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Title: Enhanced properties of tungsten films by high-power impulse magnetron sputtering

Abstract

Tungsten films (750–1200 nm thick) deposited by high-power impulse magnetron sputtering (HiPIMS) under various sputtering gas pressure and substrate bias are investigated for their physical and microstructural characteristics. Compared to films deposited by the traditional direct current (DC) method with the same deposition configuration and similar parameters, HiPIMS materials exhibit higher hardness, a smoother surface, and better adhesion to a substrate. These excellent properties are attributed to the highly uniform grain structures developed during HiPIMS deposition, in contrast to the funnel shaped grains seen in DC sputtered films. Finally, combined with the in-situ stress measurements, we discuss the underlying mechanisms that lead to enhanced properties of HiPIMS tungsten films.

Authors:
ORCiD logo [1];  [1];  [2];  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
  2. General Atomics, San Diego, CA (United States)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1513123
Alternate Identifier(s):
OSTI ID: 1547735
Report Number(s):
LLNL-JRNL-759980
Journal ID: ISSN 0257-8972; 948405
Grant/Contract Number:  
AC52-07NA27344; 17-ERD-048
Resource Type:
Accepted Manuscript
Journal Name:
Surface and Coatings Technology
Additional Journal Information:
Journal Volume: 363; Journal Issue: C; Journal ID: ISSN 0257-8972
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Engwall, A. M., Shin, S. J., Bae, J., and Wang, Y. M. Enhanced properties of tungsten films by high-power impulse magnetron sputtering. United States: N. p., 2019. Web. doi:10.1016/j.surfcoat.2019.02.055.
Engwall, A. M., Shin, S. J., Bae, J., & Wang, Y. M. Enhanced properties of tungsten films by high-power impulse magnetron sputtering. United States. doi:10.1016/j.surfcoat.2019.02.055.
Engwall, A. M., Shin, S. J., Bae, J., and Wang, Y. M. Mon . "Enhanced properties of tungsten films by high-power impulse magnetron sputtering". United States. doi:10.1016/j.surfcoat.2019.02.055.
@article{osti_1513123,
title = {Enhanced properties of tungsten films by high-power impulse magnetron sputtering},
author = {Engwall, A. M. and Shin, S. J. and Bae, J. and Wang, Y. M.},
abstractNote = {Tungsten films (750–1200 nm thick) deposited by high-power impulse magnetron sputtering (HiPIMS) under various sputtering gas pressure and substrate bias are investigated for their physical and microstructural characteristics. Compared to films deposited by the traditional direct current (DC) method with the same deposition configuration and similar parameters, HiPIMS materials exhibit higher hardness, a smoother surface, and better adhesion to a substrate. These excellent properties are attributed to the highly uniform grain structures developed during HiPIMS deposition, in contrast to the funnel shaped grains seen in DC sputtered films. Finally, combined with the in-situ stress measurements, we discuss the underlying mechanisms that lead to enhanced properties of HiPIMS tungsten films.},
doi = {10.1016/j.surfcoat.2019.02.055},
journal = {Surface and Coatings Technology},
number = C,
volume = 363,
place = {United States},
year = {2019},
month = {2}
}

Journal Article:
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This content will become publicly available on February 18, 2020
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