiconductor industry?
journal, May 1998

Diffusion-related behaviour of gold in thin film systems
journal, June 1979

Special aspects of diffusion in thin films
journal, February 1975

Automated Analysis of SEM X-Ray Spectral Images: A Powerful New Microanalysis Tool
journal, January 2003

  • Kotula, Paul G.; Keenan, Michael R.; Michael, Joseph R.
  • Microscopy and Microanalysis, Vol. 9, Issue 1
  • DOI: 10.1017/S1431927603030058

Tribological Properties of Gold for Electric Contacts
journal, March 1973

Current and future uses of gold in electronics
journal, March 2002

Grain boundary diffusivity of Ni in Au thin films and the associated degradation in electrical contact resistance due to surface oxide film formation
journal, March 2013

  • Argibay, N.; Brumbach, M. T.; Dugger, M. T.
  • Journal of Applied Physics, Vol. 113, Issue 11
  • DOI: 10.1063/1.4795768

Qualitative observations on the diffusion of copper and gold through a nickel barrier
journal, May 1976

  • Pinnel, M. Robert; Bennett, James E.
  • Metallurgical Transactions A, Vol. 7, Issue 5
  • DOI: 10.1007/BF03186793

Synthesis of Au–MoS 2 Nanocomposites: Thermal and Friction-Induced Changes to the Structure
journal, November 2013

  • Scharf, T. W.; Goeke, R. S.; Kotula, P. G.
  • ACS Applied Materials & Interfaces, Vol. 5, Issue 22
  • DOI: 10.1021/am4034476

A pyramid approach to subpixel registration based on intensity
journal, January 1998

  • Thevenaz, P.; Ruttimann, U. E.; Unser, M.
  • IEEE Transactions on Image Processing, Vol. 7, Issue 1
  • DOI: 10.1109/83.650848

Diffusion of iron, cobalt and nickel in gold
journal, January 1963

High-resolution and in situ tem studies of annealing of Ti-Si multilayers
journal, June 1988

Constriction resistance and the real area of contact
journal, December 1966

Ni-P (nickel-phosphorus)
journal, March 2000

Ni-P (Nickel-Phosphorus)
journal, January 2010

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