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Title: Pressed copper and gold-plated copper contacts at low temperatures – A review of thermal contact resistance

Journal Article · · Cryogenics
 [1]
  1. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
+ Show Author Affiliations

Cryogenic systems that utilize cryocoolers with conduction cooling for attaining temperatures of 4.2 K and below routinely employ mechanically pressed components of copper to form the heat conduction path. To help with the design of such systems, the present paper introduces thermal contact resistance data of pressed copper-copper and gold-plated copper-copper contacts from nearly twenty measurement programs that span across past fifty years. Relevant theoretical models of thermal contact resistance are briefly reviewed and compared with the experimental data. Gold-plated copper contacts display reasonable trend with the models, which may serve as a design reference for such contacts. A few measurement techniques are also summarized that enable quick characterization of thermal contacts at low temperatures.

Research Organization:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), High Energy Physics (HEP)
Grant/Contract Number:
AC02-07CH11359
OSTI ID:
1542958
Alternate ID(s):
OSTI ID: 1702308
Report Number(s):
FERMILAB-PUB-19-134-TD; 1742585
Journal Information:
Cryogenics, Vol. 101, Issue C; ISSN 0011-2275
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 19 works
Citation information provided by
Web of Science

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Cited By (1)

Partial Meissner effect measurement by a superconducting magnetic flux lens preprint January 2021

Figures / Tables (18)

Figure 1(p. 6)figure Figure 1
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Table 2: Part 1(p. 17)table Table 2: Part 1
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Table 2: Part 3(p. 19)table Table 2: Part 3
Table 2: Part 4(p. 20)table Table 2: Part 4
Table 3: Part 1(p. 21)table Table 3: Part 1
Table 3: Part 2(p. 22)table Table 3: Part 2
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Table 4(p. 27)table Table 4
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Table A1(p. 34)table Table A1

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