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Title: Electrochemical-Reaction-Driven Interfacial Stress in a Solid-Solid Layered Architecture

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Publication Date:
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
Grant/Contract Number:  
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review Applied
Additional Journal Information:
Journal Name: Physical Review Applied Journal Volume: 11 Journal Issue: 3; Journal ID: ISSN 2331-7019
American Physical Society
Country of Publication:
United States

Citation Formats

Hao, Feng, Wang, Wenxiu, and Mukherjee, Partha P. Electrochemical-Reaction-Driven Interfacial Stress in a Solid-Solid Layered Architecture. United States: N. p., 2019. Web. doi:10.1103/PhysRevApplied.11.034038.
Hao, Feng, Wang, Wenxiu, & Mukherjee, Partha P. Electrochemical-Reaction-Driven Interfacial Stress in a Solid-Solid Layered Architecture. United States. doi:10.1103/PhysRevApplied.11.034038.
Hao, Feng, Wang, Wenxiu, and Mukherjee, Partha P. Fri . "Electrochemical-Reaction-Driven Interfacial Stress in a Solid-Solid Layered Architecture". United States. doi:10.1103/PhysRevApplied.11.034038.
title = {Electrochemical-Reaction-Driven Interfacial Stress in a Solid-Solid Layered Architecture},
author = {Hao, Feng and Wang, Wenxiu and Mukherjee, Partha P.},
abstractNote = {},
doi = {10.1103/PhysRevApplied.11.034038},
journal = {Physical Review Applied},
number = 3,
volume = 11,
place = {United States},
year = {2019},
month = {3}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1103/PhysRevApplied.11.034038

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