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Title: A model for high temperature deformation of nanolaminate Cu-Nb composites

Abstract

Nanolaminate composites with layer thicknesses down to 65 nm display conventional 3 stage creep behavior with creep resistance increasing as layer thickness decreases. A model for the time dependent high temperature deformation response of Cu-Nb composites is developed, and compared to creep tests performed on multilayers fabricated via accumulative roll bonding (ARB). The model assumes a continuous laminate structure of 50 % Cu and 50 % Nb in which deformation is controlled by stage II creep for the copper (ε cr = Aσ n) and plasticity in Nb. Regimes in which composite steady-state creep at constant stress can be achieved are identified. The modeling illustrates that strain-hardening in the niobium plays a critical role in the transient response of the multilayer, which can dominate the creep lifetime. The combination of experiments and models strongly suggest that dislocation climb mechanisms in the copper control the time-response at 400 °C for all layer thicknesses tested.

Authors:
 [1]; ORCiD logo [2];  [1];  [1]
  1. Univ. of California, Santa Barbara, CA (United States)
  2. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Publication Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1530796
Report Number(s):
LA-UR-18-29111
Journal ID: ISSN 0921-5093
Grant/Contract Number:  
89233218CNA000001
Resource Type:
Accepted Manuscript
Journal Name:
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Additional Journal Information:
Journal Volume: 761; Journal Issue: C; Journal ID: ISSN 0921-5093
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Avallone, Jaclyn T., Nizolek, Thomas Joseph, Pollock, Tresa Marie, and Begley, Matthew R. A model for high temperature deformation of nanolaminate Cu-Nb composites. United States: N. p., 2019. Web. doi:10.1016/j.msea.2019.06.026.
Avallone, Jaclyn T., Nizolek, Thomas Joseph, Pollock, Tresa Marie, & Begley, Matthew R. A model for high temperature deformation of nanolaminate Cu-Nb composites. United States. doi:10.1016/j.msea.2019.06.026.
Avallone, Jaclyn T., Nizolek, Thomas Joseph, Pollock, Tresa Marie, and Begley, Matthew R. Thu . "A model for high temperature deformation of nanolaminate Cu-Nb composites". United States. doi:10.1016/j.msea.2019.06.026.
@article{osti_1530796,
title = {A model for high temperature deformation of nanolaminate Cu-Nb composites},
author = {Avallone, Jaclyn T. and Nizolek, Thomas Joseph and Pollock, Tresa Marie and Begley, Matthew R.},
abstractNote = {Nanolaminate composites with layer thicknesses down to 65 nm display conventional 3 stage creep behavior with creep resistance increasing as layer thickness decreases. A model for the time dependent high temperature deformation response of Cu-Nb composites is developed, and compared to creep tests performed on multilayers fabricated via accumulative roll bonding (ARB). The model assumes a continuous laminate structure of 50 % Cu and 50 % Nb in which deformation is controlled by stage II creep for the copper (εcr = Aσn) and plasticity in Nb. Regimes in which composite steady-state creep at constant stress can be achieved are identified. The modeling illustrates that strain-hardening in the niobium plays a critical role in the transient response of the multilayer, which can dominate the creep lifetime. The combination of experiments and models strongly suggest that dislocation climb mechanisms in the copper control the time-response at 400 °C for all layer thicknesses tested.},
doi = {10.1016/j.msea.2019.06.026},
journal = {Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing},
number = C,
volume = 761,
place = {United States},
year = {2019},
month = {6}
}

Journal Article:
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This content will become publicly available on June 20, 2020
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