Buckling and twisting of advanced materials into morphable 3D mesostructures

Journal Article · 18 June 2019 · Proceedings of the National Academy of Sciences of the United States of America

DOI: https://doi.org/10.1073/pnas.1901193116 · OSTI ID:1527191

Zhao, Hangbo ^[1]; Li, Kan ^[2]; Han, Mengdi ^[1]; Zhu, Feng ^[3]; Vázquez-Guardado, Abraham ^[4]; Guo, Peijun ^[5]; Xie, Zhaoqian ^[6]; Park, Yoonseok ^[1]; Chen, Lin ^[7]; Wang, Xueju ^[8]; Luan, Haiwen  ^[2]; Yang, Yiyuan ^[9]; Wang, Heling ^[2]; Liang, Cunman ^[10]; Xue, Yeguang  ^[2]; Schaller, Richard D. ^[11]; Chanda, Debashis ^[12]; Huang, Yonggang ^[13]; Zhang, Yihui ^[14]; Rogers, John A. ^[15]

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1. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,
2. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,
3. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, School of Logistics Engineering, Wuhan University of Technology, 430063 Wuhan, China,
4. NanoScience Technology Center, University of Central Florida, Orlando, FL 32826,, CREOL, The College of Optics and Photonics, University of Central Florida, Orlando, FL 32816,
5. Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439,
6. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, Department of Engineering Mechanics, Dalian University of Technology, 116024 Dalian, China,
7. State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi’an Jiaotong University, 710049 Xi’an, China,
8. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Mechanical and Aerospace Engineering, University of Missouri-Columbia, Columbia, MO 65211,
9. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,
10. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, 300072 Tianjin, China,, School of Mechanical Engineering, Tianjin University, 300072 Tianjin, China,
11. Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439,, Department of Chemistry, Northwestern University, Evanston, IL 60208,
12. NanoScience Technology Center, University of Central Florida, Orlando, FL 32826,, CREOL, The College of Optics and Photonics, University of Central Florida, Orlando, FL 32816,, Department of Physics, University of Central Florida, Orlando, FL 32816,
13. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,
14. Center for Flexible Electronics Technology, Tsinghua University, 100084 Beijing, China,, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, China,
15. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208,, Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208,, Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208,, Department of Chemistry, Northwestern University, Evanston, IL 60208,, Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208,

Significance The growing availability of 3D manufacturing methods has implications across diverse applications, from ship building to microelectronics processing. Systems with sizes in the micrometer and millimeter regime are of particular interest, where few techniques offer the necessary range of capabilities in throughput, materials compatibility, and design versatility. Recently reported techniques for mechanically guided 3D assembly offer many appealing features, but limitations remain, such as those in formation of structures with chiral features and morphable shapes. Here we present concepts that allow controlled introduction of twisting into 3D mesostructures. The results provide access to many classes of previously unachievable 3D architectures, as illustrated through nearly 2 dozen examples in diverse materials and across a wide span of length scales.

• Sponsoring Organization: USDOE
• Grant/Contract Number: AC02-06CH11357
• OSTI ID: 1527191
• Alternate ID(s): OSTI ID: 1559024
• Journal Information: Proceedings of the National Academy of Sciences of the United States of America, Journal Name: Proceedings of the National Academy of Sciences of the United States of America Journal Issue: 27 Vol. 116; ISSN 0027-8424
• Publisher: Proceedings of the National Academy of SciencesCopyright Statement
• Country of Publication: United States
• Language: English