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Title: In situ electrical resistance and X-ray tomography study of copper-tin polymer composites during thermal annealing

Abstract

In situ electrical conductivity and X-ray tomography experiments are conducted on a conductive polymer composite containing polyvinylidene fluoride (PVDF) copolymer, copper (Cu), and tin (Sn) during thermal annealing. During annealing, the electrical resistivity drops by an order of magnitude, while X-ray tomography, electron microscopy, and spectroscopy results show increasingly homogeneous dispersion of Sn in the conductive filler network, accompanied by the formation of Cu–Sn intermetallic around Cu and Sn particles. This study provides detailed insight into the morphological origins of the beneficial effect of thermal annealing on the electrical properties of conductive composites containing low melting metal fillers.

Authors:
 [1];  [2];  [2];  [2];  [2]; ORCiD logo [1]
  1. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source
  2. Tyco Electronics Corporation, Menlo Park, CA (United States)
Publication Date:
Research Org.:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States). National Energy Research Scientific Computing Center (NERSC); Univ. of California, Oakland, CA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1543476
Grant/Contract Number:  
AC02-05CH11231
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Applied Polymer Science
Additional Journal Information:
Journal Volume: 134; Journal Issue: 43; Journal ID: ISSN 0021-8995
Publisher:
Wiley
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; polymer science; conducting polymers; thermal properties; X-ray

Citation Formats

Yang, Qing, Beers, Megan Hoarfrost, Zheng, Min, Lloyd, Richard, Gao, Ting, and Parkinson, Dilworth. In situ electrical resistance and X-ray tomography study of copper-tin polymer composites during thermal annealing. United States: N. p., 2017. Web. doi:10.1002/app.45399.
Yang, Qing, Beers, Megan Hoarfrost, Zheng, Min, Lloyd, Richard, Gao, Ting, & Parkinson, Dilworth. In situ electrical resistance and X-ray tomography study of copper-tin polymer composites during thermal annealing. United States. doi:10.1002/app.45399.
Yang, Qing, Beers, Megan Hoarfrost, Zheng, Min, Lloyd, Richard, Gao, Ting, and Parkinson, Dilworth. Sun . "In situ electrical resistance and X-ray tomography study of copper-tin polymer composites during thermal annealing". United States. doi:10.1002/app.45399. https://www.osti.gov/servlets/purl/1543476.
@article{osti_1543476,
title = {In situ electrical resistance and X-ray tomography study of copper-tin polymer composites during thermal annealing},
author = {Yang, Qing and Beers, Megan Hoarfrost and Zheng, Min and Lloyd, Richard and Gao, Ting and Parkinson, Dilworth},
abstractNote = {In situ electrical conductivity and X-ray tomography experiments are conducted on a conductive polymer composite containing polyvinylidene fluoride (PVDF) copolymer, copper (Cu), and tin (Sn) during thermal annealing. During annealing, the electrical resistivity drops by an order of magnitude, while X-ray tomography, electron microscopy, and spectroscopy results show increasingly homogeneous dispersion of Sn in the conductive filler network, accompanied by the formation of Cu–Sn intermetallic around Cu and Sn particles. This study provides detailed insight into the morphological origins of the beneficial effect of thermal annealing on the electrical properties of conductive composites containing low melting metal fillers.},
doi = {10.1002/app.45399},
journal = {Journal of Applied Polymer Science},
number = 43,
volume = 134,
place = {United States},
year = {2017},
month = {8}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Figure 1 Figure 1: Schematic 3D drawing of the in-situ tomography test cell.

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Works referenced in this record:

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    Figures/Tables have been extracted from DOE-funded journal article accepted manuscripts.