Title: Buckling and twisting of advanced materials into morphable 3D mesostructures

Abstract

Recently developed methods in mechanically guided assembly provide deterministic access to wide-ranging classes of complex, 3D structures in high-performance functional materials, with characteristic length scales that can range from nanometers to centimeters. These processes exploit stress relaxation in prestretched elastomeric platforms to affect transformation of 2D precursors into 3D shapes by in- and out-of-plane translational displacements. This paper introduces a scheme for introducing local twisting deformations into this process, thereby providing access to 3D mesostructures that have strong, local levels of chirality and other previously inaccessible geometrical features. Here, elastomeric assembly platforms segmented into interconnected, rotatable units generate in-plane torques imposed through bonding sites at engineered locations across the 2D precursors during the process of stress relaxation. Nearly 2 dozen examples illustrate the ideas through a diverse variety of 3D structures, including those with designs inspired by the ancient arts of origami/kirigami and with layouts that can morph into different shapes. Here, a mechanically tunable, multilayered chiral 3D metamaterial configured for operation in the terahertz regime serves as an application example guided by finite-element analysis and electromagnetic modeling.

Authors:

Zhao, Hangbo ^[1]; Li, Kan ^[2]; Han, Mengdi ^[1]; Zhu, Feng ^[3]; Vázquez-Guardado, Abraham ^[4]; Guo, Peijun ^[5]; Xie, Zhaoqian ^[6]; Park, Yoonseok ^[1]; Chen, Lin ^[7]; Wang, Xueju ^[8]; Luan, Haiwen  ^[2];

• Search DOE PAGES for author "Luan, Haiwen"
• Search DOE PAGES for ORCID "0000-0003-0722-1108"

Yang, Yiyuan ^[9]; Wang, Heling ^[2]; Liang, Cunman ^[10]; Xue, Yeguang  ^[2];

• Search DOE PAGES for author "Xue, Yeguang"
• Search DOE PAGES for ORCID "0000-0002-1968-5092"

Schaller, Richard D. ^[11]; Chanda, Debashis ^[12]; Huang, Yonggang ^[13]; Zhang, Yihui ^[14]; Rogers, John A. ^[15]

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+ Show Author Affiliations

1. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,
2. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,
3. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, School of Logistics Engineering, Wuhan University of Technology, 430063 Wuhan, China,
4. NanoScience Technology Center, University of Central Florida, Orlando, FL 32826,, CREOL, The College of Optics and Photonics, University of Central Florida, Orlando, FL 32816,
5. Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439,
6. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, Department of Engineering Mechanics, Dalian University of Technology, 116024 Dalian, China,
7. State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi’an Jiaotong University, 710049 Xi’an, China,
8. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Mechanical and Aerospace Engineering, University of Missouri-Columbia, Columbia, MO 65211,
9. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,
10. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, 300072 Tianjin, China,, School of Mechanical Engineering, Tianjin University, 300072 Tianjin, China,
11. Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439,, Department of Chemistry, Northwestern University, Evanston, IL 60208,
12. NanoScience Technology Center, University of Central Florida, Orlando, FL 32826,, CREOL, The College of Optics and Photonics, University of Central Florida, Orlando, FL 32816,, Department of Physics, University of Central Florida, Orlando, FL 32816,
13. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,
14. Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China,, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, China,
15. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, Department of Chemistry, Northwestern University, Evanston, IL 60208,, Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208,

Publication Date:

Wed Jun 19 00:00:00 EDT 2019

Research Org.:

Argonne National Laboratory (ANL), Argonne, IL (United States)

Sponsoring Org.:

National Science Foundation (NSF); National Natural Science Foundation of China (NSFC); USDOE Office of Science (SC)

OSTI Identifier:

1527191

Alternate Identifier(s):

OSTI ID: 1559024

Grant/Contract Number:  

AC02-06CH11357

Resource Type:

Published Article

Journal Name:

Proceedings of the National Academy of Sciences of the United States of America

Additional Journal Information:

Journal Name: Proceedings of the National Academy of Sciences of the United States of America Journal Volume: 116 Journal Issue: 27; Journal ID: ISSN 0027-8424

Publisher:

Proceedings of the National Academy of Sciences

Country of Publication:

United States

Language:

English

Subject:

36 MATERIALS SCIENCE; kirigami; metamaterials; origami; three-dimensional fabrication